公开(公告)号：US20070022909A1

公开(公告)日：2007-02-01

申请号：US10570750

申请日：2004-10-05

申请人： Joseph Kennedy ,  Wei Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

发明人： Joseph Kennedy ,  Wei Huang ,  Kim Do ,  Jason Stuck ,  Bo Li

IPC分类号： C08L83/05

CPC分类号： C09D183/04

摘要： A coating material is described herein that includes at least one inorganic compound, and at least one densifying agent, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound. A method of producing a coating material is described herein that includes: providing at least one inorganic compound, providing at least one densifying agent, combining the at least one inorganic compound with the at least one densifying agent to form the coating material, wherein the densifying agent increases the density of the coating material as compared to the density of the at least one inorganic compound.

摘要翻译： 本文描述了包括至少一种无机化合物和至少一种致密化剂的涂层材料，其中与至少一种无机化合物的密度相比，致密化剂增加涂层材料的密度。 本文描述了制备涂料的方法，其包括：提供至少一种无机化合物，提供至少一种致密化剂，将至少一种无机化合物与至少一种致密化剂结合以形成涂层材料，其中致密化 与至少一种无机化合物的密度相比，增加了涂层材料的密度。

公开(公告)号：US20060224272A1

公开(公告)日：2006-10-05

申请号：US11096620

申请日：2005-03-31

申请人： Bo Li ,  Johnny Wu ,  Aishwarya Varadhan ,  Ron Elfacy ,  Robin Hoskinson

发明人： Bo Li ,  Johnny Wu ,  Aishwarya Varadhan ,  Ron Elfacy ,  Robin Hoskinson

IPC分类号： G06F7/00

CPC分类号： H01L21/67271 ,  H01L21/67769

摘要： According to one aspect of the invention, a method for managing the storage of semiconductor material is provided. The method may include processing a plurality of semiconductor substrates with a first type of semiconductor substrate processing tool to create a plurality of a first type of semiconductor substrate, determining the contents of a plurality of storage devices, each storage device being connected to a second type of semiconductor substrate processing tool, and selecting a maximum number of the first type of semiconductor substrate to be stored in each storage device, the maximum number being less than a storage capacity of the respective storage device.

摘要翻译： 根据本发明的一个方面，提供一种用于管理半导体材料的存储的方法。 该方法可以包括利用第一类型的半导体衬底处理工具来处理多个半导体衬底以产生多个第一类型的半导体衬底，确定多个存储器件的内容，每个存储器件连接到第二类型 并且选择要存储在每个存储装置中的第一类型的第一类型的半导体衬底的最大数量，最大数量小于各个存储装置的存储容量。

公开(公告)号：US07049005B2

公开(公告)日：2006-05-23

申请号：US10160773

申请日：2002-05-30

申请人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

发明人： Paul G. Apen ,  William B. Bedwell ,  Nancy Iwamoto ,  Boris A. Korolev ,  Kreisler S. Lau ,  Bo Li ,  Ananth Naman

IPC分类号： B32B9/04

CPC分类号： H01L21/02118 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/31695 ,  H05K1/0313 ,  Y10T428/31663

摘要： The present invention provides a composition comprising: (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; G is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1; (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate. The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.

公开(公告)号：US07010600B1

公开(公告)日：2006-03-07

申请号：US09895534

申请日：2001-06-29

申请人： Ranjan Prasad ,  Ramprasad Golla ,  Serge Zloto ,  Bo Li

发明人： Ranjan Prasad ,  Ramprasad Golla ,  Serge Zloto ,  Bo Li

IPC分类号： G06F15/173

CPC分类号： H04L63/102 ,  H04L63/0815

摘要： A method is disclosed for managing network resources in multiple administrative domains. According to the method, a user is authenticated in a first administrative domain. A token is generated for the user that identifies the user as being assigned a role. The token is configured to identify the user by the role to a component of a second administrative domain. When the user requests a resource of the second administrative domain, its component examines the token and the role to determine whether to grant access to the resource. As a result, the second administrative domain may grant the user access to its resources without re-authenticating the user in the second administrative domain.

