公开(公告)号：US20020151195A1

公开(公告)日：2002-10-17

申请号：US10147395

申请日：2002-05-16

Applicant: INCEP Technologies, Inc.

Inventor： Joseph Ted DiBene II ,  David H. Hartke

IPC: H05K001/00

CPC classification number: G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K7/20509 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for providing power from a first circuit board to a second circuit board is disclosed. The apparatus comprises a flex circuit having a plurality of conductive paths formed by a plurality of first conductive areas electrically coupled to a plurality of second conductive areas wherein the plurality of first conductive areas permanently and electrically coupled to a plurality of first circuit board conductive pads and the plurality of second conductive areas disconnectably and electrically coupleable to at least one second circuit board conductive pad.

Abstract translation: 公开了一种从第一电路板向第二电路板提供电力的方法和设备。 该装置包括柔性电路，该柔性电路具有由多个第一导电区域形成的多个导电路径，该多个第一导电区域电耦合到多个第二导电区域，其中多个第一导电区域永久并电耦合到多个第一电路板导电焊盘， 所述多个第二导电区域可拆卸地并且电连接到至少一个第二电路板导电焊盘。

公开(公告)号：US06448106B1

公开(公告)日：2002-09-10

申请号：US09437736

申请日：1999-11-09

Applicant: Wen-chou Vincent Wang ,  Thomas J. Massingill ,  Yasuhito Takahashi ,  Lei Zhang

Inventor： Wen-chou Vincent Wang ,  Thomas J. Massingill ,  Yasuhito Takahashi ,  Lei Zhang

IPC: H01L2144

CPC classification number: H01L21/568 ,  H01L21/4853 ,  H01L21/6835 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H05K1/0271 ,  H05K1/113 ,  H05K2201/10318 ,  H05K2201/1034 ,  H05K2201/10704 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Device modules with pins and methods for making device modules with pins are disclosed. One embodiment is directed to a method including forming a polymeric circuit structure having a first side and a second side on a substrate. The formed first side is adjacent to the substrate. A pin is bonded to the second side of the polymeric circuit structure. At least a portion of the substrate is removed to expose at least a portion of the first side of the polymeric circuit structure, and a device is mounted on the first side of the polymeric circuit structure.

Abstract translation: 公开了具有引脚的装置模块和用于制造具有引脚的装置模块的方法。 一个实施例涉及包括在基板上形成具有第一侧和第二侧的聚合物电路结构的方法。 形成的第一侧与基底相邻。 销被接合到聚合物电路结构的第二侧。 去除衬底的至少一部分以暴露聚合物电路结构的第一侧的至少一部分，并且将器件安装在聚合物电路结构的第一侧上。

公开(公告)号：US20020089833A1

公开(公告)日：2002-07-11

申请号：US10076893

申请日：2002-02-14

Applicant: Intel Corporation

Inventor： P.R. Patel ,  Yuan-Liang Li ,  David G. Figueroa ,  Shamala Chickamenahalli ,  Huong T. Do

IPC: H05K007/02 ,  H05K007/06

CPC classification number: H05K1/141 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0262 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  H01L2224/0401

Abstract: An interposer includes two separate sets of pins, and inserts into two sockets on a printed circuit board. One set of pins supplies power to a step down converter (SDC) mounted on the interposer. The second set of pins provide inputs and outputs to an integrated circuit mounted on the interposer. One or more conductive traces in or on the interposer electrically connect an output of the SDC to an input of the integrated circuit, thus supplying regulated power to the integrated circuit through the interposer. The SDC and integrated circuit can be directly mounted on the interposer, or either or both can be mounted on packages that connect to the interposer. The SDC and integrated circuit can be flip chips or can be connected to the interposer or package using wirebonds. The packages can be pinned or connectable by solder bumps.

公开(公告)号：US20020057554A1

公开(公告)日：2002-05-16

申请号：US09802329

申请日：2001-03-08

Inventor： Joseph T. Dibene II ,  David H. Hartke

IPC: H05K007/20

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2224/0401

Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.

公开(公告)号：US20020021556A1

公开(公告)日：2002-02-21

申请号：US09921153

申请日：2001-08-02

Inventor： Joseph T. Dibene II ,  Farhad Raiszadeh

IPC: H05K007/20

CPC classification number: H05K7/1092 ,  F28D15/0233 ,  F28D15/04 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.

Abstract translation: 公开了一种传热装置，其中蒸气室与引脚结构组合，其允许高导电冷却蒸汽在针阵列的引脚内流动，从而将散热器的两个部件的效率最大化为一个单元。 在一个实施例中，传热装置包括导热室，其具有第一导热室部分，其具有热耦合到散热装置的基座; 第二导热室部分，其具有多个中空突出部，其延伸远离第一导热室部分并且与第一导热室部分流体连通，其中导热室包括在与散热装置热连通时可蒸发的流体，并且当处于热通信时可冷凝 与中空的突起。

公开(公告)号：US20020008963A1

公开(公告)日：2002-01-24

申请号：US09818173

申请日：2001-03-26

Inventor： Joseph T. DiBene, II ,  David H. Hartke

IPC: H05K007/20

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2224/0401

Abstract: A modular circuit board assembly is disclosed. The modular circuit board assembly comprises a substrate, a circuit board, and a component, disposed between the circuit board and the substrate, the component physically and electrically coupled to the substrate. In one embodiment, the circuit board also comprises an aperture allowing for the transmission of thermal energy from the component to a heat sink. In still another embodiment of the invention, the heat sink includes a mesa having surface features cooperatively interacting with surface features on the component or members mounted on the component to provide for location and/or retention.

