公开(公告)号：US20070235871A1

公开(公告)日：2007-10-11

申请号：US11400182

申请日：2006-04-10

Applicant: Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

Inventor： Hsiang-Ming Huang ,  An-Hong Liu ,  Yeong-Jyh Lin ,  Yi-Chang Lee ,  Wu-Chang Tu ,  Chun-Hung Lin ,  Shih Chiu

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/13 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.

Abstract translation: 高频IC封装主要包括衬底，凸起芯片和多个导电填料，其中衬底具有从顶表面到底表面穿透的多个凸起孔。 芯片的有源表面以分别插入到凸块孔中的方式附接到基板的顶表面。 导电填料形成在凸起孔中，以将凸块电连接到基板的电路层。 高频IC封装具有更短的电路径和更薄的封装厚度。

公开(公告)号：US20070215992A1

公开(公告)日：2007-09-20

申请号：US11481719

申请日：2006-07-05

Applicant: Geng-Shin Shen ,  Chun-Hung Lin

Inventor： Geng-Shin Shen ,  Chun-Hung Lin

IPC: H01L23/495

CPC classification number: H01L23/49575 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer treating method for making adhesive chips is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform an adhesive film having B-stage property which has a glass transition temperature between −40 and 175 degree C. for example. After positioning the wafer, the wafer is singulated to form a plurality of chips with adhesive for chip-to-chip stacking, chip-to-substrate or chip-to-lead frame attaching.

Abstract translation: 提供了制造粘合剂芯片的晶片处理方法。 具有两级特性的液体粘合剂涂覆在晶片的表面上。 然后，将晶片预固化，以使液体粘合剂例如具有玻璃化转变温度在-40至175℃之间的具有B阶特性的粘合剂膜。 在晶片定位之后，晶片被单片化以形成具有用于芯片到芯片堆叠，芯片到衬底或芯片到引线框架连接的粘合剂的多个芯片。

公开(公告)号：US20070128377A1

公开(公告)日：2007-06-07

申请号：US11503191

申请日：2006-08-14

Applicant: Huang-Chin Tang ,  Chun-Hung Lin ,  Chih-Wei Chen ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chin-Yang Lee

Inventor： Huang-Chin Tang ,  Chun-Hung Lin ,  Chih-Wei Chen ,  Chin-Jyi Wu ,  Chen-Der Tsai ,  Chin-Yang Lee

IPC: C09K19/00 ,  G02F1/1337

CPC classification number: G02F1/13378 ,  Y10T428/1005

Abstract: A method for producing an alignment layer for a liquid crystal panel, which is produced by modifying an alignment film in a fixed direction and at a fixed angle by using an atmospheric pressure plasma source to form a uniform and isotropic alignment layer on the surface of the substrate. The resultant alignment layer has good uniformity and high anchoring energy, and the pre-tilt angle can be selected as desired. In addition, there are no problems with static charge generation, dust pollution and the like as in the prior arts. The method of the present invention is not restricted by vacuum apparatuses that need ion alignment or vacuum plasma alignment and the like and is not restricted by the size of the equipment. Therefore, the method of the present invention is suitable for treating the surface of an alignment layer of a large size liquid crystal panel.

Abstract translation: 一种用于制造液晶面板取向层的方法，其通过使用大气压等离子体源在固定方向和固定角度下修正取向膜而在其表面上形成均匀且各向同性的取向层 基质。 所得到的取向层具有良好的均匀性和较高的锚固能，并且可以根据需要选择预倾角。 此外，与现有技术相同，静电荷产生，粉尘污染等没有问题。 本发明的方法不受需要离子对准或真空等离子体对准等的真空装置的限制，并且不受设备尺寸的限制。 因此，本发明的方法适用于处理大尺寸液晶面板的取向层的表面。

公开(公告)号：US20070063325A1

公开(公告)日：2007-03-22

申请号：US11361646

申请日：2006-02-24

Applicant: Chun-Hung Lin ,  Geng-Shin Shen

Inventor： Chun-Hung Lin ,  Geng-Shin Shen

IPC: H01L21/00

CPC classification number: H01L25/0657 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/731 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A chip package structure including a first substrate, a second substrate, bumps and adhesive blocks is provided. The first substrate has first bonding pads. The second substrate is disposed above the first substrate and has second bonding pads. The bumps are respectively arranged on the first bonding pads or the second bonding pads, and the second substrate is electrically connected to the first substrate through the bumps. The adhesive material with B-stage property are respectively arranged between the first bonding pads and the second bonding pads and enclose each bump. The bumps can be stud bumps or plating bumps.

