公开(公告)号：US20080176358A1

公开(公告)日：2008-07-24

申请号：US12009866

申请日：2008-01-23

申请人： Chung-Lun Liu ,  Chin-Huang Chang ,  Yi-Feng Chang ,  Jung-Pin Huang ,  Chih-Ming Huang

发明人： Chung-Lun Liu ,  Chin-Huang Chang ,  Yi-Feng Chang ,  Jung-Pin Huang ,  Chih-Ming Huang

IPC分类号： H01L21/56

CPC分类号： H01L25/0657 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The present invention provides a fabrication method of a multi-chip stacking structure. The method includes steps of: stacking the first chips on the chip carrier in a step-like manner to form a first chip module; electrically connecting the first chip module to the chip carrier by a plurality of first bonding wires; stacking the second chips on the first chip module in step-like manner to form a second chip module, wherein a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive layer with the bottom chip deviated from the top chip horizontally in a direction toward the first bonding wires; and electrically connecting the bond pads of the second chip module to the chip carrier by a plurality of second bonding wires.

摘要翻译： 本发明提供一种多芯片堆叠结构的制造方法。 该方法包括以下步骤：以阶梯状方式堆叠芯片载体上的第一芯片以形成第一芯片模块; 通过多个第一接合线将第一芯片模块电连接到芯片载体; 在第一芯片模块上堆叠第二芯片以形成第二芯片模块，其中第二芯片模块的底部芯片通过粘合剂层堆叠在第一芯片模块的顶部芯片上，底部芯片偏离 从顶部芯片沿着朝向第一接合线的方向水平地; 以及通过多个第二接合线将所述第二芯片模块的所述接合焊盘电连接到所述芯片载体。

公开(公告)号：US07205485B2

公开(公告)日：2007-04-17

申请号：US10831247

申请日：2004-04-23

申请人： Chin-Tien Chiu ,  Chin-Huang Chang ,  Chih-Ming Huang

发明人： Chin-Tien Chiu ,  Chin-Huang Chang ,  Chih-Ming Huang

IPC分类号： H05K1/16

CPC分类号： H05K3/305 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/0187 ,  H05K2201/09072 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49146

摘要： A printed circuit board and a method for fabricating the same is provided. A substrate having a core layer and a plurality of pairs of bond pads thereon is prepared with at least one opening formed on the core layer between each pair of the bond pads. A solder mask layer covers the core layer and fills the openings, with recessed portions formed at positions of the solder mask layer on the openings during curing of the solder mask layer. When a small passive component is mounted on the printed circuit board, a space is formed between the bottom of the passive component and the recessed portions of the solder mask layer. An encapsulating resin can flow into the space to form an insulating barrier between the bond pads to prevent bridging between the bond pads and short circuiting of the passive component.

摘要翻译： 提供一种印刷电路板及其制造方法。 制备具有芯层和其上的多对接合焊盘的衬底，其中在每对接合焊盘之间的芯层上形成有至少一个开口。 焊接掩模层覆盖芯层并填充开口，其中凹陷部分形成在焊料掩模层固化期间在开口上的焊料掩模层的位置处。 当将小的无源部件安装在印刷电路板上时，在无源部件的底部和焊料掩模层的凹部之间形成空间。 封装树脂可以流入空间，以在接合焊盘之间形成绝缘屏障，以防止接合焊盘之间的桥接和无源部件的短路。

公开(公告)号：US20070035655A1

公开(公告)日：2007-02-15

申请号：US11200089

申请日：2005-08-10

申请人： Chang-Fu Chen ,  Chih-Ming Huang ,  Yi-Cheng Su ,  Chien-Cheng Chen ,  Chih-Hao Chen ,  Tomas-Gavin Melia

发明人： Chang-Fu Chen ,  Chih-Ming Huang ,  Yi-Cheng Su ,  Chien-Cheng Chen ,  Chih-Hao Chen ,  Tomas-Gavin Melia

IPC分类号： H04N5/225

CPC分类号： H04N1/04 ,  H04N2201/0081 ,  H04N2201/0436 ,  H04N2201/0446 ,  H04N2201/045

摘要： A multi-functional scanning camera comprises a rear cover; a front cover combined to the rear cover; a main back casing; a left telescopic rod; a right telescopic rod; a left fixing unit and a right fixing unit locked to two sides of the back casing; a main front casing assembled to a main back casing; and a lower side of a rear end of the main back casing being installed with a left rotary retaining seat and a right rotary retaining seat. The scanning operation will not affect the operation of network operation. The scanner is extendable and foldable. The plurality of light emitting diodes serves to illuminate the documents located below and the adjusting button serves to adjust the illumination so that the words on the document are shown clearly.

