公开(公告)号：US07112071B2

公开(公告)日：2006-09-26

申请号：US11290558

申请日：2005-12-01

Applicant: Tooru Nakagawa ,  Kazuhiro Yamamoto

Inventor： Tooru Nakagawa ,  Kazuhiro Yamamoto

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R13/112 ,  H05K3/301 ,  H05K2201/10333 ,  H05K2201/10651 ,  H05K2201/10962

Abstract: In a structure for attaching a circuit board terminal to a circuit board, stress is minimized in a soldered portion on a circuit section upon inserting and drawing an electrical element into and from the circuit board. The attaching structure including a holding member mounted on and secured to a circuit board, a bus bar that has a base portion supported on the holding member and a leg portion that passes one or more through-holes and to be soldered on a circuit section, and a circuit board terminal that has a base portion to be connected to the bus bar and a connection portion adapted to be coupled to a terminal of an electrical element. The bus bar is provided on the base portion with elastic tongue pieces that can contact elastically with a circuit board terminal. The circuit board terminal is connected through the bus bar to the circuit section.

Abstract translation: 在将电路基板端子安装在电路基板上的结构中，将电气元件插入电路基板并从电路基板上拔出时，电路部分的焊接部位的应力最小化。 该安装结构包括安装在电路板上并固定到电路板上的保持构件，具有支撑在保持构件上的基部的汇流条和通过一个或多个通孔并被焊接在电路部分上的支脚部分， 以及电路板端子，其具有要连接到母线的基座部分和适于联接到电气元件的端子的连接部分。 汇流条在基部上设置有可与电路板端子弹性接触的弹性舌片。 电路板端子通过母线连接到电路部分。

公开(公告)号：US20060198128A1

公开(公告)日：2006-09-07

申请号：US11364304

申请日：2006-02-28

Applicant: Colin Piepgras ,  Kevin Dowling

Inventor： Colin Piepgras ,  Kevin Dowling

IPC: F21S8/00

CPC classification number: H05K3/284 ,  B29C39/10 ,  B29C39/12 ,  F21K9/00 ,  F21K9/90 ,  F21S4/20 ,  F21V31/04 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0863 ,  H05K1/0239 ,  H05K1/14 ,  H05K1/144 ,  H05K3/3405 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10386 ,  H05K2203/308 ,  Y10S362/80

Abstract: Methods and means for embedding electronic components, such as LED-based light sources and associated control circuitry, into molded or continuously cast surface materials (e.g., material manufactured under the trademark CORIAN®). During the manufacture of the surface material, the components can be held in position using a scaffold or frame constructed of a sacrificial material, the same material as the finished surface material and/or another material used in the manufacture of the finished product. The embedded components can include control circuitry, e.g., printed circuit boards, for separately controlling each component, power conductors and data busses. Conductors and/or busses can be in the form of conductive rails, wire mesh or sheets. Access to the conductors in the finished product can be made by a number of methods, including but not limited to sanding, grinding, drilling into, screwing into, and/or inserting pins into the finished material.

公开(公告)号：US06881074B1

公开(公告)日：2005-04-19

申请号：US10673652

申请日：2003-09-29

Applicant: Allen James McLenaghan

Inventor： Allen James McLenaghan

IPC: H01L23/48 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K3/32

CPC classification number: H01R13/2435 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/83899 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01R13/20 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333

Abstract: An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

Abstract translation: 本发明的组件具有电气和机械连接到基板的集成电路装置。 至少一个导电连接元件位于基板和电路装置中的一个上，并且至少一个插座位于基板和电路装置的另一个上。 插座容纳至少一个连接元件并且包括至少两个弹性构件。 弹性构件被偏置抵靠连接元件，使得电路装置和基板通过弹性构件的抵抗连接元件的偏置力保持在电气和机械连接中。

公开(公告)号：US06699046B2

公开(公告)日：2004-03-02

申请号：US10151679

申请日：2002-05-20

Applicant: Kwun-Yao Ho ,  Kung Moriss ,  Lin-Chou Tung

Inventor： Kwun-Yao Ho ,  Kung Moriss ,  Lin-Chou Tung

IPC: H01R1200

CPC classification number: H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K2201/2018 ,  H05K2201/2027

Abstract: A pin grid array integrated circuit connecting device which including a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further includes multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame. Said driving apparatus is connecting to said sliding slice and, by rotating horizontally, drive said sliding slice to move in a proper manner linearly.