Abstract translation: 提供了包括第一基板，第二基板，凸块和粘合块的芯片封装结构。 第一衬底具有第一接合焊盘。 第二基板设置在第一基板上方并具有第二接合焊盘。 凸块分别布置在第一接合焊盘或第二接合焊盘上，并且第二衬底通过凸块电连接到第一衬底。 具有B阶特性的粘合剂材料分别布置在第一接合焊盘和第二接合焊盘之间并且包围每个凸块。 凸块可以是凸块或电镀凸块。

公开(公告)号：US20070020816A1

公开(公告)日：2007-01-25

申请号：US11326749

申请日：2006-01-05

Applicant: Yu-Tang Pan ,  Geng-Shin Shen ,  Chun-Hung Lin

Inventor： Yu-Tang Pan ,  Geng-Shin Shen ,  Chun-Hung Lin

IPC: H01L21/00

CPC classification number: H01L23/3128 ,  H01L21/4857 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A manufacturing process for chip package without core is disclosed. First of all, a conductive layer with a first surface and a second surface is provided. A first film is formed onto the first surface, and the conductive layer is patterned to form a patterned circuit layer. A solder resistance layer is formed on the patterned circuit layer and then patterned to expose parts of the patterned circuit layer. After a second film is formed on the solder resistance layer and the first film is removed, a chip is disposed on the first surface and electrically connected to the patterned circuit layer. A molding compound is formed to cover the patterned circuit layer and fix the chip onto the patterned circuit layer. After that, the second film is removed.

Abstract translation: 公开了一种无芯片封装的制造工艺。 首先，提供具有第一表面和第二表面的导电层。 第一膜形成在第一表面上，并且导电层被图案化以形成图案化的电路层。 在图案化电路层上形成阻焊层，然后将其图案化以暴露图案化电路层的部分。 在阻焊层上形成第二膜并且去除第一膜之后，在第一表面上设置芯片并与图案化电路层电连接。 形成模塑料以覆盖图案化电路层并将芯片固定在图案化电路层上。 之后，第二个膜被去除。

公开(公告)号：US07078520B2

公开(公告)日：2006-07-18

申请号：US10406979

申请日：2003-04-04

Applicant: Chun-Hung Lin ,  Wen-Bin Yang ,  Hui-Chang Lin

Inventor： Chun-Hung Lin ,  Wen-Bin Yang ,  Hui-Chang Lin

IPC: C07H3/02 ,  C07C13/00

CPC classification number: C07H1/00

Abstract: This invention relates to a method of preparing a first alicyclic compound having a vinyl group on one alkyl ring carbon and an alkoxy, cycloalkoxy, heterocycloalkyoxy, aryloxy, or heteroaryloxy group on the same ring carbon; the method comprising reacting an aliphatic alcohol or an aromatic alcohol with a second alicyclic compound having an exo cyclic carbon-carbon double bond, wherein the non-ring olefinic carbon is substituted with a hydroxymethyl, thiomethyl, alkoxymethyl, aryloxymethyl, acyloxymethyl, alkylsulfonyloxymethyl, arylsulfonyloxymethyl, alkylsulfonylmethyl, arylsulfonylmethyl, halomethyl, or silyloxymethyl group.

Abstract translation: 本发明涉及一种在同一环碳上一烷基环碳和烷氧基，环烷氧基，杂环烷氧基，芳氧基或杂芳氧基上具有乙烯基的第一脂环族化合物的制备方法; 所述方法包括使脂族醇或芳族醇与具有外环碳 - 碳双键的第二脂环族化合物反应，其中所述非环烯烃被羟甲基，硫代甲基，烷氧基甲基，芳氧基甲基，酰氧基甲基，烷基磺酰氧基甲基，芳基磺酰氧基甲基 ，烷基磺酰基甲基，芳基磺酰基甲基，卤代甲基或甲硅烷氧基甲基。

公开(公告)号：US06776884B2

公开(公告)日：2004-08-17

申请号：US10076308

申请日：2002-02-19

Applicant: Chun-Hung Lin ,  Chin-Ching Wu ,  Yun-Sheng Chung ,  Chin-Jyi Wu ,  Yung-Chen Peng ,  Yu-Chuan Tu

Inventor： Chun-Hung Lin ,  Chin-Ching Wu ,  Yun-Sheng Chung ,  Chin-Jyi Wu ,  Yung-Chen Peng ,  Yu-Chuan Tu