摘要翻译： 多功能扫描照相机包括后盖; 一个前盖组合在后盖上; 主后套 左伸缩杆 右伸缩杆 左固定单元和右固定单元，锁定在后壳的两侧; 组装到主后壳的主前壳; 并且主后壳的后端的下侧安装有左旋转保持座和右旋转保持座。 扫描操作不会影响网络运行。 扫描仪是可扩展和可折叠的。 多个发光二极管用于照亮位于下方的文件，并且调节按钮用于调节照明，使得文档上的单词被清楚地示出。

公开(公告)号：US20050093143A1

公开(公告)日：2005-05-05

申请号：US10816339

申请日：2004-03-31

申请人： Cheng-Chian Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

发明人： Cheng-Chian Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

IPC分类号： G11C5/04 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/34 ,  H01L23/28

CPC分类号： H01L23/3121 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes two substrates each having a plurality of electrical connection pads, at least one chip mounted on each of the substrates, an encapsulation body formed on each of the substrates for encapsulating the chip, and an cover for receiving the substrates and the chips therein. The chip is electrically connected to the electrical connection pads. The electrical connection pads are exposed from the cover and located on the same surface or oppositely arranged. The substrates and the cover each substantially has a rectangular shape, with a longer side of each of the substrates being vertical to a longer side of the cover. The semiconductor package is incorporated with multiple chips to enhance the performance and memory capacity thereof, and the substrates are smaller than those in the prior art and thus are more cost-effective to fabricate.

公开(公告)号：USD498760S1

公开(公告)日：2004-11-23

申请号：US29196558

申请日：2003-12-30

申请人： Cheng-Chia Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

设计人： Cheng-Chia Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

公开(公告)号：US20090288866A1

公开(公告)日：2009-11-26

申请号：US12535397

申请日：2009-08-04

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Wen-Tsung Tseng ,  Chih-Ming Huang

IPC分类号： H05K1/16 ,  H05K1/02

CPC分类号： H01R43/0256 ,  H01R43/0228 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.

摘要翻译： 提供一种电子载体板，包括载体，形成在载体上的至少两个成对的接合焊盘和覆盖载体的保护层。 保护层形成有与两个接合焊盘相对应的开口。 开口沿相同方向排列，并暴露两个接合焊盘中的每一个的至少第一侧壁和第二侧壁。 第一侧壁垂直于接合焊盘的对准方向，第二侧壁平行于接合焊盘的对准方向。 至少一个接合焊盘的第一侧壁与对应的一个开口的对应侧之间的距离比至少一个接合焊盘的第二侧壁和相应侧面之间的距离大至少约50μm 的相应开口。

公开(公告)号：US20090166831A1

公开(公告)日：2009-07-02

申请号：US12344988

申请日：2008-12-29

申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chin-Huang Chang ,  Chih-Ming Huang

发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chin-Huang Chang ,  Chih-Ming Huang

IPC分类号： H01L23/04 ,  H01L21/50

CPC分类号： H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： This invention provides a sensor semiconductor package and a method for fabricating the same. The method includes: mounting on a substrate a sensor chip having a sensor area; electrically connecting the sensor chip and the substrate by means of bonding wires; forming on a transparent member an adhesive layer with an opening corresponding in position to the sensor area; and mounting the transparent member on the substrate via the adhesive layer while heating the substrate, such that the adhesive layer melts, to thereby encapsulate the periphery of the sensor chip and the bonding wires while exposing the sensor area from the adhesive layer. Thus, the sensor area is sealed by the transparent member cooperative with the adhesive layer, making the sensor semiconductor package thus-obtained dam-free, light, thin, and compact, and incurs low process costs. Also, the product reliability is enhanced since the bonding wires are encapsulated by the adhesive layer without severing concern.

摘要翻译： 本发明提供一种传感器半导体封装及其制造方法。 该方法包括：在基板上安装具有传感器区域的传感器芯片; 通过接合线电连接传感器芯片和基板; 在透明构件上形成具有对应于传感器区域的位置的开口的粘合剂层; 并且通过粘合剂层将透明构件安装在基板上，同时加热基板，使得粘合剂层熔化，从而在将传感器区域从粘合剂层暴露出来的同时封装传感器芯片和接合线的周边。 因此，传感器区域与透明构件密封，与粘合剂层协作，使得传感器半导体封装得到无阻尼，轻薄，紧凑，并且导致低的工艺成本。 而且，由于接合线被粘合剂层封装而不会被切断，所以产品的可靠性得到提高。

公开(公告)号：US20080265385A1

公开(公告)日：2008-10-30

申请号：US12215543

申请日：2008-06-27

申请人： Han-Lung Tsai ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Han-Lung Tsai ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L24/85 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A semiconductor package using copper wires and a wire bonding method for the same are proposed. The package includes a carrier having fingers and a chip mounted on the carrier. The method includes implanting stud bumps on the fingers of the carrier and electrically connecting the chip and the carrier by copper wires with one ends of the copper wires being bonded to bond pads of the chip and the other ends of the copper wires being bonded to the stud bumps on the carrier. The implanted stud bumps on the carrier improve bondability of the copper wires to the carrier and thus prevent stitch lift. With good bonding, residues of copper wires left behind after a bonding process have even tail ends and uniform tail length to enable fabrication of solder balls of uniform size, thereby eliminating a conventional step of implanting stud bumps on the bond pads of chips and preventing ball lift from occurring.

