公开(公告)号：US09385153B2

公开(公告)日：2016-07-05

申请号：US14740468

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L27/00 ,  H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48095 ,  H01L2224/73265

Abstract: An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface.

Abstract translation: 图像传感器装置可以包括具有延伸穿过其中的开口的互连层，在开口内的图像传感器IC，并且具有图像感测表面，以及与图像感测表面对准的IR滤光器。 图像传感器装置可以包括横向围绕图像传感器IC并填充开口的封装材料，以及耦合到与图像感测表面相对的互连层的柔性互连层。

公开(公告)号：US20160099373A1

公开(公告)日：2016-04-07

申请号：US14968359

申请日：2015-12-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/0232 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

Abstract translation: 光学检测传感器用作包括光学系统和选择性透射结构的接近检测传感器。 诸如激光的电磁辐射可以通过选择性透射结构的透射部分发射。 可以检测反射光束以确定物体的存在。 传感器通过将透射结构封装在第一密封体中并将光学系统封装在第二密封体内而形成。 然后将第一和第二密封剂体接合在一起。 在晶片规模中组装由连接的密封体产生的结构被切割以形成光学检测传感器。

公开(公告)号：US09257423B2

公开(公告)日：2016-02-09

申请号：US14090673

申请日：2013-11-26

Applicant: STMicroelectronics Pte. Ltd.

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L27/06 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成电子器件。 导电材料沉积在聚酰亚胺上并图案化以形成电极和信号迹线。 电子器件的剩余部分形成在聚酰亚胺上。 然后在第一聚酰亚胺层上形成第二聚酰亚胺层。 然后去除玻璃基板，暴露电极和电子设备的顶表面。

公开(公告)号：US09105766B2

公开(公告)日：2015-08-11

申请号：US13845445

申请日：2013-03-18

Applicant: STMicroelectronics (Grenoble 2) SAS ,  STMicroelectronics Pte Ltd

Inventor： Romain Coffy ,  Eric Saugier ,  Hk Looi ,  Norbert Chevrier

IPC: H01L33/48 ,  H01L31/0203 ,  H01L31/18 ,  G01S17/02 ,  H01L25/16 ,  H03K17/94 ,  G01S7/481 ,  H03K17/945

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S17/026 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94026 ,  H03K2217/94112 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical electronic package includes transmitting chip and a receiving chip fixed to a wafer. A transparent encapsulation structure is formed by a transparent plate and a transparent encapsulation block that are formed over the transmitter chip and at least a portion of the receiver chip, with the transparent encapsulation block embedding the transmitter chip. An opaque encapsulation block extends over the transparent plate and includes an opening that reveals a front area of the transparent plate. The front area is situated above an optical transmitter of the transmitting chip and is offset laterally relative to an optical sensor of the receiving chip.

Abstract translation: 光学电子封装包括固定到晶片的透射芯片和接收芯片。 透明封装结构由形成在发射机芯片和接收芯片的至少一部分上的透明板和透明封装块形成，透明封装块嵌入发射器芯片。 不透明的封装块在透明板上延伸并且包括露出透明板的前部区域的开口。 前部区域位于发射芯片的光发射机之上，相对于接收芯片的光学传感器横向偏移。

公开(公告)号：US09091924B2

公开(公告)日：2015-07-28

申请号：US13625210

申请日：2012-09-24

Applicant: STMicroelectronics Pte Ltd.

Inventor： Gino George ,  KeenYip Koh ,  CheeChiang Lee ,  Ditto Adnan

IPC: G01F7/00 ,  G03F7/16 ,  H01L21/67

CPC classification number: G03F7/16 ,  H01L21/6715

Abstract: A photoresist delivery system includes a photoresist pump, a photoresist reservoir coupled to the photoresist pump, and a photoresist container. A control valve is between the photoresist reservoir and the photoresist container and is movable from a closed position to an open position upon engagement of the photoresist container with the photoresist reservoir to replenish photoresist therein.

Abstract translation: 光致抗蚀剂传输系统包括光致抗蚀剂泵，耦合到光致抗蚀剂泵的光致抗蚀剂储存器和光致抗蚀剂容器。 控制阀位于光致抗蚀剂储存器和光致抗蚀剂容器之间，并且在光致抗蚀剂容器与光致抗蚀剂储存器接合时能够从关闭位置移动到打开位置，以补充其中的光致抗蚀剂。

公开(公告)号：US09059058B2

公开(公告)日：2015-06-16

申请号：US13656912

申请日：2012-10-22

Applicant: STMICROELECTRONICS ASIA PACIFIC PTE LTD (SINGAPORE)

Inventor： Jerome Teysseyre ,  Yonggang Jin

IPC: H01L27/146 ,  H01L31/18

CPC classification number: H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2924/12042 ,  H01L2924/00

Abstract: An image sensor device may include a bottom interconnect layer, an image sensing IC above the bottom interconnect layer and coupled thereto, and an adhesive material on the image sensing IC. The image sensor device may include an IR filter layer above the lens layer, and an encapsulation material on the bottom interconnect layer and surrounding the image sensing IC, the lens layer, and the IR filter layer. The image sensor device may include a top contact layer above the encapsulation material and including a dielectric layer, and a contact thereon, the dielectric layer being flush with adjacent portions of the IR filter layer.

