公开(公告)号：US06561044B1

公开(公告)日：2003-05-13

申请号：US09531612

申请日：2000-03-21

Applicant: Tongbi Jiang ,  Zhigiang Wu

Inventor： Tongbi Jiang ,  Zhigiang Wu

IPC: G01L516

CPC classification number: G01L1/205

Abstract: A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance measuring circuit.

Abstract translation: 公开了一种高分辨率压力感测装置。 该装置包括具有多个填料颗粒的绝缘柔性基质。 对矩阵施加力会导致矩阵的压缩。 这导致在没有施加力的情况下，填料颗粒在基质内占据更大量的空间。 连接到基体的检测器检测或测量填料颗粒相对于基体体积的体积，因此确定施加到基质上的力。 优选地，基质的电阻率与填料颗粒的体积百分比成反比，在这种情况下，检测器是电阻测量电路。

公开(公告)号：US06551863B2

公开(公告)日：2003-04-22

申请号：US09943481

申请日：2001-08-30

Applicant: Farrah J. Johnson ,  Tongbi Jiang

Inventor： Farrah J. Johnson ,  Tongbi Jiang

IPC: H01L2144

CPC classification number: H01L21/56 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.

公开(公告)号：US06524891B1

公开(公告)日：2003-02-25

申请号：US09515579

申请日：2000-02-29

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01L2144

CPC classification number: H01L23/4951 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of curing adhesives of a die attach material to reduce the formation of voids at the resulting bondline, defined by the interface between the adhesive and the surface of a die being attached. The method includes applying a relatively high pressure, in addition to a relatively high temperature, to cure the adhesive material.

公开(公告)号：US06521287B2

公开(公告)日：2003-02-18

申请号：US09513939

申请日：2000-02-28

Applicant: Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

Inventor： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC: B05D132

CPC classification number: B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract translation: 公开了一种用于改进模板/丝网印刷质量的方法和装置。 在片上（LOC）包装过程中，模板或屏幕有助于将可印刷材料施加到基底上，例如对半导体晶片的半导体管芯的粘合剂。 在一个实施例中，模板包括施加到模板或筛网的图案的至少一个表面上的涂层，以阻止可印刷材料运动到表面上。 在另一个实施例中，模板或丝网包括施加到图案的至少一个其他表面的第二涂层，以促进可印刷材料在基底上的铺展。

公开(公告)号：US06501170B1

公开(公告)日：2002-12-31

申请号：US09591144

申请日：2000-06-09

Applicant: Brenton L. Dickey ,  Tongbi Jiang

Inventor： Brenton L. Dickey ,  Tongbi Jiang

IPC: H01L2314

CPC classification number: H01L24/32 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.

Abstract translation: 一种用于将衬底的背面粘附到具有插入其间的粘合带的至少一个半导体管芯的有源表面的装置和方法。 在衬底的背面和至少一个半导体管芯的有源表面中的至少一个上提供润湿剂层。 当加热基底时，润湿剂层与粘合带上的粘合剂相互作用，使得基底粘合到至少一个半导体管芯上。 润湿剂层的相互作用允许粘合带在比常规粘合方法更低的温度下粘合到其上，更重要的是增强粘附力。

公开(公告)号：US06492713B2

公开(公告)日：2002-12-10

申请号：US09849812

申请日：2001-05-04

Applicant: Tongbi Jiang ,  Syed S. Ahmad

Inventor： Tongbi Jiang ,  Syed S. Ahmad

IPC: H01L23495

CPC classification number: H01L24/12 ,  H01L21/56 ,  H01L23/24 ,  H01L23/4951 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/83191 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/095 ,  H05K3/12 ,  H05K3/305 ,  H05K3/321 ,  H05K2203/1563 ,  H05K2203/159 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and maintaining the inverted orientation until the viscous material dries or cures enough to maintain definition of its perimeter and edge characteristics.

公开(公告)号：US06485778B1

公开(公告)日：2002-11-26

申请号：US09531551

申请日：2000-03-20

Applicant: Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

Inventor： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC: B05D512

CPC classification number: H01L24/06 ,  H01L21/67132 ,  H01L23/4951 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method and apparatus for achieving a level exposed surface of an adhesive material pool for applying the adhesive material to lead fingers of a lead frame by contacting the lead fingers with the adhesive material pool within an adhesive reservoir. The level adhesive material exposed surface is achieved by attaching a coating stencil having small apertures, such as a screen or a plate with slots, to the adhesive reservoir, such that the only upward outlet for the adhesive material is through the apertures in the coating stencil. The surface tension between walls of the small apertures and the adhesive material flattens out the exposed surface of the adhesive material. This allows a larger area to be printed with a more uniform thickness layer.