摘要翻译： 公开了一种用于管理多个管理域中的网络资源的方法。 根据该方法，用户在第一管理域中被认证。 为用户生成令牌，将用户标识为分配角色。 令牌被配置为通过角色将用户识别到第二管理域的组件。 当用户请求第二个管理域的资源时，其组件检查令牌和角色，以确定是否授予对资源的访问权限。 结果，第二管理域可以授权用户对其资源的访问，而不在第二管理域中重新认证用户。

公开(公告)号：US20060014842A1

公开(公告)日：2006-01-19

申请号：US10890981

申请日：2004-07-14

申请人： Bo Li ,  Victor Lu ,  Paul Apen ,  Roger Leung

发明人： Bo Li ,  Victor Lu ,  Paul Apen ,  Roger Leung

IPC分类号： C08J9/26

CPC分类号： C08J9/26 ,  C04B38/0022 ,  C04B2111/00482 ,  C04B2111/92 ,  C08J2201/0422 ,  C08J2201/046 ,  C08J2383/04 ,  G03F7/0757 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31695 ,  C04B35/14 ,  C04B38/0054 ,  C04B38/067

摘要： A method of producing a nanoporous silica dielectric film having improved mechanical strength. A composition is formed which comprises in admixture a porogen, a solvent, a catalyst and a combination of silicon containing pre-polymers.

公开(公告)号：US20060004837A1

公开(公告)日：2006-01-05

申请号：US10882902

申请日：2004-06-30

申请人： Victoria Genovker ,  Ward McQueen ,  Mohamad Rooholamini ,  Bo Li

发明人： Victoria Genovker ,  Ward McQueen ,  Mohamad Rooholamini ,  Bo Li

IPC分类号： G06F17/00

CPC分类号： H04L45/34 ,  H04L43/0811 ,  H04L45/28 ,  H04L49/552 ,  H04L49/602

摘要： A peer-to-peer connection protocol for establishing and managing peer-to-peer connections between endpoints coupled via a serial-based interconnect fabric. A requesting endpoint generates and sends a query to a fabric manager requesting connection information for at least one target endpoint having attributes matching attributes specified in the query. The fabric manager returns a query reply containing connection information to connect the requesting endpoint to a target endpoint or multiple target endpoints having matching attributes. In the case of multiple target endpoints, one target endpoint is selected for the connection. The requesting and target endpoints then negotiate and establish the connection by passing connection information and parameters between themselves directly. Upon establishing the connection, the fabric manager is apprised of the new connection and updates its connection list. The method is facilitated by software components running on various devices coupled to the serial-based interconnect fabric. Such devices include server blades and ATCA boards. In one embodiment, the serial-based interconnect fabric comprises an Advanced Switching (AS) fabric.

摘要翻译： 一种对等连接协议，用于建立和管理通过基于串行的互连结构耦合的端点之间的对等连接。 请求端点生成并向架构管理器发送查询，请求至少一个具有与查询中指定的属性匹配的属性的目标端点的连接信息。 架构管理器返回包含连接信息的查询答复，以将请求端点连接到目标端点或具有匹配属性的多个目标端点。 在多个目标端点的情况下，为连接选择一个目标端点。 然后，请求和目标端点通过直接在彼此之间传递连接信息和参数来协商和建立连接。 建立连接后，结构管理器被通知新的连接并更新其连接列表。 该方法通过在耦合到基于串行的互连结构的各种设备上运行的软件组件来促进。 这样的设备包括服务器刀片和ATCA板。 在一个实施例中，基于串行的互连结构包括高级交换（AS）结构。

公开(公告)号：US20050136687A1

公开(公告)日：2005-06-23

申请号：US10741272

申请日：2003-12-19

申请人： Victor Lu ,  Bo Li ,  Deling Zhou ,  Roger Leung ,  Paul Apen

发明人： Victor Lu ,  Bo Li ,  Deling Zhou ,  Roger Leung ,  Paul Apen

IPC分类号： H01L21/311 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L21/76 ,  H01L21/31 ,  H01L21/469

CPC分类号： H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/31695 ,  H01L21/7682 ,  H01L2221/1047

摘要： A composition comprising a nanoporous silica dielectric film having a void volume of about 30% or less based on the total volume of the nanoporous silica dielectric film, and having a dielectric constant of about 2.2 or less. A method of producing a nanoporous silica dielectric film having a void volume of about 30% or less based on the total volume of the nanoporous silica dielectric film, and having a dielectric constant of about 2.2 or less. A silicon containing pre-polymer is provided, which is capable of forming a film having a dielectric constant of about 2.8 or less. It is then combined with a porogen, and a metal-ion-free catalyst selected from the group consisting of onium compounds and nucleophiles, to thereby form a composition. A layer of the composition is coated on to a substrate, crosslinked to form a gelled film, and heated to remove substantially all of the porogen and to thereby produce a nanoporous silica dielectric film of the invention.

