公开(公告)号：US20090211704A1

公开(公告)日：2009-08-27

申请号：US12430954

申请日：2009-04-28

Applicant: Karl Haberle ,  Rainer Koniger ,  Eva Wagner ,  Klaus Dieter Hoerner

Inventor： Karl Haberle ,  Rainer Koniger ,  Eva Wagner ,  Klaus Dieter Hoerner

IPC: B32B37/00 ,  C08G18/00 ,  C08L75/04 ,  C09J201/02 ,  C09J4/04

CPC classification number: C09D175/00 ,  C08G18/283 ,  C08G18/706 ,  C08G18/7831 ,  C08G18/792

Abstract: Mixtures comprising(A) an isocyanurate and/or biuret of 1,6-diisocyanatohexane (HDI), (B) an isocyanurate of 1-isocyanato-3,5,5-trimethyl-5-isocyanatomethylcyclohexane (IPDI), (C) at least one emulsifier, and (D) if desired, solvent.

Abstract translation: 包含（A）1,6-二异氰酸根合己烷（HDI）的异氰脲酸酯和/或缩二脲的混合物，（B）1-异氰酸酯基-3,5,5-三甲基-5-异氰酸甲酯基环己烷（IPDI）的异氰尿酸酯（IPDI），（C） 至少一种乳化剂，和（D）如果需要，溶剂。

公开(公告)号：US20050191456A1

公开(公告)日：2005-09-01

申请号：US11054826

申请日：2005-02-10

Applicant: Kouichi Hashimoto ,  Kazuhiko Yamamoto

Inventor： Kouichi Hashimoto ,  Kazuhiko Yamamoto

IPC: C09J7/02 ,  C09J133/00 ,  C09J175/14 ,  C09J201/02 ,  H01L21/00 ,  H01L21/301 ,  H01L21/304 ,  B32B9/00

CPC classification number: C09J7/22 ,  C09J7/38 ,  C09J7/403 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/67132 ,  Y10S428/906 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24355

Abstract: To present an adhesive sheet roll for wafer processing excellent in storage stability, radiation curing property, and low contamination to wafer. To present an adhesive sheet for wafer processing prepared by cutting the adhesive sheet roll for wafer processing, and an adhesive sheet with semiconductor wafer. To present a manufacturing method of semiconductor device using adhesive sheet for wafer processing or adhesive sheet with semiconductor wafer, and a semiconductor device obtained in this manufacturing method. An adhesive film for roll wafer processing which laminating multiple layers of laminated film stacking up base film, radiation curing type adhesive layer, and releasing film in this sequence, in which the arithmetic average roughness (Ra) of the other surface of the side of the base film and/or releasing film contacting with the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.

Abstract translation: 提供用于晶片处理的粘合片卷，其具有优异的储存稳定性，辐射固化性能和对晶片的低污染。 呈现通过切割用于晶片加工的粘合片卷制备的用于晶片加工的粘合片，以及具有半导体晶片的粘合片。 介绍使用晶片加工用粘合片或半导体晶片的半导体器件的制造方法以及在该制造方法中获得的半导体器件。 一种用于辊晶片处理的粘合膜，其中以层叠多层叠层膜叠层基膜，辐射固化型粘合剂层和脱模膜，其中该层的另一面的算术平均粗糙度（Ra） 与辐射固化型粘合剂层接触的基膜和/或脱模膜为1μm以上，辐射固化型粘合剂层中所含的自由基聚合引发剂的重量小于1000ppm。

公开(公告)号：US20050095531A1

公开(公告)日：2005-05-05

申请号：US10918946

申请日：2004-08-16

Applicant: Yuxia Liu

Inventor： Yuxia Liu

IPC: C07C19/075 ,  C07C381/12 ,  C07D335/10 ,  C07D335/16 ,  C08F2/50 ,  C08G59/00 ,  C09D7/12 ,  C09D163/00 ,  C09D201/02 ,  C09J11/06 ,  C09J201/02 ,  C09K3/10 ,  G03C1/76

CPC classification number: C07C381/12 ,  C07D335/16 ,  C08G59/688 ,  G03F7/0045 ,  G03F7/038 ,  Y10S430/122 ,  Y10S430/123 ,  Y10S430/124 ,  Y10S430/125 ,  Y10S430/126

Abstract: Sulfonium salt photoinitiator compositions, precursors useful in the preparation of such photoinitiators and the use of these photoinitiators in, e.g., UV curable adhesives, UV curable sealants, UV curable coating compositions, such as printing inks and varnishes, and UV curable encapsulants.