摘要翻译： 提出了使用铜线的半导体封装及其引线接合方法。 封装包括具有指状物的载体和安装在载体上的芯片。 该方法包括在支架的指状物上注入螺柱凸块，并用铜线电连接芯片和载体，铜线的一端被接合到芯片的接合焊盘，并且铜线的另一端被接合到 支架上的螺柱凸起。 载体上植入的柱形突起提高了铜线对载体的粘结性，从而防止了针迹提升。 通过良好的接合，在接合工艺之后留下的铜线的残留物具有均匀的尾端和均匀的尾部长度，以使得能够制造均匀尺寸的焊球，从而消除了在芯片的接合焊盘上植入凸块凸起并防止球的常规步骤 提升不发生。

公开(公告)号：US20080174030A1

公开(公告)日：2008-07-24

申请号：US12009865

申请日：2008-01-23

申请人： Chung-Lun Liu ,  Chin-Huang Chang ,  Yi-Feng Chang ,  Jung-Pin Huang ,  Chih-Ming Huang

发明人： Chung-Lun Liu ,  Chin-Huang Chang ,  Yi-Feng Chang ,  Jung-Pin Huang ,  Chih-Ming Huang

IPC分类号： H01L23/492

CPC分类号： H01L25/0657 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The present invention provides a multi-chip stacking structure. The multichip stacking structure comprises: a chip carrier; a first and a second chip modules respectively having a plurality of first and a plurality of second chips, wherein each chips has a bond pad and the chips are stacked on the chip carrier in a step-like manner to expose the bond pads; and a plurality of bonding wires for electrically connecting the bond pads of the first and the second chip modules to the chip carrier, wherein a bottom chip of the second chip module is stacked on a top chip of the first chip module by an adhesive layer having fillers therein to support the bottom chip, and the bottom chip is deviated from the top chip horizontally in a direction toward the bonding wires of the first chip module.

摘要翻译： 本发明提供一种多芯片堆叠结构。 多芯片堆叠结构包括：芯片载体; 分别具有多个第一和多个第二芯片的第一和第二芯片模块，其中每个芯片具有接合焊盘，并且所述芯片以阶梯状方式堆叠在所述芯片载体上以暴露所述接合焊盘; 以及多个用于将第一和第二芯片模块的接合焊盘电连接到芯片载体的接合线，其中第二芯片模块的底部芯片通过粘合剂层被堆叠在第一芯片模块的顶部芯片上，该粘合层具有 填充物以支撑底部芯片，并且底部芯片在朝向第一芯片模块的接合线的方向上水平地偏离顶部芯片。

公开(公告)号：US07160261B1

公开(公告)日：2007-01-09

申请号：US11332723

申请日：2006-01-17

申请人： Chih-Ming Huang

发明人： Chih-Ming Huang

IPC分类号： A61H19/00

CPC分类号： A61H15/0078 ,  A61H2201/1669 ,  A61H2205/081

摘要： The present invention is related to a health care instrument, particularly to a back sliding massager. The massager comprising a base, a slide consists of an upper and a lower plate, a transmission mechanism, massage heads, and a cover. In that, the slide, transmission mechanism, and massage heads are mounted into the chamber constructed by the base and cover. Chains disposed on the surface of the base, transmission mechanism installed between the cover and base includes a motor, a set of gears driven by the motor having bottom pinions meshed with the chains, each of top gears connected to one massage head on top of the cover by a central axle respectively; openings formed through the cover, massage heads are exposed out from the openings. The massager of the present invention has a larger massaged portion with a man-made massage effect.

摘要翻译： 本发明涉及一种保健器具，特别涉及背部滑动按摩器。 包括基座的按摩器，滑动件由上下板，传动机构，按摩头和盖组成。 因此，将滑动件，传动机构和按摩头安装到由基座和盖构成的腔室中。 设置在基座表面上的链条，安装在盖和底座之间的传动机构包括马达，由马达驱动的一组齿轮，其具有与链条啮合的底部小齿轮，每个顶部齿轮连接到一个按摩头 分别由中心轴覆盖; 通过盖形成的开口，按摩头从开口露出。 本发明的按摩器具有较大的具有人造按摩效果的按摩部分。