Abstract translation: 一种针阵列集成电路连接装置，其包括基板，滑动切片，引导框架和驱动装置。 所述衬底还包括多个孔以保持集成电路封装的引脚，孔中的多个导电定位部件以保持所述引脚并将所述引脚电连接，电路器件具有适当的电路布局和在所述衬底的底部上的多个电连接点 通过所述电路装置连接所述多个导电定位部件。 放置在所述基板上的额外的电子部件将提供额外的功能。 所述滑动片放置在所述衬底的顶部上并且可相对移动。 多个孔被放置在所述滑动切片上并相对于所述基底上的孔定位。 所述引导框架被放置在所述基板的至少两个相对的侧面上，所述两个相对侧沿着所述导向框架的延伸部线性地引导所述滑动移动。 所述驱动装置连接到所述滑动片，并且通过水平旋转驱动所述滑动片以适当的方式线性移动。

公开(公告)号：US20030096514A1

公开(公告)日：2003-05-22

申请号：US10151679

申请日：2002-05-20

Inventor： Kwun-Yao Ho ,  Kung Moriss ,  Lin-Chou Tung

IPC: H05K001/00

CPC classification number: H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K2201/2018 ,  H05K2201/2027

Abstract: A pin grid array integrated circuit connecting device which comprises a substrate, a sliding slice, a guiding frame and a driving apparatus. Said substrate further comprises multiple holes to hold pins of a integrated circuit package, multiple conductive positioning components in the holes to hold said pins and connect said pins electrically, circuit device with proper circuit layout and multiple electrical connecting spots on the bottom of said substrate which connecting said multiple conductive positioning components thru said circuit device. The extra electronic components placed on said substrate will provide the additional function. Said sliding slice is placed on the top of said substrate and can be moved relatively. Multiple holes are placed on said sliding slice and positioned correspondingly to the holes on said substrate. Said guiding frame is placed on at least the two opposite sides of said substrate which guide said sliding move linearly along the extension of said guiding frame. Said driving apparatus is connecting to said sliding slice and, by rotating horizontally, drive said sliding slice to move in a proper manner linearly.

Abstract translation: 一种针阵列集成电路连接装置，包括基板，滑动切片，引导框架和驱动装置。 所述衬底还包括多个孔以保持集成电路封装的引脚，孔中的多个导电定位部件以保持所述引脚并将所述引脚电连接，电路器件具有适当的电路布局和在所述衬底的底部上的多个电连接点 通过所述电路装置连接所述多个导电定位部件。 放置在所述基板上的额外的电子部件将提供额外的功能。 所述滑动片放置在所述衬底的顶部上并且可相对移动。 多个孔被放置在所述滑动切片上并相对于所述基底上的孔定位。 所述引导框架被放置在所述基板的至少两个相对的侧面上，所述两个相对侧沿着所述导向框架的延伸部线性地引导所述滑动移动。 所述驱动装置连接到所述滑动片，并且通过水平旋转驱动所述滑动片以适当的方式线性移动。

公开(公告)号：US06392165B1

公开(公告)日：2002-05-21

申请号：US09939234

申请日：2001-08-24

Applicant: Sheng-Ji Liao

Inventor： Sheng-Ji Liao

IPC: H01R909

CPC classification number: H01R12/526 ,  H05K1/112 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2203/0455

Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes and are coaxial therewith. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.

Abstract translation: 提供了一种适配器，用于将球栅阵列装置安装在针式集成电路插座上，并且包括基板和接口板。 基板具有在其上形成有多个焊盘的器件安装侧。 基板还形成有多个上通孔，每个上通孔对应于焊盘之一。 接口板形成有分别对应于上通孔并与其同轴的多个下通孔。 接口板还具有一个与其相对的多个插入销的面对面的插座。 电导体设置在基板和接口板上，用于经由上和下通孔电连接和分别焊接焊盘和插入销。

公开(公告)号：US20020029903A1

公开(公告)日：2002-03-14

申请号：US09939234

申请日：2001-08-24

Applicant: Witek Enterprise Co., Ltd. a Taiwan Corporation

Inventor： Sheng-Ji Liao

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H01R12/526 ,  H05K1/112 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2203/0455

Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.