Abstract translation: 锍盐光引发剂组合物，可用于制备这种光引发剂的前体和这些光引发剂在例如UV可固化粘合剂，UV可固化密封剂，UV可固化涂料组合物如印刷油墨和清漆中的用途以及UV可固化的密封剂。

公开(公告)号：US5977260A

公开(公告)日：1999-11-02

申请号：US677807

申请日：1996-07-10

Applicant: Vittorio Ciaccia ,  Eugenio Longo ,  Patrizia Piancastelli

Inventor： Vittorio Ciaccia ,  Eugenio Longo ,  Patrizia Piancastelli

IPC: C09J123/00 ,  C08J5/12 ,  C08L23/04 ,  C08L23/16 ,  C09J123/02 ,  C09J123/04 ,  C09J123/10 ,  C09J123/16 ,  C09J123/18 ,  C09J123/22 ,  C09J201/02 ,  C09K3/10 ,  C08L9/00

CPC classification number: C08J5/124 ,  C09J123/04 ,  C08J2323/16 ,  Y10T428/31917 ,  Y10T428/31924

Abstract: Adhesive thermoplastic composition basically consisting of:1) dynamically vulcanized thermoplastic elastomer;2) polyethylene having a density equal to or less than 0.920 g/cm.sup.3 ;3) additives.The above composition is particularly useful for being firmly bound to articles made of EPM and/or EPDM vulcanized rubbers and for binding parts of vulcanized EPM and/or EPDM to each other.

Abstract translation: 粘合热塑性成分基本上由以下组成：1）动态硫化热塑性弹性体; 2）密度等于或小于0.920g / cm 3的聚乙烯; 3）添加剂。 上述组合物特别可用于牢固地结合由EPM和/或EPDM硫化橡胶制成的制品以及将硫化EPM和/或EPDM的部分彼此粘合。

公开(公告)号：US5948863A

公开(公告)日：1999-09-07

申请号：US932970

申请日：1997-09-18

Applicant: David John St. Clair ,  James Robert Erickson

Inventor： David John St. Clair ,  James Robert Erickson

IPC: C09K3/10 ,  C08G18/62 ,  C08G18/69 ,  C08G59/18 ,  C08G59/34 ,  C08J3/24 ,  C08L53/00 ,  C09J4/06 ,  C09J119/00 ,  C09J153/00 ,  C09J161/34 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J201/02 ,  C08L53/02 ,  C08L33/08 ,  C08L67/02

CPC classification number: C08G59/027 ,  C08G18/6208 ,  C08G18/69 ,  C08G18/698 ,  C08G59/18 ,  C08J3/243 ,  C09J119/006 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J4/06 ,  C08G2170/40 ,  C08G2190/00

Abstract: A pressure structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a glycidyl ether-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functonalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with glycidyl ether and another functionality such as olefinic unsaturation or epoxidized olefin; and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as an aliphatic polyamine, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer but does not cure under conditions required to cure the telechelic polymer, such as a sulfur-based curing agent when the functionality is olefinic unsaturation or an amino resin when the functionality is epoxidized olefin.