Abstract translation: 公开了一种模块化电路板组件。 模块化电路板组件包括设置在电路板和衬底之间的衬底，电路板和组件，该组件物理和电耦合到衬底。 在一个实施例中，电路板还包括允许将热能从组件传输到散热器的孔。 在本发明的另一个实施例中，散热器包括台面，其具有与安装在部件上的部件或部件上的表面特征协作地相互作用以提供位置和/或保持的表面特征。

公开(公告)号：US20010038527A1

公开(公告)日：2001-11-08

申请号：US09885780

申请日：2001-06-19

Applicant: INCEP Technologies, Inc.

Inventor： Joseph Ted DiBene II ,  David Hartke

IPC: H05K007/20

CPC classification number: H05K7/20509 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.

Abstract translation: 公开了封装电路组件和制造封装电路组件的方法。 组件包括第一印刷电路板，第二印刷电路板和传热装置。 第二印刷电路板包括散热器，并且传热装置连接在安装在第一印刷电路板上的装置和第二印刷电路板之间，用于将热量从装置转移到第二印刷电路板的散热片。

公开(公告)号：US20010032738A1

公开(公告)日：2001-10-25

申请号：US09785892

申请日：2001-02-16

Inventor： Joseph Ted Dibene II ,  David Hartke ,  Kaskade James Hjerpe ,  Carl E. Hoge

IPC: H05K001/14 ,  H05K007/20 ,  H05K007/12 ,  H05K009/00

CPC classification number: H01L23/433 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US06203356B1

公开(公告)日：2001-03-20

申请号：US09260282

申请日：1999-03-02

Applicant: Peter Thomsen

Inventor： Peter Thomsen

IPC: H01R1364

CPC classification number: H01R13/4538 ,  H01R12/7076 ,  H01R13/631 ,  H05K3/301 ,  H05K3/306 ,  H05K7/1076 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10704

Abstract: An apparatus having a thin metal frame has an opening and a protective rail on each end. Four guide posts extend from the lower surface of the frame to a plate which is spring-biased away from the frame. The plate has pin holes which are arrayed for a particular electrical component having contact pins. The component is loaded into the apparatus by extending the pins through the opening and into the pin holes in the plate. The rails may be flexed outward to accommodate the component before snapping onto and around the ends of the component to fix it from movement relative to the apparatus. The guide posts extend beyond the tips of the pins to provide stand-off protection. The tips of the guide posts are placed in a socket and the assembly is pressed into the socket until the pins seat in it. As the pins are inserted into the socket, the plate is pressed toward the frame to collapse the springs. The apparatus is left permanently installed with the component in the socket.

Abstract translation: 具有薄金属框架的装置在每一端具有开口和保护轨。 四个导柱从框架的下表面延伸到板，该板被弹簧偏压远离框架。 板具有针孔，其针对具有接触针的特定电气部件排列。 通过将销延伸穿过开口并进入板中的销孔，将部件装载到装置中。 轨道可以向外弯曲以容纳部件，然后卡在组件的端部上并围绕部件的端部固定，以使其相对于装置移动。 引导柱延伸超出引脚的尖端以提供对立保护。 导柱的尖端放置在插座中，组件被压入插座中，直到插针插入插座中。 当销插入插座时，将板压向框架以使弹簧折叠。 设备将组件永久性地安装在插座中。

公开(公告)号：US6083032A

公开(公告)日：2000-07-04

申请号：US45550

申请日：1998-03-20

Applicant: Bassel Hage Daoud

Inventor： Bassel Hage Daoud

IPC: H05K3/30 ,  H01R13/64

CPC classification number: H01R12/58 ,  H05K3/306 ,  H05K2201/10424 ,  H05K2201/10704 ,  H05K2203/0195

Abstract: An adjustment fixture for aligning pins on a protector panel to facilitate insertion of a printed wiring board thereon. The adjustment fixture includes an alignment comb having a plurality of substantially parallel beams, each having a thickness. The comb is placed between rows or columns of pins on the protector panel to straighten and impede unintended displacement or movement of the pins. A beam receptacle brace is provided for attachment to an end of the beams so as to maintain the beams in an appropriate fixed spacing so that the printed wiring board can be mounted to the pins.

Abstract translation: 一种用于在保护板上对齐销的便利装置，以便于在其上插入印刷电路板。 调整夹具包括具有多个基本上平行的梁的对准梳，每个具有厚度。 梳子放置在保护器面板上的销或列之间以矫正并阻止销的意外位移或移动。 梁插座支架被设置用于附接到梁的端部，以便将梁保持在适当的固定间隔，使得印刷线路板可以安装到销上。