公开(公告)号：US07312677B2

公开(公告)日：2007-12-25

申请号：US10878330

申请日：2004-06-29

Applicant: Tadashi Nakatani ,  Tsutomu Miyashita

Inventor： Tadashi Nakatani ,  Tsutomu Miyashita

IPC: H01H51/22

CPC classification number: H01H59/0009 ,  B81B2201/016 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C2201/0109

Abstract: A method is provided for making a micro-switching element. The switching element includes a substrate, two supporting members fixed to the substrate, and a movable beam bridging between the supporting members. The beam includes a membrane, a movable contact electrode and a movable driving electrode, both disposed on the membrane. The switching element also includes a pair of stationary contact electrodes facing the movable contact electrode, and a stationary driving electrode cooperating with the movable driving electrode for generation of electrostatic force. The method includes the steps of making a sacrifice layer on the substrate, making the membrane on the sacrifice layer, and subjecting the sacrifice layer to etching with the membrane intervening, so that the supporting members are formed as remaining portions of the sacrifice layer between the substrate and the membrane.

Abstract translation: 提供了一种制造微型开关元件的方法。 开关元件包括基板，固定到基板的两个支撑构件和桥接在支撑构件之间的可移动梁。 梁包括设置在膜上的膜，可动接触电极和可移动​​驱动电极。 开关元件还包括面对可动接触电极的一对固定接触电极，以及与可动驱动电极配合以产生静电力的固定驱动电极。 该方法包括以下步骤：在基底上制备牺牲层，使膜处于牺牲层上，并使牺牲层进行介入蚀刻，使得支撑构件形成为牺牲层的剩余部分 底物和膜。

公开(公告)号：US20070222007A1

公开(公告)日：2007-09-27

申请号：US10578026

申请日：2004-10-26

Applicant: Jozef Van Beek ,  Mathieu Joseph Ulenaers

Inventor： Jozef Van Beek ,  Mathieu Joseph Ulenaers

IPC: H01L29/84 ,  H01L21/00

CPC classification number: H01G5/18 ,  B81B3/0078 ,  B81B2201/016 ,  B81B2201/038 ,  B81B2203/04 ,  B81B2203/053 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2239/01

Abstract: A method for manufacturing a micro-electromechanical systems (MEMS) device, comprising providing a base layer (10) and a mechanical layer (12) on a substrate (14), providing a sacrificial layer (16) between the base layer (10) and the mechanical layer (12), providing an etch stop layer (18) between the sacrificial layer (16) and the substrate (14), and removing the sacrificial layer (16) by means of dry chemical etching, wherein the dry chemical etching is performed using a fluorine-containing plasma, and the etch stop layer (18) comprises a substantially non-conducting, fluorine chemistry inert material, such as HfO2, ZrO2, Al2O3 or TiO2.

Abstract translation: 一种用于制造微机电系统（MEMS）装置的方法，包括在基底（14）上提供基底层（10）和机械层（12），在基底层（10）之间提供牺牲层（16） 和所述机械层（12），在所述牺牲层（16）和所述衬底（14）之间提供蚀刻停止层（18），以及通过干法化学蚀刻去除所述牺牲层（16），其中所述干化学蚀刻 使用含氟等离子体进行，并且蚀刻停止层（18）包括基本上不导电的氟化学惰性材料，例如HfO 2，ZrO 2， ，Al 2 O 3 3或TiO 2。

公开(公告)号：US20070035200A1

公开(公告)日：2007-02-15

申请号：US11388213

申请日：2006-03-23

Applicant: Fabrice Casset ,  Karim Segueni ,  Arnaud De Grave ,  Nicolas Abele

Inventor： Fabrice Casset ,  Karim Segueni ,  Arnaud De Grave ,  Nicolas Abele

IPC: H01H57/00 ,  C23F1/00 ,  H02N1/00

CPC classification number: H03H9/2463 ,  B81B3/007 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0118 ,  H03H3/0076 ,  H03H9/2447

Abstract: A microelectromechanical system comprises a beam and an electrode coupled to the beam via electrostatic interaction. The beam is designed to undergo elastic flexural deformation and has an approximately constant cross section. The beam consists of several flat faces that extend over the length of the beam, each having a thickness of less than an external dimension of the cross section. A flexural vibration frequency of the beam is then increased compared with a solid beam of the same external dimensions. Such a microelectromechanical system is suitable for applications requiring very short transition times, or for producing high-frequency oscillators and resonators.