Abstract translation: 提供了一种适配器，用于将球栅阵列装置安装在针式集成电路插座上，并且包括基板和接口板。 基板具有在其上形成有多个焊盘的器件安装侧。 焊盘对应于并适用于其上的球栅阵列器件的焊球的表面安装。 基板还形成有多个上通孔，每个上通孔对应于焊盘之一。 接口板形成有分别对应于上通孔的多个下通孔。 接口板还具有一个与其相对的多个插入销的面对面的插座。 插入销对应于并适于插入到集成电路插座中的针孔中，以便与设置在销孔中的板安装销建立电接触。 电导体设置在基板和接口板上，用于经由上和下通孔电连接和分别焊接焊盘和插入销。

公开(公告)号：US5982635A

公开(公告)日：1999-11-09

申请号：US735832

申请日：1996-10-23

Applicant: L. William Menzies ,  Stephen W. Menzies ,  Dale S. Mackey

Inventor： L. William Menzies ,  Stephen W. Menzies ,  Dale S. Mackey

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K7/1092 ,  H05K1/0203 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K3/3447 ,  H05K3/368

Abstract: An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package. The intermediate adaptor board and the socket combine to perform all necessary signal conversion, including power supply voltage levels, between the circuit board and the IC.

Abstract translation: 互连结构适应在印刷电路板（PCB）和包括引线的集成电路（IC）之间传导的一个或多个信号，该IC具有不由PCB提供的信号要求。 互连结构包括提供A的插座。 导线之间的电路板和一些但不是全部的引线在封装上。 为了适应信号，互连结构还包括包括一个或多个电气部件的中间适配器板。 适配器板和插槽配置在包含IC和PCB上方的封装下方，并且不延伸超出封装的侧边界。 在IC运行期间由这些部件产生的热量通过夹在组件和封装之间的导热材料层通过IC封装消散。 中间适配器板和插座组合在电路板和IC之间执行所有必要的信号转换，包括电源电压电平。

公开(公告)号：US5724728A

公开(公告)日：1998-03-10

申请号：US552917

申请日：1995-11-03

Applicant: Robert H. Bond ,  Harry M. Siegel

Inventor： Robert H. Bond ,  Harry M. Siegel

IPC: H01L23/58 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/10 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01L23/58 ,  H05K1/181 ,  H05K7/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K2201/10037 ,  H05K2201/10068 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/325 ,  Y02P70/611 ,  Y10T29/49144

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract translation: 一种用于封装集成电路部件的系统，包括具有耦合到所述衬底的多个焊球的球栅阵列衬底。 半导体器件安装在衬底上并电耦合到焊球。 一个或多个端子耦合到基板并电耦合到所述半导体器件。 可拆卸模块包含辅助部件。 该模块包括用于容纳部件的主体部分和用于与相应端子配合的一个或多个电连接器，以将模块保持在基板上并将部件与半导体器件电耦合。 端子也可以连接到焊球，使得部件可以可选地设置在电路板上或可拆卸模块中。

公开(公告)号：US5460531A

公开(公告)日：1995-10-24

申请号：US187927

申请日：1994-01-27

Applicant: Joseph A. Vivio

Inventor： Joseph A. Vivio

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H01L23/52

CPC classification number: H05K7/1084 ,  H05K1/141 ,  H05K7/1092 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10704 ,  H05K3/368

Abstract: An interconnect structure is provided for converting or adapting select signals sent between a printed circuit board (PCB) and an electrical component. The interconnect structure comprises an adapter card placed between the PCB and the electrical component, wherein the adapter card includes one or more pass-through vias and non pass-through vias extending completely through the adapter card in parallel spaced relation to one another. Pass-through vias are used to couple signals having critical timing paths between the electrical component and the PCB without substantially modifying or changing the critical path switch points. The pass-through vias also provide connection of signals of non critical timing between the PCB and the component. A signal converter may be used to convert non-critical signals and place those signals at select pins upon the electrical component. Thus, the adapter card is well suited for providing conversion to newer, updated components which are pin-for-pin compatible with, and which operate at dissimilar voltages from, older components. The adapter card performs all necessary signal conversion without requiring modification to the larger PCB.

Abstract translation: 提供互连结构，用于转换或调整在印刷电路板（PCB）和电气部件之间发送的选择信号。 互连结构包括放置在PCB和电气部件之间的适配器卡，其中适配器卡包括一个或多个穿过通孔和非穿过通孔，其彼此平行地间隔开地完全延伸穿过适配器卡。 穿通通孔用于将具有关键定时路径的信号耦合在电气部件和PCB之间，而不必基本上修改或改变关键路径切换点。 直通通孔还提供PCB和组件之间非关键定时信号的连接。 信号转换器可用于转换非关键信号，并将这些信号放置在电气部件上的选定引脚处。 因此，适配器卡非常适合于提供与更旧的更新的组件的转换，这些更新的组件是针对引脚兼容的，并且在旧组件中以不同的电压工作。 适配器卡执行所有必要的信号转换，无需修改较大的PCB。