IPC: C25D1700

CPC classification number: C25F3/16 ,  C25F7/00 ,  Y02B10/10

Abstract: An electropolishing device having: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; and an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract translation: 一种电抛光装置，具有：电极装置，包括正极引导件，负极引导件，正极板，负极板和负极工作电极; 夹紧装置，其至少包括绝缘螺钉，上绝缘件和下绝缘件; 以及绝缘结构，其包括上绝缘盖和下绝缘盖。

公开(公告)号：US06600830B1

公开(公告)日：2003-07-29

申请号：US09441607

申请日：1999-11-16

Applicant: Chun-Hung Lin ,  Ja-Ling Wu

Inventor： Chun-Hung Lin ,  Ja-Ling Wu

IPC: G06K900

CPC classification number: G06K9/00268

Abstract: An automatic feature extraction system for analyzing a face image and finding the facial features of the face. In the pre-processing stage, a second-chance region growing method is applied to determine a face region on the face image. In the feature extraction stage, three primary facial features, including both eyes and the mouth, are extracted first. Then other facial features can be extracted according to these extracted primary facial features. Searching feature points can be achieved by calculating the cost function of each point using a simple feature template. In addition, a genetic algorithm can be used to accelerate the process of searching feature points.

Abstract translation: 一种自动特征提取系统，用于分析面部图像并找到面部的面部特征。 在预处理阶段，应用第二机会区域生长方法来确定面部图像上的面部区域。 在特征提取阶段，首先提取包括眼睛和嘴巴在内的三个主要面部特征。 然后可以根据这些提取的主要面部特征提取其他面部特征。 通过使用简单的特征模板计算每个点的成本函数可以获得搜索特征点。 另外，遗传算法可以用来加快搜索特征点的过程。

公开(公告)号：US06383846B1

公开(公告)日：2002-05-07

申请号：US09528617

申请日：2000-03-20

Applicant: Chi-Chih Shen ,  Wei-Chung Wang ,  Chun-Hung Lin

Inventor： Chi-Chih Shen ,  Wei-Chung Wang ,  Chun-Hung Lin

IPC: H01L2144

CPC classification number: H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2224/0401

Abstract: A method and apparatus for molding a flip chip semiconductor device are disclosed herein. A substrate having at least one air hole is provided. A chip is mounted on the substrate by multiple solder balls such that the air hole is beneath the chip and surrounded by the multiple solder balls. The substrate mounted with the chip is placed in a mold apparatus which defines at least one air channel aligning with the air hole, such that air can be exhausted via the air hole and the air channel when encapsulation material is filling the mold apparatus.

Abstract translation: 本文公开了一种用于模制倒装芯片半导体器件的方法和装置。 提供具有至少一个空气孔的基板。 芯片通过多个焊球安装在基板上，使得空气孔在芯片下方并被多个焊球围绕。 安装有芯片的基板被放置在模具装置中，该模具装置限定与空气孔对准的至少一个空气通道，使得当封装材料填充模具装置时，空气可以经由空气孔和空气通道排出。

公开(公告)号：US06341769B1

公开(公告)日：2002-01-29

申请号：US09779657

申请日：2001-02-09

Applicant: Chun-Hung Lin ,  Tzer-Kun Lin ,  Yun-Chuan Tu ,  Hann-Tsong Wang ,  Chin-Ching Wu

Inventor： Chun-Hung Lin ,  Tzer-Kun Lin ,  Yun-Chuan Tu ,  Hann-Tsong Wang ,  Chin-Ching Wu

IPC: B25B1100

CPC classification number: B25B11/005

Abstract: A non-contact pick-up device is disclosed. The non-contact pick-up device mainly includes a disk, and a plurality of air nozzles on the disk. Each nozzle has an air channel; and an upper end of the channel is tilt outwards. Therefore, as a disc-shaped article is placed on the disk; air jets out from the nozzles, due to Bernoulli principle, pressure difference is formed on the disc-shaped article. Thus, due to the action of atmosphere pressure, the disc-shaped article will be clamped. The pick-up device may be used in semiconductor manufacturing process for clamping a wafer.

Abstract translation: 公开了非接触式拾取装置。 非接触拾取装置主要包括盘，以及盘上的多个空气喷嘴。 每个喷嘴都有一个空气通道; 并且通道的上端向外倾斜。 因此，由于盘形物品被放置在盘上; 由于伯努利的原理，空气从喷嘴喷出，在圆盘形物品上形成压力差。 因此，由于大气压的作用，盘状物品被夹紧。 拾取装置可用于夹紧晶片的半导体制造工艺。