Abstract translation: 微机电系统包括通过静电相互作用耦合到束的光束和电极。 梁被设计成经历弹性弯曲变形并且具有大致恒定的横截面。 梁包括在梁的长度上延伸的多个平面，每个平面具有小于横截面的外部尺寸的厚度。 然后与相同外部尺寸的实心束相比，梁的弯曲振动频率增加。 这样的微机电系统适用于需要非常短的转换时间或用于产生高频振荡器和谐振器的应用。

公开(公告)号：US20050190023A1

公开(公告)日：2005-09-01

申请号：US10878330

申请日：2004-06-29

Applicant: Tadashi Nakatani ,  Tsutomu Miyashita

Inventor： Tadashi Nakatani ,  Tsutomu Miyashita

IPC: H01H49/00 ,  B81B3/00 ,  B81B5/00 ,  B81B7/00 ,  B81C1/00 ,  H01H11/00 ,  H01H51/22 ,  H01H59/00 ,  H01L21/00 ,  H01L29/00

CPC classification number: H01H59/0009 ,  B81B2201/016 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C2201/0109

Abstract: A method is provided for making a micro-switching element. The switching element includes a substrate, two supporting members fixed to the substrate, and a movable beam bridging between the supporting members. The beam includes a membrane, a movable contact electrode and a movable driving electrode, both disposed on the membrane. The switching element also includes a pair of stationary contact electrodes facing the movable contact electrode, and a stationary driving electrode cooperating with the movable driving electrode for generation of electrostatic force. The method includes the steps of making a sacrifice layer on the substrate, making the membrane on the sacrifice layer, and subjecting the sacrifice layer to etching with the membrane intervening, so that the supporting members are formed as remaining portions of the sacrifice layer between the substrate and the membrane.

Abstract translation: 提供了一种制造微型开关元件的方法。 开关元件包括基板，固定到基板的两个支撑构件和桥接在支撑构件之间的可移动梁。 梁包括设置在膜上的膜，可动接触电极和可移动​​驱动电极。 开关元件还包括面对可动接触电极的一对固定接触电极，以及与可动驱动电极配合以产生静电力的固定驱动电极。 该方法包括以下步骤：在衬底上制造牺牲层，使膜处于牺牲层上，并使牺牲层进行介入蚀刻，使得支撑构件形成为牺牲层的剩余部分 底物和膜。

公开(公告)号：US20050167047A1

公开(公告)日：2005-08-04

申请号：US10663986

申请日：2003-09-17

Applicant: Michael Huff ,  Mehmet Ozgur

Inventor： Michael Huff ,  Mehmet Ozgur

IPC: H01H59/00 ,  H01P1/12 ,  H01P1/18 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q15/00 ,  H01Q21/00 ,  H05K1/03 ,  H05K1/16 ,  C23F1/00 ,  H01L21/306

CPC classification number: B82Y30/00 ,  B81B7/0064 ,  B81B2201/016 ,  B81B2207/015 ,  B81B2207/092 ,  B81B2207/095 ,  B81B2207/096 ,  B81C2203/0118 ,  B81C2203/035 ,  H01G5/16 ,  H01G5/18 ,  H01G5/40 ,  H01H59/0009 ,  H01H2057/006 ,  H01H2059/0072 ,  H01L2224/16225 ,  H01L2924/15153 ,  H01P1/127 ,  H01P1/184 ,  H01Q1/38 ,  H01Q3/26 ,  H01Q15/0013 ,  H01Q15/004 ,  H01Q21/0087 ,  H05K1/0306 ,  H05K1/16

Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.

Abstract translation: 使用微机电开关（“MEMS”）和低温共烧陶瓷（“LTCC”）技术的相控阵天线系统和其它类型的射频（RF）装置和系统以及制造这种相控阵天线的方法 系统和其他类型的射频（RF）设备。 每个天线或其他类型的装置包括至少两个多层陶瓷模块和在其中一个模块上制造的MEMS装置。 一旦完成了MEMS器件的制造，就将两个陶瓷模块结合在一起，密封MEMS器件，并允许所有器件层之间的电连接。 底部陶瓷模块在背面还具有用于安装集成电路的空腔。 内部层使用标准LTCC制造和低损耗介电LTCC带材料中可用的导电，电阻和高k电介质浆料形成。

公开(公告)号：US20050046541A1

公开(公告)日：2005-03-03

申请号：US10949800

申请日：2004-09-24

Applicant: Yves Fouillet

Inventor： Yves Fouillet

IPC: H01H1/00 ,  G02F1/1339

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  H01G5/16 ,  H01H2001/0042 ,  H01H2037/008 ,  Y10T29/42 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: The invention involves a microsystem which can be used in particular for making microswitches or microvalves, composed of a substrate (50) and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element (51) attached, at opposite ends, to the substrate (50) so that there is a natural deflection without stress with respect to a surface of the substrate opposite it, this natural deflection determining the first state of functioning, the second state of functioning being caused by the thermal sensor which, under the influence of temperature variation, induces a deformation of the deformable element (51) which diminishes the deflection by subjecting it to a compressive force which shifts it in a direction opposite to its natural deflection by buckling.

