Abstract:
A first transistor including a channel formation region, a first gate insulating layer, a first gate electrode, and a first source electrode and a first drain electrode; a second transistor including an oxide semiconductor layer, a second source electrode and a second drain electrode, a second gate insulating layer, and a second gate electrode; and a capacitor including one of the second source electrode and the second drain electrode, the second gate insulating layer, and an electrode provided to overlap with one of the second source electrode and the second drain electrode over the second gate insulating layer are provided. The first gate electrode and one of the second source electrode and the second drain electrode are electrically connected to each other.
Abstract:
A circuit with a reduced leakage current is provided. A first transistor, a third transistor, and a second transistor are electrically connected in this order in series, a drain of the second transistor and a source of the third transistor are electrically connected to each other and are electrically connected to an output node. The first transistor is a p-channel transistor. The second and third transistors are n-channel transistors each including a semiconductor region including an oxide semiconductor. The third transistor functions as a switch that controls electrical connection between a drain of the first transistor and an output node of the circuit. In the standby mode, the third transistor is in an off state.
Abstract:
An object is to provide a semiconductor device with a novel structure. The semiconductor device includes a first wiring; a second wiring; a third wiring; a fourth wiring; a first transistor having a first gate electrode, a first source electrode, and a first drain electrode; and a second transistor having a second gate electrode, a second source electrode, and a second drain electrode. The first transistor is provided in a substrate including a semiconductor material. The second transistor includes an oxide semiconductor layer.
Abstract:
To provide a memory device with low power consumption. The memory device includes a sense amplifier, bit lines, memory cells, and first transistors. The bit lines are provided over a layer where the sense amplifier is provided. The memory cells are provided over a layer where the bit lines are provided. The memory cell includes a second transistor and a capacitor. The sense amplifier and the bit lines are electrically connected to each other through the first transistors. The sense amplifier may include at least one layer of a conductor.
Abstract:
A memory cell includes a node and first transistor to third transistors. The third transistor and the second transistor are electrically connected to a fourth wiring and a third wiring in series, respectively. A gate of the third transistor is electrically connected to a second wiring. A gate of the second transistor is electrically connected to the node. In the first transistor, a gate is electrically connected to a first wiring, one of a source and a drain is electrically connected to the fourth wiring, and the other of the source and the drain is electrically connected to the node. The first transistor includes an oxide semiconductor layer where a channel is formed and a channel length and a channel width thereof are each shorter than 100 nm. A maximum potential of the first wiring is lower than or equal to 2 V.
Abstract translation:存储单元包括节点和第三晶体管至第三晶体管。 第三晶体管和第二晶体管分别电连接到第四布线和第三布线。 第三晶体管的栅极电连接到第二布线。 第二晶体管的栅极电连接到节点。 在第一晶体管中,栅极电连接到第一布线,源极和漏极中的一个电连接到第四布线,并且源极和漏极中的另一个电连接到节点。 第一晶体管包括其中形成沟道并且沟道长度和沟道宽度均小于100nm的氧化物半导体层。 第一布线的最大电位低于或等于2 V.
Abstract:
A semiconductor device with a novel structure is provided in which stored data can be held even when power is not supplied and the number of writing is not limited. The semiconductor includes a second transistor and a capacitor over a first transistor. The capacitor includes a source or drain electrode and a gate insulating layer of the second transistor and a capacitor electrode over an insulating layer which covers the second transistor. The gate electrode of the second transistor and the capacitor electrode overlap at least partly with each other with the insulating layer interposed therebetween. By forming the gate electrode of the second transistor and the capacitor electrode using different layers, an integration degree of the semiconductor device can be improved.
Abstract:
An object is to miniaturize a semiconductor device. Another object is to reduce the area of a driver circuit of a semiconductor device including a memory cell. The semiconductor device includes an element formation layer provided with at least a first semiconductor element, a first wiring provided over the element formation layer, an interlayer film provided over the first wiring, and a second wiring overlapping with the first wiring with the interlayer film provided therebetween. The first wiring, the interlayer film, and the second wiring are included in a second semiconductor element. The first wiring and the second wiring are wirings to which the same potentials are supplied.
Abstract:
When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing through a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.
Abstract:
An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied and there is no limit on the number of write operations. The semiconductor device includes a first memory cell including a first transistor and a second transistor, a second memory cell including a third transistor and a fourth transistor, and a driver circuit. The first transistor and the second transistor overlap at least partly with each other. The third transistor and the fourth transistor overlap at least partly with each other. The second memory cell is provided over the first memory cell. The first transistor includes a first semiconductor material. The second transistor, the third transistor, and the fourth transistor include a second semiconductor material.
Abstract:
A semiconductor device that can be miniaturized or highly integrated is provided. First to second transistors share a first metal oxide over a first insulator and a first conductor over the first metal oxide; the first transistor includes a second conductor and a second insulator which are over the first metal oxide and a third conductor over the second insulator; the second transistor includes a fourth conductor and a third insulator which are over the first metal oxide and a fifth conductor over the third insulator; a side surface of the first insulator includes a portion in contact with the fourth conductor; an end portion of the fourth conductor includes a portion positioned outward from an end portion of the first insulator; the second insulator is positioned between the first conductor and the second conductor; the metal oxide and the third conductor overlap with each other with the second insulator therebetween; the third insulator is positioned between the first conductor and the fourth conductor; and the metal oxide and the fifth conductor overlap with each other with the third insulator therebetween.