Abstract translation: 图像传感器装置可以包括底部互连层，在底部互连层上方并耦合到其上的图像感测IC以及图像感测IC上的粘合剂材料。 图像传感器装置可以包括在透镜层上方的IR滤光层，以及在底部互连层上的包围材料，并围绕图像感测IC，透镜层和IR滤光层。 图像传感器装置可以包括在封装材料上方的顶部接触层，并且包括介电层及其上的接触件，该介电层与IR滤光器层的相邻部分齐平。

公开(公告)号：US20150140479A1

公开(公告)日：2015-05-21

申请号：US14084773

申请日：2013-11-20

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Alan Lee ,  Xi Ge

IPC: G03F1/00 ,  G03F1/42 ,  G03F7/20

CPC classification number: G03F1/00 ,  G03F1/42 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/70425

Abstract: A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.

Abstract translation: 一种处理半导体晶片的方法可以包括提供包括不同掩模图像的可旋转对准的光刻掩模。 每个掩模图像可以在相应的不同的掩模扇区中。 该方法还可以包括使用相对于半导体晶片的不同旋转对准的可旋转对准的光刻掩模执行一系列曝光，使得不同的掩模图像产生至少一个工作半导体晶片扇区，以及至少一个非工作半导体晶片 部门。

公开(公告)号：US09013017B2

公开(公告)日：2015-04-21

申请号：US13651526

申请日：2012-10-15

Applicant: STMicroelectronics Asia Pacific Pte Ltd (Singapore)

Inventor： Yonggang Jin ,  Laurent Herard ,  WeeChinJudy Lim

IPC: H01L31/0232 ,  H01L31/0203

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14687 ,  H01L31/0232 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of making image sensor devices may include forming a sensor layer including image sensor ICs in an encapsulation material, bonding a spacer layer to the sensor layer, the spacer layer having openings therein and aligned with the image sensor ICs, and bonding a lens layer to the spacer layer, the lens layer including lens in an encapsulation material and aligned with the openings and the image sensor ICs. The method may also include dicing the bonded-together sensor, spacer and lens layers to provide the image sensor devices. Helpfully, the method may use WLP to enhance production.

Abstract translation: 制作图像传感器装置的方法可以包括在封装材料中形成包括图像传感器IC的传感器层，将间隔层粘合到传感器层，间隔层在其中具有开口并与图像传感器IC对准，并且将透镜层 到间隔层，透镜层包括在封装材料中并与开口对准的透镜和图像传感器IC。 该方法还可以包括切割结合在一起的传感器，间隔物和透镜层以提供图像传感器装置。 有利的是，该方法可以使用WLP来增强生产。

公开(公告)号：US09012269B2

公开(公告)日：2015-04-21

申请号：US13488276

申请日：2012-06-04

Applicant: Yonggang Jin ,  Xavier Baraton ,  Faxing Che

Inventor： Yonggang Jin ,  Xavier Baraton ,  Faxing Che

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

Abstract: Fan-out wafer level packaging includes an integrated circuit having a top surface, a bottom surface, a plurality of side surfaces, and a bond pad defined on the top surface. A layer of encapsulant substantially surrounds the side surfaces of the integrated circuit, the layer of encapsulant having a height substantially equal to a height of the integrated circuit. A bump is spaced apart from the integrated circuit, and a redistribution layer electrically couples the bond pad of the integrated circuit to the bump.

Abstract translation: 扇出晶片级封装包括具有顶表面，底表面，多个侧表面以及限定在顶表面上的接合焊盘的集成电路。 密封剂层基本上围绕集成电路的侧表面，密封剂层的高度基本上等于集成电路的高度。 凸块与集成电路间隔开，并且再分配层将集成电路的接合焊盘电耦合到凸块。

公开(公告)号：US20150103297A1

公开(公告)日：2015-04-16

申请号：US14050522

申请日：2013-10-10

Applicant: STMICROELECTRONICS PTE. LTD

Inventor： WeeChinJudy LIM ,  David Gani ,  Hk Looi ,  Bs Aw ,  Cheng-hai Cheh

IPC: G02F1/29 ,  B23K31/02 ,  B32B37/24 ,  B23K1/00

CPC classification number: G02F1/29 ,  B23K1/0016 ,  B23K2101/38 ,  G02F2001/294 ,  G02F2202/28 ,  Y10T156/10

Abstract: An optical assembly may include a substrate, a housing carried by the substrate and having at least one adhesive-receiving recess in an upper surface thereof, and a lens carried by the housing. The optical assembly may also include a liquid crystal focus cell adjacent the lens and including cell layers and pairs of electrically conductive contacts associated therewith. The optical assembly may also include at least one electrically conductive member within the at least one adhesive-receiving recess and coupling together each pair of the electrically conductive contacts, and an adhesive body in the at least one adhesive-receiving recess covering the at least one electrically conductive member.

Abstract translation: 光学组件可以包括衬底，由衬底承载的壳体，并且在其上表面中具有至少一个粘合剂容纳凹部，以及由壳体承载的透镜。 光学组件还可以包括与透镜相邻的液晶聚焦单元，并且包括与其相关联的单元层和导电触点对。 所述光学组件还可以包括至少一个导电构件，在所述至少一个粘合剂容纳凹部内并且将每对所述导电触点连接在一起，并且所述至少一个粘合剂容纳凹部中的粘合体覆盖所述至少一个 导电部件。