Abstract translation: 本发明涉及一种微系统，其特别可用于制造由基板（50）组成的微型开关或微型阀，并用于通过双金属效应热传感器在第一功能状态和第二功能状态之间移动。 所述传感器包括可变形元件（51），所述可变形元件（51）在相对端附接到所述基板（50），使得相对于与其相对的所述基板的表面具有无应力的自然变形，所述自然偏转确定所述第一功能状态 由热传感器引起的第二功能状态是在温度变化的影响下引起可变形元件（51）的变形，该变形元件（51）的变形通过使其沿与 其屈曲的自然偏转。

公开(公告)号：US20040160302A1

公开(公告)日：2004-08-19

申请号：US10781444

申请日：2004-02-18

Inventor： Masazumi Yasuoka ,  Hirokazu Sanpei ,  Jun Mizuno

IPC: H01H037/52

CPC classification number: H01H61/02 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2203/0109 ,  B81B2203/053 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2061/006

Abstract: A switch, comprising a movable part supported at both ends and a contact installed on the movable part, the movable part characterized by further comprising a first bimetal for displacing the contact in a specified direction according to a temperature and a second bimetal for displacing the contact in the direction opposite to the specified direction according to the temperature.

Abstract translation: 一种开关，包括支撑在两端的可移动部分和安装在可动部件上的触点，所述可移动部件的特征在于还包括用于根据温度在指定方向上移动触点的第一双金属片和用于移动触点的第二双金属件 根据温度与指定方向相反的方向。

公开(公告)号：US06740946B2

公开(公告)日：2004-05-25

申请号：US10230200

申请日：2002-08-29

Applicant: Hideyuki Funaki

Inventor： Hideyuki Funaki

IPC: H01L2982

CPC classification number: H03H9/462 ,  B81B3/0021 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/051 ,  H01H13/80 ,  H01H59/0009 ,  H01H2001/0078 ,  H01H2201/008 ,  H03H3/0072

Abstract: A micromechanical switch includes a substrate, at least one pair of support members fixed to the substrate, and at least one pair of beam members placed in proximity and parallel to each other above the substrate, and connected to one of the support members, respectively, each of the beam members having a moving portion which is movable with a gap with respect to the substrate. A contact portion is provided on the moving portion, and a driving electrode is placed on the substrate between the pair of beam members to attract the moving portions of the beam members in a direction in a plane substantially parallel to the substrate with an electrostatic force so that the contact portions of the bean members which are opposed to each other are short-circuited.

Abstract translation: 微机械开关包括基板，固定到基板的至少一对支撑构件和至少一对梁构件，所述至少一对梁构件分别邻近并平行放置在基板上方并分别连接到支撑构件之一， 每个梁构件具有可相对于基板间隙移动的移动部分。 接触部分设置在移动部分上，并且驱动电极被放置在一对梁构件之间的基板上，以静电力吸引梁构件的移动部分在大致平行于基板的平面中的方向上 豆制品的彼此相对的接触部分短路。

公开(公告)号：US09966194B2

公开(公告)日：2018-05-08

申请号：US15385431

申请日：2016-12-20

Applicant: Texas Instruments Incorporated

Inventor： Arun Gupta ,  William C. McDonald ,  Adam Fruehling ,  Ivan Kmecko ,  Lance Barron ,  Divyanshu Agrawal ,  Arthur M. Turner ,  John C. Ehmke

IPC: H01L27/20 ,  H01L29/84 ,  H01G5/16 ,  H01G5/40 ,  H01G5/011 ,  B81B7/00

CPC classification number: H01G5/16 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/0064 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00158 ,  H01G5/011 ,  H01G5/40

Abstract: A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

公开(公告)号：US20170271114A1

公开(公告)日：2017-09-21

申请号：US15073372

申请日：2016-03-17

Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION

Inventor： XING LAN ,  Chunbo Zhang

IPC: H01H49/00 ,  H01H59/00 ,  H01H1/00

CPC classification number: H01H59/0009 ,  B81B2201/014 ,  B81B2201/016 ,  B81C1/00373 ,  H01H1/0036 ,  H01H2001/0052 ,  H01H2059/0072

Abstract: A method for fabricating an MEMS switch including providing a substrate and printing at least one metal bias electrode, at least one metal connection pad and at least one metal contact pad on the substrate. The method then prints a sacrificial layer on the substrate and over the at least one bias electrode, and prints a flexible beam structure on the sacrificial layer. The sacrificial layer is then removed by dissolving the sacrificial layer in a wet solution to release the beam structure so that the beam structure is spaced some distance from the at least one bias electrode and the contact pad.