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    Organic compositions
    3.
    发明申请
    Organic compositions 审中-公开
    有机成分

    公开(公告)号：US20070155997A1

    公开(公告)日：2007-07-05

    申请号：US10536884

    申请日：2003-12-31

    申请人： Bo Li ,  Kreisler Lau ,  Paul Apen

    发明人： Bo Li ,  Kreisler Lau ,  Paul Apen

    IPC分类号： C07C13/615

    CPC分类号： C07C17/10 ,  C07C13/615 ,  C07C13/64 ,  C07C17/269 ,  C07C2603/74 ,  C07C2603/90 ,  C08G61/06 ,  C07C23/46 ,  C07C25/22

    摘要： Compositions and methods of forming and using those compositions are provided herein where the composition comprises at least one oligomer or polymer of Formula I wherein E is a cage compound; each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; A is substituted or unsubstituted aryl with substituted or unsubstituted arylalkynyl group (substituents include hydrogen, halogen, alkyl, phenyl or substituted aryl; and aryl includes phenyl, biphenyl, naphthyl, terphenyl, anthracenyl, polyphenylene, polyphenylene ether, or substituted aryl); h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1.

    摘要翻译： 本文提供了组合物和形成和使用这些组合物的方法，其中组合物包含至少一种式I的低聚物或聚合物，其中E是笼形化合物; 每个Q相同或不同，选自芳基，支链芳基和取代芳基，其中取代基包括氢，卤素，烷基，芳基，取代的芳基，杂芳基，芳基醚，烯基，炔基，烷氧基，羟基烷基，羟基芳基，羟基烯基， 羟基炔基，羟基或羧基; A是取代或未取代的具有取代或未取代的芳基炔基的芳基（取代基包括氢，卤素，烷基，苯基或取代的芳基;芳基包括苯基，联苯基，萘基，三联苯基，蒽基，聚亚苯基，聚苯醚或取代的芳基）。 h为0〜10; 我是从0到10; j为0〜10; w为0或1。

    Low dielectric constant materials with improved thermo-mechanical strength and processability
    4.
    发明授权
    Low dielectric constant materials with improved thermo-mechanical strength and processability 失效
    低介电常数材料，具有改善的热机械强度和加工性能

    公开(公告)号：US06987147B2

    公开(公告)日：2006-01-17

    申请号：US10263204

    申请日：2002-10-01

    申请人： Kreisler Lau ,  Bo Li ,  Boris Korolev ,  Edward Sullivan ,  Ruslan Zherebin

    发明人： Kreisler Lau ,  Bo Li ,  Boris Korolev ,  Edward Sullivan ,  Ruslan Zherebin

    IPC分类号： C08G65/30 ,  C08G65/38 ,  C08F8/00

    CPC分类号： H01L21/02118 ,  B32B27/06 ,  C08G61/02 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  Y10T428/24851

    摘要： A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.

    摘要翻译： 聚合物网络包括多个单体，其包括具有至少三个臂的笼形化合物，其中至少一个臂具有两个或更多个分支，并且其中每个分支还包含反应性基团。 预期聚合物网络中的单体通过反应性基团共价偶联。 特别预期的笼形化合物包括金刚烷和金刚烷，特别是预期的支链包括邻 - 双（苯基乙炔基）苯基。 特别考虑的聚合物网络具有不超过3.0的介电常数，并且形成在基底的表面上。

    Organic compositions
    6.
    发明授权
    Organic compositions 失效
    有机成分

    公开(公告)号：US07060204B2

    公开(公告)日：2006-06-13

    申请号：US10404047

    申请日：2003-04-02

    申请人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    发明人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    IPC分类号： H01B1/12 ,  C08J9/38 ,  C08J9/00

    CPC分类号： H01L21/02126 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31695 ,  H05K1/0313

    摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

    摘要翻译： 本发明提供一种组合物，其包含：（a）电介质材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基，并且在相邻芳环上的至少两个烷基取代基之间存在键。 优选地，电介质材料是包含（a）热固性组分的组合物，其包含（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中Q，G，h ，I，I和w如下所述，（b）致孔剂。 优选地，致孔剂选自非官能化聚苊烯均聚物，官能化聚苊烯均聚物，聚苊烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，聚丙烯酸酯，脂族 聚碳酸酯，聚砜，聚丙交酯及其共混物。 本发明的组合物特别可用作微芯片，多芯片模块，层叠电路板和印刷线路板中的介电基板材料。

    Porous silica dielectric having improved etch selectivity towards inorganic anti-reflective coating materials for integrated circuit applications, and methods of manufacture
    8.
    发明申请
    Porous silica dielectric having improved etch selectivity towards inorganic anti-reflective coating materials for integrated circuit applications, and methods of manufacture 审中-公开
    具有改进的针对集成电路应用的无机抗反射涂层材料的蚀刻选择性的多孔二氧化硅电介质以及制造方法

    公开(公告)号：US20050136687A1

    公开(公告)日：2005-06-23

    申请号：US10741272

    申请日：2003-12-19

    申请人： Victor Lu ,  Bo Li ,  Deling Zhou ,  Roger Leung ,  Paul Apen

    发明人： Victor Lu ,  Bo Li ,  Deling Zhou ,  Roger Leung ,  Paul Apen

    IPC分类号： H01L21/311 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L21/76 ,  H01L21/31 ,  H01L21/469

    CPC分类号： H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/31695 ,  H01L21/7682 ,  H01L2221/1047

    摘要： A composition comprising a nanoporous silica dielectric film having a void volume of about 30% or less based on the total volume of the nanoporous silica dielectric film, and having a dielectric constant of about 2.2 or less. A method of producing a nanoporous silica dielectric film having a void volume of about 30% or less based on the total volume of the nanoporous silica dielectric film, and having a dielectric constant of about 2.2 or less. A silicon containing pre-polymer is provided, which is capable of forming a film having a dielectric constant of about 2.8 or less. It is then combined with a porogen, and a metal-ion-free catalyst selected from the group consisting of onium compounds and nucleophiles, to thereby form a composition. A layer of the composition is coated on to a substrate, crosslinked to form a gelled film, and heated to remove substantially all of the porogen and to thereby produce a nanoporous silica dielectric film of the invention.

    摘要翻译： 一种组合物，其包含基于纳米多孔硅介电膜的总体积具有约30％或更小的空隙体积并且具有约2.2或更小的介电常数的纳米多孔硅介电膜。 基于纳米多孔硅介电膜的总体积，并且具有约2.2或更小的介电常数，制备具有约30％或更小的空隙体积的纳米多孔二氧化硅电介质膜的方法。 提供含硅预聚物，其能够形成介电常数为约2.8或更小的膜。 然后将其与致孔剂和选自鎓化合物和亲核试剂的无金属离子的催化剂组合，从而形成组合物。 将一层组合物涂布在基材上，交联以形成凝胶膜，并加热以除去基本上所有的致孔剂，从而制备本发明的纳米孔硅石介电膜。