公开(公告)号：US20110186103A1

公开(公告)日：2011-08-04

申请号：US13017965

申请日：2011-01-31

申请人： Hiroyuki KOBAYASHI ,  Toshiaki Fukunaga ,  Shinya Suzuki

发明人： Hiroyuki KOBAYASHI ,  Toshiaki Fukunaga ,  Shinya Suzuki

IPC分类号： H01L31/042 ,  H01L31/0216 ,  H01L31/0224

CPC分类号： H01L31/03928 ,  H01L31/02008 ,  H01L31/046 ,  Y02E10/541 ,  Y02P70/521

摘要： A photoelectric conversion element includes a substrate with an insulation layer having a metallic substrate and an electrical insulation layer formed on a surface of the metallic substrate, a diffusion prevention layer formed on the electrical insulation layer, an alkali supply layer being electrically conductive and formed on the diffusion prevention layer, a lower electrode formed on the alkali supply layer, a photoelectric conversion layer comprising a compound semiconductor layer and formed on the lower electrode, and an upper electrode formed on the photoelectric conversion layer. The diffusion prevention layer prevents at least diffusion of alkali metal from the alkali supply layer to the substrate with the insulation layer.

摘要翻译： 一种光电转换元件包括具有金属基板的绝缘层和形成在金属基板的表面上的电绝缘层的基板，形成在电绝缘层上的扩散防止层，碱性供应层导电并形成在 扩散防止层，形成在碱性供电层上的下电极，形成在下电极上的化合物半导体层的光电转换层和形成在光电转换层上的上电极。 扩散防止层至少防止碱金属从碱性供应层到具有绝缘层的基板的扩散。

公开(公告)号：US07969541B2

公开(公告)日：2011-06-28

申请号：US12564505

申请日：2009-09-22

申请人： Kentaro Okuyama ,  Hitoshi Katakura ,  Kei Obata ,  Jun Shimizu ,  Shinya Suzuki ,  Mitsunari Hoshi ,  Junichi Inoue ,  Akito Kuriyama

发明人： Kentaro Okuyama ,  Hitoshi Katakura ,  Kei Obata ,  Jun Shimizu ,  Shinya Suzuki ,  Mitsunari Hoshi ,  Junichi Inoue ,  Akito Kuriyama

IPC分类号： G02F1/1335 ,  G02F1/1339

CPC分类号： G02B5/3083 ,  B29D11/00644 ,  B32B2457/20 ,  B32B2457/204 ,  G02B5/045 ,  G02F1/133555 ,  G02F1/133636 ,  G02F2001/133631 ,  G02F2001/133638 ,  G02F2202/023 ,  G02F2413/02 ,  G02F2413/05 ,  G02F2413/11

摘要： A retardation film which is manufacturable by a simple process, and being capable of preventing a decline in light use efficiency is provided. A retardation film includes: a substrate having a plurality of grooves extending in a specific direction on a surface thereof; and a retardation layer arranged in contact with the surface of the substrate, and including a liquid crystal material, the liquid crystal material being aligned along the extending direction of the plurality of grooves and being polymerized.

摘要翻译： 提供了可以通过简单的工艺制造并且能够防止光利用效率下降的延迟膜。 延迟膜包括：具有在其表面上沿特定方向延伸的多个槽的基板; 以及延迟层，与所述基板的表面接触，并且包括液晶材料，所述液晶材料沿着所述多个槽的延伸方向排列并聚合。

公开(公告)号：US07941083B2

公开(公告)日：2011-05-10

申请号：US12718082

申请日：2010-03-05

申请人： Shinya Suzuki

发明人： Shinya Suzuki

IPC分类号： G03G15/01

CPC分类号： G03G15/5033 ,  G03G15/5058 ,  G03G2215/0119

摘要： An image forming method includes forming toner images on first and second image bearing members; transferring a first toner image on the first image bearing member and a second toner image on the second image bearing member, in mutually superposed manner, onto a recording material; heating the first and second toner image thereby fixing the same to the recording material; detecting alignment marks on the first and second image bearing members in the course of a continuous job for continuously forming images; controlling relative positions of the first toner image and the second toner image, based on a result of detection of the alignment marks; and increasing a frequency of execution of the relative position control in the continuous job, as the recording material to be subjected to image formation in the continuous job has a smaller width in a direction perpendicular to a transport direction of the recording material.