Abstract translation: 一种用于实现粘合剂材料池的水平暴露表面的方法和装置，用于通过使引线指与粘合剂储存器内的粘合剂材料池接触来将粘合剂材料施加到引线框架的引线指状件。 水平粘合剂材料暴露表面通过将具有小孔的涂层模板（例如屏幕或具有狭缝的板）附接到粘合剂储存器来实现，使得用于粘合剂材料的唯一向上的出口通过涂布模板中的孔 。 小孔的壁和粘合剂材料的表面张力使粘合剂材料的暴露表面平坦化。 这允许用更均匀的厚度层印刷较大的面积。

公开(公告)号：US06368897B1

公开(公告)日：2002-04-09

申请号：US09513935

申请日：2000-02-28

Applicant: Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

Inventor： Tongbi Jiang ,  Chad A. Cobbley ,  John VanNortwick

IPC: B41N124

CPC classification number: B41C1/14 ,  B41N1/242 ,  H01L2224/4826 ,  H05K3/1225 ,  Y10S438/945

Abstract: A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.

Abstract translation: 公开了一种用于改进模板/丝网印刷质量的方法和装置。 在片上（LOC）包装过程中，模板或屏幕有助于将可印刷材料施加到基底上，例如对半导体晶片的半导体管芯的粘合剂。 在一个实施例中，模板包括施加到模板或筛网的图案的至少一个表面上的涂层，以阻止可印刷材料运动到表面上。 在另一个实施例中，模板或丝网包括施加到图案的至少一个其他表面的第二涂层，以促进可印刷材料在基底上的铺展。

公开(公告)号：US06365842B1

公开(公告)日：2002-04-02

申请号：US09679336

申请日：2000-10-04

Applicant: Tongbi Jiang

Inventor： Tongbi Jiang

IPC: H01R1204

CPC classification number: H01L24/83 ,  H01L24/16 ,  H01L24/28 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/81141 ,  H01L2224/81903 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01R4/04 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The present invention includes electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive. In one embodiment, an electrical interconnection configured to electrically couple a first substrate and a second substrate includes: a bond pad of the first substrate having a male configuration; and a bond pad of the second substrate having a female configuration, the bond pad of the second substrate being configured to mate with the bond pad of the first substrate during electrical connection of the bond pads of the first substrate and the second substrate. A method of conducting electricity according to the present invention includes providing first and second bond pads individually defining a planar dimension; coupling the first and second bond pads at an interface having a surface area greater than the area of the planar dimension; and conducting electricity between the first and second bond pads following the coupling.

Abstract translation: 本发明包括电互连，导电方法以及降低各向异性导电粘合剂内水平电导率的方法。 在一个实施例中，配置成电耦合第一衬底和第二衬底的电互连包括：具有阳构造的第一衬底的接合焊盘; 以及具有凹形结构的所述第二基板的接合焊盘，所述第二基板的接合焊盘被配置为在所述第一基板和所述第二基板的接合焊盘的电连接期间与所述第一基板的接合焊盘配合。 根据本发明的导电方法包括提供单独限定平面尺寸的第一和第二接合焊盘; 在具有大于所述平面尺寸的面积的表面积的界面处耦合所述第一和第二接合焊盘; 并且在耦合之后在第一和第二接合焊盘之间传导电力。

公开(公告)号：US06346152B1

公开(公告)日：2002-02-12

申请号：US09405943

申请日：1999-09-27

Applicant: Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

Inventor： Walter L. Moden ,  Syed S. Ahmad ,  Gregory M. Chapman ,  Tongbi Jiang

IPC: B05C300

CPC classification number: H01L24/27 ,  H01L23/4951 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/743 ,  H01L2224/7565 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.

Abstract translation: 一种将粘性材料施加到引线框架元件的方法。 本发明的一种方法包括将引线框架朝下定位并使引线指与一块粘合剂材料接触。 引线指与粘合剂材料的接触导致引线指的一部分从粘合剂材料池接收粘合材料的一部分。 面向下的引线框架上的粘合剂材料上的重力保持粘合剂材料的形状和边界限定。