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111.发明授权Light emitting device having opening for extracting light and method for manufacturing light emitting device having opening for extracting light 有权具有用于提取光的开口的发光器件和具有用于提取光的开口的发光器件的制造方法公开(公告)号：US09425367B2
公开(公告)日：2016-08-23
申请号：US14802317
申请日：2015-07-17
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi , Takuya Nakabayashi
CPC classification number: H01L33/502 , H01L25/0753 , H01L25/0756 , H01L25/50 , H01L33/005 , H01L33/08 , H01L33/10 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2924/00
Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.
Abstract translation: 发光装置包括倒装芯片安装型发光元件，含荧光体的构件和第一反射构件。 倒装芯片安装型发光元件具有设置在底面侧的一对电极。 含荧光体的构件至少设置在发光元件的上方并与发光元件分离。 第一反射部件被构造成覆盖含荧光体的部件。 开口处在发光装置的侧面中的至少一个面上，从发光元件发射的开口提取光和由含荧光体的构件转换波长的光。
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公开(公告)号：US09232655B2
公开(公告)日：2016-01-05
申请号：US14582282
申请日：2014-12-24
Applicant: NICHIA CORPORATION
Inventor： Takuya Nakabayashi , Hiroto Tamaki
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.
Abstract translation: 在包括含有银的导电构件的布线基板中抑制了变色。 布线基板包括陶瓷层和包括设置在陶瓷层的上表面上的导电层的导电构件。 导电构件包括银，并且导电层的上表面的至少一部分被覆盖层覆盖。 覆盖层包括层叠在无机反射层上的无机反射层和玻璃层。
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113.发明申请公开(公告)号：US20150325756A1
公开(公告)日：2015-11-12
申请号：US14802317
申请日：2015-07-17
Applicant: NICHIA CORPORATION
Inventor： Tadao Hayashi , Takuya Nakabayashi
CPC classification number: H01L33/502 , H01L25/0753 , H01L25/0756 , H01L25/50 , H01L33/005 , H01L33/08 , H01L33/10 , H01L33/50 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2924/00
Abstract: A light emitting device includes a flip-chip mounted type light emitting element, a phosphor-containing member, and a first reflecting member. The flip-chip mounted type light emitting element has a pair of electrodes disposed on a bottom surface side. The phosphor-containing member is provided at least above the light emitting element and separated from the light emitting element. The first reflecting member is configured to cover the phosphor-containing member. An opening is in at least one of side faces of the light emitting device, the opening extracting light emitted from the light emitting element and light whose wavelength is converted by the phosphor-containing member.
Abstract translation: 发光装置包括倒装芯片安装型发光元件，含荧光体的构件和第一反射构件。 倒装芯片安装型发光元件具有设置在底面侧的一对电极。 含荧光体的构件至少设置在发光元件的上方并与发光元件分离。 第一反射部件被构造成覆盖含荧光体的部件。 开口处在发光装置的侧面中的至少一个面上，从发光元件发射的开口提取光和由含荧光体的构件转换波长的光。
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公开(公告)号：USD728491S1
公开(公告)日：2015-05-05
申请号：US29457409
申请日：2013-06-10
Applicant: Nichia Corporation
Designer： Takuya Nakabayashi , Masaki Hayashi , Daisuke Kishikawa
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