摘要翻译： 图像形成方法包括在第一和第二图像承载部件上形成调色剂图像; 将第一图像承载部件上的第一调色剂图像和第二图像承载部件上的第二调色剂图像以相互叠加的方式转印到记录材料上; 加热第一和第二调色剂图像，从而将其固定到记录材料上; 在连续工作的过程中检测第一和第二图像承载部件上的对准标记，以连续地形成图像; 基于对准标记的检测结果控制第一调色剂图像和第二调色剂图像的相对位置; 并且由于在连续作业中要进行图像形成的记录材料在与记录材料的传送方向垂直的方向上具有较小的宽度，因此在连续作业中增加执行相对位置控制的频率。

公开(公告)号：US20110031850A1

公开(公告)日：2011-02-10

申请号：US12819569

申请日：2010-06-21

申请人： Takahiro Nakamura ,  Kazuhiro Nakamura ,  Takehide Nakamura ,  Shinya Suzuki

发明人： Takahiro Nakamura ,  Kazuhiro Nakamura ,  Takehide Nakamura ,  Shinya Suzuki

IPC分类号： H02K11/00 ,  H02K15/00

CPC分类号： H02K29/12 ,  H02K5/225 ,  H02K2211/03 ,  Y10T29/49009

摘要： A motor is provided with a rotation detector including a detection rotor and a detection stator placed to face the detection rotor. The motor further includes a motor case and a motor shaft protruding out of the motor case. The detection rotor is fixed to an end of the motor shaft. The detection rotor includes a plate and a coil provided on the plate. The plate is fixed to the end of the motor shaft. Specifically, the motor shaft includes an opening in the end. The plate has a circular disc shape and a cylindrical portion protruding in the center from the back side. The cylindrical portion is press-fitted in the opening of the motor shaft to fix the plate to the end of the motor shaft.

摘要翻译： 电动机设置有旋转检测器，其包括检测转子和放置成面对检测转子的检测定子。 电动机还包括电动机壳体和从电动机壳体伸出的电动机轴。 检测转子固定在电机轴的一端。 检测转子包括设置在板上的板和线圈。 板固定在电机轴的端部。 具体地说，电动机轴包括一端部的开口。 该板具有圆盘形状和从后侧突出于中心的圆柱形部分。 将圆筒部分压配合在电动机轴的开口中，以将板固定到电动机轴的端部。

公开(公告)号：US07766385B2

公开(公告)日：2010-08-03

申请号：US11990911

申请日：2006-08-28

申请人： Osamu Fukawatase ,  Seiji Yamada ,  Kenichi Takenaka ,  Shinya Suzuki ,  Satoru Hirai

发明人： Osamu Fukawatase ,  Seiji Yamada ,  Kenichi Takenaka ,  Shinya Suzuki ,  Satoru Hirai

IPC分类号： B60R21/16

CPC分类号： B60R21/233 ,  B60R21/2338 ,  B60R21/2346 ,  B60R2021/23324 ,  B60R2021/23382

摘要： A passenger-seat airbag (32) includes a left airbag (44), a right airbag (46), and a root portion (48). A strap (70) is provided in the root portion (48) that is inflated by gas injected from an inflator (28) when a passenger-seat airbag device (10) operates. The strap (70) connects the base-end portion (48B) of the root portion (48) to a connection root portion (48C). Further, the strap (70) is provided such that a peripheral length (L2) on a front side is longer than or equal to a peripheral length (L1) on a rear side in a lateral view showing the inflated root portion (48).

摘要翻译： 乘客座位安全气囊（32）包括左安全气囊（44），右安全气囊（46）和根部部分（48）。 在乘客座椅安全气囊装置（10）工作时，在根部（48）上设置有由充气机（28）喷射的气体充气的带（70）。 带（70）将根部（48）的基端部（48B）与连接根部（48C）连接。 此外，带子（70）设置成使得前侧的周长（L2）在表示膨胀的根部（48）的侧视图中在后侧的周长（L1）长于或等于圆周长度（L1）。

公开(公告)号：US20100163172A1

公开(公告)日：2010-07-01

申请号：US12647771

申请日：2009-12-28

申请人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/00

CPC分类号： B32B38/0008 ,  B32B37/02 ,  B32B2457/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/095 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface activation step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface activation step, a surface of the resin layer is activated by means of plasma treatment, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面活化步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面活化步骤中，树脂层的表面通过等离子体处理，在固定步骤之后，但在绝缘层形成步骤之前被激活。

