Abstract:
Circuitry and a method provide a plurality of timed control and bias voltages to sense amplifiers and write drivers of a spin-torque magnetoresistive random access memory array for improved power supply noise rejection, increased sensing speed with immunity for bank-to-bank noise coupling, and reduced leakage from off word line select devices in an active column.
Abstract:
The present disclosure is drawn to, among other things, a magnetoresistive memory. The magnetoresistive memory includes a first memory cell, a first access circuit, a second access circuit, and a current generating circuit. The first memory cell includes a first magnetic tunnel junction and a second magnetic tunnel junction. The first access circuit is configured to receive access command signals for accessing the first magnetic tunnel junction. The first access circuit includes a first access switch and a second access switch. The second access circuit is configured to receive access command signals for accessing the second magnetic tunnel junction. The second access circuit includes a third access switch and a fourth access switch. The current generating circuit is configured to generate a first write current through the first magnetic tunnel junction and generate a second write current through the second magnetic tunnel junction based on data input signals.
Abstract:
A memory device includes memory arrays configured to store pages of data organized into multiple ECC words. The memory device also includes at least one input/output pad for each ECC word associated with a page. The memory device is configurable to perform a first level of error correction on each of the ECC words associated with the page. A system-level error correction circuit is configurable to perform a second level of error correction on the data output by each of the input/output pads during a particular period of time. Each of the one or more input/output pads of the memory device is configurable to provide only one bit of data per ECC word to an external source during an access from an external source.
Abstract:
A cell bias control circuit maximizes the performance of devices in the read/write path of memory cells (magnetic tunnel junction device+transistor) without exceeding leakage current or reliability limits by automatically adjusting multiple control inputs of the read/write path at the memory array according to predefined profiles over supply voltage, temperature, and process corner variations by applying any specific reference parameter profiles to the memory array.
Abstract:
A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.
Abstract:
A technique for detecting tampering attempts directed at a memory device includes setting each of a plurality of detection memory cells to an initial predetermined state, where corresponding portions of the plurality of detection memory cells are included in each of the arrays of data storage memory cells on the memory device. A plurality of corresponding reference bits on the memory device permanently store information representative of the initial predetermined state of each of the detection memory elements. When a tamper detection check is performed, a comparison between the reference bits and the current state of the detection memory cells is used to determine whether any of the detection memory cells have changed state from their initial predetermined states. Based on the comparison, a tamper detect indication is flagged if a threshold level of change is determined. Once a tampering attempt is detected, responses on the memory device include disabling one or more memory operations, generating a mock current to emulate current expected during normal operation, and erasing data stored on the memory device.
Abstract:
In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.
Abstract:
In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on whether the majority of bits are set to a high state or a low state. For instance, the memory device may be configured to set each bit in the memory array to a low state when the data is read. The memory device may then be configured to store the data in the original state when a majority of the bits to be written to the array are in the low state and in the inverted state when the majority of the bits to be written to the array are in the high state.
Abstract:
Circuits and methods for driving generating multiple word line voltages used for writing to two-transistor two-magnetic tunnel junction (2T2MTJ) spin-torque magnetic random access memory (MRAM) cells. Some embodiments include auto-booting isolated word lines using common lines such as bit and source lines that are capacitively coupled to the word lines. Different memory architectures for 2T2MTJ memory arrays are also presented that include read/write circuits and word line drivers.
Abstract:
A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.