Semiconductor device and manufacturing method of semiconductor device

    公开(公告)号:US11101300B2

    公开(公告)日:2021-08-24

    申请号:US16628920

    申请日:2018-07-13

    Abstract: A semiconductor device enabling high integration is provided. The semiconductor device includes a plug, two capacitors, and two transistors sharing one oxide semiconductor. Each of the transistors includes a stacked-layer structure of a gate insulator and a gate electrode over the oxide semiconductor and an insulator in contact with a side surface of the gate electrode. An opening between the two gate electrodes exposes the insulators in contact with the side surfaces of the gate electrodes, and the plug is in the opening. The capacitor is directly provided over the oxide semiconductor. The side surface area of the capacitor is larger than the projected area of the capacitor.

    Semiconductor device, semiconductor wafer, and electronic device

    公开(公告)号:US10998447B2

    公开(公告)日:2021-05-04

    申请号:US15451514

    申请日:2017-03-07

    Abstract: A semiconductor device is provided in which the power consumption can be reduced by reducing the driving voltage and the on-state current can be increased in a period in which a transistor having an extremely low off-state current is brought into an electrically floating state. The semiconductor device comprises a memory cell, a first circuit, and a second circuit. The memory cell includes a first transistor. The first transistor includes a first semiconductor layer, a first gate electrode, and a first back gate electrode. The first gate electrode is connected to a word line. The first back gate electrode is connected to a back gate line. The first circuit supplies a signal for controlling the conduction state of the first transistor to the word line. The second circuit supplies a voltage for controlling the threshold voltage of the first transistor to the back gate line. The second circuit has a function of bringing the back gate line into an electrically floating state in a period in which a signal for controlling the conduction state of the first transistor is supplied to the word line.

    Memory device and semiconductor device including the same

    公开(公告)号:US10210915B2

    公开(公告)日:2019-02-19

    申请号:US15613508

    申请日:2017-06-05

    Inventor: Tatsuya Onuki

    Abstract: A memory device with reduced latency is provided. The memory device includes a burst read mode with a burst length of M0 (M0 is an integer greater than or equal to 2), a global sense amplifier array, M0 local memory cell arrays to , and M0 local sense amplifier arrays to . A memory cell includes a transistor and a capacitor. A local memory cell array (J is an integer from 1 to M0) is stacked over a local sense amplifier array . The local memory cell array comprises M0 blocks to differentiated by row, The local sense amplifier array in an idle state retains the data of the block . The block is specified when the local memory cell array is the first local memory cell array to be accessed in a burst read mode.

    Semiconductor device
    106.
    发明授权

    公开(公告)号:US10192871B2

    公开(公告)日:2019-01-29

    申请号:US15698138

    申请日:2017-09-07

    Abstract: To provide a semiconductor device in which the on-state current is high and the operation speed is high. The semiconductor device includes a transistor, a first circuit, and a second circuit. The transistor includes a first gate and a second gate. The first gate and the second gate overlap with each other with a semiconductor layer positioned therebetween. The first circuit includes a temperature sensor. The temperature sensor obtains temperature information. The first circuit is configured to apply a voltage to the second gate depending on the temperature information. The first circuit preferably includes a comparator. The second circuit is configured to apply a negative voltage to the second gate and hold the negative voltage.

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