公开(公告)号：US07728442B2

公开(公告)日：2010-06-01

申请号：US11953068

申请日：2007-12-09

申请人： Akihiko Yoshioka ,  Shinya Suzuki

发明人： Akihiko Yoshioka ,  Shinya Suzuki

IPC分类号： H01L23/48 ,  H01L29/40

CPC分类号： H01L27/124 ,  G02F1/13452 ,  H01L21/50 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/485 ,  H01L23/522 ,  H01L24/11 ,  H01L24/13 ,  H01L24/83 ,  H01L2021/60232 ,  H01L2021/60262 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14104 ,  H01L2224/16105 ,  H01L2224/29075 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45124 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/48

摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

摘要翻译： 一种允许减小半导体芯片尺寸的半导体器件制造技术。 首先，在绝缘膜上形成焊盘和其它电线。 在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。 开口位于垫上并露出垫的表面。 在包括开口的表面保护膜之上形成凸起电极。 这里，焊盘小于凸块电极。 因此，电线布置在与焊盘10相同的层中的突起电极正下方。换句话说，导线布置在可用的空间中，因为焊盘足够小。

公开(公告)号：US07538430B2

公开(公告)日：2009-05-26

申请号：US11953055

申请日：2007-12-09

申请人： Akihiko Yoshioka ,  Shinya Suzuki

发明人： Akihiko Yoshioka ,  Shinya Suzuki

IPC分类号： H01L29/40

CPC分类号： H01L27/124 ,  G02F1/13452 ,  H01L21/50 ,  H01L23/3157 ,  H01L23/48 ,  H01L23/485 ,  H01L23/522 ,  H01L24/11 ,  H01L24/13 ,  H01L24/83 ,  H01L2021/60232 ,  H01L2021/60262 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14104 ,  H01L2224/16105 ,  H01L2224/29075 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45124 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/48

摘要： A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating film. A surface protective film is formed over the insulating film including the pad and wires, and an opening is made in the surface protective film. The opening lies over the pad and exposes a surface of the pad. A bump electrode is formed over the surface protective film including the opening. Here, the pad is smaller than the bump electrode. Consequently, the wires are arranged just beneath the bump electrode in the same layer as the pad 10. In other words, the wires are arranged in space which becomes available because the pad is small enough.

摘要翻译： 一种允许减小半导体芯片尺寸的半导体器件制造技术。 首先，在绝缘膜上形成焊盘和其它电线。 在包括焊盘和电线的绝缘膜上形成表面保护膜，并且在表面保护膜中形成开口。 开口位于垫上并露出垫的表面。 在包括开口的表面保护膜之上形成凸起电极。 这里，焊盘小于凸块电极。 因此，电线布置在与焊盘10相同的层中的突起电极正下方。换句话说，导线布置在可用的空间中，因为焊盘足够小。

公开(公告)号：US20090123017A1

公开(公告)日：2009-05-14

申请号：US12267202

申请日：2008-11-07

申请人： Shinya Suzuki ,  Shouji Suzuki

发明人： Shinya Suzuki ,  Shouji Suzuki

IPC分类号： H05K7/00 ,  H04R1/02

CPC分类号： H05K3/325 ,  H04R1/021 ,  H04R1/06 ,  H04R31/006 ,  H04R2201/34 ,  H04R2400/11 ,  H05K3/301 ,  H05K2201/10083 ,  H05K2201/10265 ,  H05K2201/2018

摘要： To provide an electronic component, an electronic component unit, a speaker, and a mobile terminal including the speaker which can realize the stable electrical conduction. An electronic component includes a frame, an electric circuit which is provided on the frame, a coil spring which is electrically connected to the electric circuit, and a rib which is provided on the frame and is inserted into the coil spring.

摘要翻译： 提供一种电子部件，电子部件单元，扬声器以及包括能够实现稳定导电的扬声器的移动终端。 电子部件包括框架，设置在框架上的电路，电连接到电路的螺旋弹簧和设置在框架上并插入到螺旋弹簧中的肋。

公开(公告)号：US07475234B2

公开(公告)日：2009-01-06

申请号：US11054314

申请日：2005-02-10

申请人： Shinya Suzuki

发明人： Shinya Suzuki

IPC分类号： G06F9/00

CPC分类号： F02D41/22 ,  F02D41/042 ,  F02D41/26 ,  F02M25/0809

摘要： An electronic control apparatus is provided which is equipped with a timer-activated function and a timer diagnosis function. The apparatus is designed to retain the fact that a host microcomputer has been activated upon expiry of time measured by a timer as a history record in the timer. This improves the reliability of diagnosing a malfunction of the timer.

摘要翻译： 提供了具有定时器激活功能和定时器诊断功能的电子控制装置。 该设备被设计成保持主计算机在计时器测量的时间到期后被激活，作为定时器中的历史记录。 这提高了诊断定时器故障的可靠性。