Abstract translation: 压力结构或密封剂组合物包含（a）15至95重量％的遥爪聚合物，例如缩水甘油醚官能遥爪聚合物和5至85重量％的异炔基聚二烯嵌段聚合物，其中至少一个 功能与遥爪聚合物的功能相同，例如具有缩水甘油醚和另一官能团如烯属不饱和键或环氧化烯烃的杂多炔类聚二烯嵌段聚合物; 和（b）双重固化体系，其中一种固化剂固化脱氧缩醛聚合物和杂多烯聚二烯嵌段聚合物如脂肪族多胺的共同官能团，而另一种固化剂固化在异金属聚二烯嵌段聚合物上的其它官能团，但不 在官能度为烯属不饱和度时固化遥爪聚合物（例如硫基固化剂）或官能度为环氧化烯烃时的氨基树脂所需的条件下固化。

公开(公告)号：US5869568A

公开(公告)日：1999-02-09

申请号：US969086

申请日：1997-11-12

Applicant: Norihisa Maeda

Inventor： Norihisa Maeda

IPC: C08L101/02 ,  C08F2/44 ,  C08F265/00 ,  C08F265/04 ,  C08L33/06 ,  C08L51/00 ,  C08L51/06 ,  C09D133/06 ,  C09D151/00 ,  C09D151/06 ,  C09D163/00 ,  C09D201/02 ,  C09J133/06 ,  C09J151/06 ,  C09J201/02 ,  C08L29/04 ,  C08F8/00

CPC classification number: C09D151/00 ,  C08F265/04 ,  C08L33/068 ,  C08L51/00 ,  C09D133/068 ,  C09D163/00 ,  C09J133/068 ,  C08L33/064

Abstract: A one-part cold crosslinking emulsion composition containing, in an aqueous medium, a double-structure fine grain comprising the following Component (A) 1 and the following Component (B) 2 covering the same, wherein the following Component (C) is contained in Component (B) 2:(A) a copolymer comprising an epoxy group-containing monomer and an ethylenic unsaturated monomer;(B) a copolymer comprising an unsaturated carboxylic acid and an ethylenic unsaturated monomer; and(C) a low molecular weight monofunctional epoxy compound.

Abstract translation: 在水性介质中含有包含以下组分（A）1和下述组分（B）2的双结构细晶粒的单组分冷交联乳液组合物，其中包含以下组分（C） 组分（B）2：（A）包含含环氧基的单体和烯属不饱和单体的共聚物; （B）包含不饱和羧酸和烯属不饱和单体的共聚物; 和（C）低分子量单官能环氧化合物。

公开(公告)号：US5721318A

公开(公告)日：1998-02-24

申请号：US631759

申请日：1996-04-12

Applicant: David John St. Clair ,  James Robert Erickson

Inventor： David John St. Clair ,  James Robert Erickson

IPC: C09K3/10 ,  C08G18/62 ,  C08G18/69 ,  C08G59/18 ,  C08G59/34 ,  C08J3/24 ,  C08L53/00 ,  C09J4/06 ,  C09J119/00 ,  C09J153/00 ,  C09J161/34 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J201/02 ,  C08L53/02 ,  C08L33/08 ,  C08L67/02

CPC classification number: C08G59/027 ,  C08G18/6208 ,  C08G18/69 ,  C08G18/698 ,  C08G59/18 ,  C08J3/243 ,  C09J119/006 ,  C09J163/00 ,  C09J163/08 ,  C09J175/04 ,  C09J4/06 ,  C08G2170/40 ,  C08G2190/00

Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality. The dual curing system preferably is comprised of an isocyanate curing agent to cure through the hydroxyl groups at ambient temperatures to form a pressure sensitive adhesive or sealant and an amino resin to cure through the epoxy functionality upon baking to form a structural adhesive or sealant.

Abstract translation: 压敏结构粘合剂和密封剂组合物，其包含：（a）包含95至15重量％的遥爪聚合物和5至85重量％的异丙炔基聚合物的聚合物体系，其中至少一个其上的官能团相同 作为遥爪聚合物上的功能，和（b）双重固化系统，其中固化体系的一个元素固化遥爪聚合物，并且杂多聚乙烯聚合物上的共同官能团固化，而另一个元素固化在异极性聚合物上的功能，但不固化 在固化遥爪聚合物以形成结构粘合剂或密封剂组合物所需的条件下。 在一个优选的实施方案中，聚合物体系由羟基官能的遥爪二醇或多元醇聚合物组成，并且所述聚异戊烯聚合物是也具有环氧化烯烃官能团的单羟基化聚二烯烃聚合物。 双重固化体系优选由异氰酸酯固化剂组成，以在环境温度下固化通过羟基，以形成压敏粘合剂或密封剂和氨基树脂，以在烘烤时通过环氧官能团固化以形成结构粘合剂或密封剂。