摘要翻译： 一种组合物，其包含基于纳米多孔硅介电膜的总体积具有约30％或更小的空隙体积并且具有约2.2或更小的介电常数的纳米多孔硅介电膜。 基于纳米多孔硅介电膜的总体积，并且具有约2.2或更小的介电常数，制备具有约30％或更小的空隙体积的纳米多孔二氧化硅电介质膜的方法。 提供含硅预聚物，其能够形成介电常数为约2.8或更小的膜。 然后将其与致孔剂和选自鎓化合物和亲核试剂的无金属离子的催化剂组合，从而形成组合物。 将一层组合物涂布在基材上，交联以形成凝胶膜，并加热以除去基本上所有的致孔剂，从而制备本发明的纳米孔硅石介电膜。

公开(公告)号：US20050020702A1

公开(公告)日：2005-01-27

申请号：US10735579

申请日：2003-12-12

申请人： Bo Li ,  Paul Apen ,  Kreisler Lau ,  Edward Sullivan

发明人： Bo Li ,  Paul Apen ,  Kreisler Lau ,  Edward Sullivan

IPC分类号： C07C17/10 ,  C07C17/266 ,  C07C25/22 ,  C07C25/24 ,  C08G61/02 ,  C08L65/00 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L23/14 ,  H01L23/532 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  C08J9/38

CPC分类号： C07C17/10 ,  C07C17/266 ,  C07C25/22 ,  C07C25/24 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/3122 ,  H01L21/31695 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/024 ,  H05K1/0313 ,  H05K3/4676 ,  C07C23/46 ,  H01L2924/00

摘要： The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.

摘要翻译： 本发明提供一种组合物，其包含（a）热固性组分，其包含：（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中E，Q，G， h，I，j和w如下所述，（b）与热固性组分（a）键合的致孔剂。 优选地，造孔剂选自未取代的聚降冰片烯，取代的聚降冰片烯，聚己内酯，未取代的聚苯乙烯，取代的聚苯乙烯，聚苊烯均聚物和聚苊烯共聚物。 优选地，本发明组合物可以用作微芯片，多芯片模块，层叠电路板或印刷线路板中的电介质基板。

公开(公告)号：US06642774B1

公开(公告)日：2003-11-04

申请号：US10187219

申请日：2002-06-28

申请人： Bo Li

发明人： Bo Li

IPC分类号： G05F110

CPC分类号： H02M3/073 ,  H02M2001/0032 ,  H02M2001/0041 ,  Y02B70/16

摘要： A method for high precision charge pump regulation. The method of one embodiment comprises comparing an output feedback voltage with a reference voltage to determine whether the output feedback voltage is greater than or less than the reference voltage. In response to the comparison, either increasing a frequency for a clock signal if the output feedback voltage is less than the reference voltage, decreasing the frequency for the clock signal if the output feedback voltage is greater than the reference voltage; or disabling the clock signal if the output feedback voltage is much greater than the reference voltage. A pumped voltage is generated in response to changes to the clock signal.

摘要翻译： 一种高精度电荷泵调节方法。 一个实施例的方法包括将输出反馈电压与参考电压进行比较，以确定输出反馈电压是否大于或小于参考电压。 响应于比较，如果输出反馈电压小于参考电压，则增加时钟信号的频率，如果输出反馈电压大于参考电压，则降低时钟信号的频率; 或者如果输出反馈电压远大于参考电压，则禁用时钟信号。 响应于时钟信号的变化产生泵浦电压。

公开(公告)号：US06496055B2

公开(公告)日：2002-12-17

申请号：US09753045

申请日：2000-12-29

申请人： Bo Li

发明人： Bo Li

IPC分类号： G05F502

CPC分类号： H02M3/073 ,  H02M2003/075 ,  H02M2003/078

摘要： A gate enhanced tri-channel positive charge pump. The positive charge pump of one embodiment comprises a switching device to transfer charge from its input terminal to its output terminal, the switching terminal further comprising a substrate terminal coupled to the input terminal. A pull-up device is coupled to the switching device, the pull-up device to precharge a boot node, the pull-up device further comprising a substrate terminal couple to the input terminal of the switching device. A pull-down device is coupled to the switching device, the pull-down device to discharge the boot-node, the pull-down device further comprising a substrate terminal coupled to the input terminal of the switching device. The pump also comprises a control device coupled to the pull-down device, the control device to enable and disable the pull-down device, the control device further comprising a substrate terminal coupled to a drain terminal of the control device.

摘要翻译： 门增强三通道正电荷泵。 一个实施例的正电荷泵包括将电荷从其输入端子转移到其输出端子的开关装置，该开关端子还包括耦合到输入端子的衬底端子。 上拉装置耦合到开关装置，所述上拉装置对引导节点预充电，所述上拉装置还包括耦合到所述开关装置的输入端子的衬底端子。 下拉装置耦合到开关装置，下拉装置以对引导节点放电，下拉装置还包括耦合到开关装置的输入端子的衬底端子。 所述泵还包括耦合到所述下拉装置的控制装置，所述控制装置用于启用和禁用所述下拉装置，所述控制装置还包括耦合到所述控制装置的漏极端子的衬底端子。