公开(公告)号：US5107069A

公开(公告)日：1992-04-21

申请号：US431029

申请日：1989-10-27

Applicant: Jurgen Wichelhaus ,  Johannes Andres ,  Serge Rebouillat ,  Werner Gruber

Inventor： Jurgen Wichelhaus ,  Johannes Andres ,  Serge Rebouillat ,  Werner Gruber

IPC: B05D7/14 ,  C08J5/12 ,  C09J4/00 ,  C09J5/02 ,  C09J177/00 ,  C09J201/02 ,  D06M13/02 ,  D06M13/07 ,  D06M13/144 ,  D06M13/184 ,  D06M13/203 ,  D06M13/224 ,  D06M13/41 ,  D06M15/59 ,  D06M15/592 ,  D06M101/00 ,  D06M101/16 ,  D06M101/30 ,  D06M101/34 ,  D06M101/36

CPC classification number: B05D7/14 ,  C08J5/124 ,  C09J5/02 ,  D06M13/203 ,  D06M13/41 ,  D06M15/592 ,  C09J2400/166 ,  C09J2400/228 ,  Y10T428/2938

Abstract: Described are heat-activatable promoters for treating the surfaces of metals or synthetic materials (plastics) prior to bonding, containingfrom 0.1 to 10% by weight of a carbonyl compound having at least one activated double bond,from 5 to 30% by weight of a polymer having functional groups,from 0 to 10% by weight of further auxiliary materials, as well asone or more organic solvent(s) to make 100% by weight.The invention further relates to a process for producing the heat-activatable adhesion promoter and the use thereof for the surface treatment of polymer fibers.

Abstract translation: 描述了用于在粘合之前处理金属或合成材料（塑料）表面的热激活助剂，其含有0.1至10重量％的具有至少一个活化双键的羰基化合物，5至30重量％ 具有官能团的聚合物，0至10重量％的其它辅助材料，以及一种或多种制备100重量％的有机溶剂。 本发明还涉及一种制备可热活化的粘合促进剂的方法及其用于聚合物纤维表面处理的用途。

公开(公告)号：US4791164A

公开(公告)日：1988-12-13

申请号：US829349

申请日：1986-02-13

Applicant: Juergen Wichelhaus ,  Werner Gruber ,  Johannes Andres

Inventor： Juergen Wichelhaus ,  Werner Gruber ,  Johannes Andres

IPC: C08L23/08 ,  C08L23/00 ,  C08L33/00 ,  C08L33/02 ,  C08L67/00 ,  C08L77/00 ,  C08L101/00 ,  C09J5/00 ,  C09J5/06 ,  C09J123/02 ,  C09J123/08 ,  C09J177/00 ,  C09J177/08 ,  C09J201/02 ,  C08L77/08

CPC classification number: C09J177/08 ,  C09J123/08

Abstract: A hotmelt adhesive comprising a compatible mixture of at least one polyamide based on dimeric fatty acid, and at least one copolymer or terpolymer based on ethylene, a method for manufacturing the same, and a method for using the same to adhere plastics and metals.

Abstract translation: 一种热熔粘合剂，其包含至少一种基于二聚脂肪酸的聚酰胺和至少一种基于乙烯的共聚物或三元共聚物的相容混合物，其制备方法及其用于粘附塑料和金属的方法。

公开(公告)号：US11512228B2

公开(公告)日：2022-11-29

申请号：US15747937

申请日：2016-07-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： James P. Endle ,  Frank T. Sher ,  Patrick J. Yeshe

IPC: C09J7/22 ,  C09J7/40 ,  C09J7/24 ,  C09J7/38 ,  C08L57/00 ,  C09J201/02 ,  C08F10/02

Abstract: An adhesive-backed film with an adhesive layer having thermoplastic or thermoset filaments partially projecting therefrom, to promote fluid egress and repositionability.