Abstract:
The present disclosure is drawn to a magnetoresistive device including an array of memory cells arranged in rows and columns, each memory cell comprising a magnetic tunnel junction, each row comprising a word line, and each column comprising a bit line; a column select device that selects a bit line. The magnetoresistive device also includes a sense amplifier comprising a first input corresponding to a selected bit line, a second input corresponding to a reference bit line, and a data output. The plurality of columns comprise a reference column, the reference column comprising a conductive element coupled to the magnetic tunnel junctions in the reference column.
Abstract:
The present disclosure is drawn to, among other things, a magnetoresistive memory. The magnetoresistive memory includes a first memory cell, a first access circuit, a second access circuit, and a current generating circuit. The first memory cell includes a first magnetic tunnel junction and a second magnetic tunnel junction. The first access circuit is configured to receive access command signals for accessing the first magnetic tunnel junction. The first access circuit includes a first access switch and a second access switch. The second access circuit is configured to receive access command signals for accessing the second magnetic tunnel junction. The second access circuit includes a third access switch and a fourth access switch. The current generating circuit is configured to generate a first write current through the first magnetic tunnel junction and generate a second write current through the second magnetic tunnel junction based on data input signals.
Abstract:
A memory device includes memory arrays configured to store pages of data organized into multiple ECC words. The memory device also includes at least one input/output pad for each ECC word associated with a page. The memory device is configurable to perform a first level of error correction on each of the ECC words associated with the page. A system-level error correction circuit is configurable to perform a second level of error correction on the data output by each of the input/output pads during a particular period of time. Each of the one or more input/output pads of the memory device is configurable to provide only one bit of data per ECC word to an external source during an access from an external source.
Abstract:
Higher word line voltages facilitate write operations in spin-torque magnetic memory devices, but overdriving the gate of a selection transistor with such higher word line voltages can damage the selection transistor if the gate-to-source voltage for the selection transistor is too high. Therefore in order to support the word line voltage needed on the gate of the select transistor for an up-current write operation without exceeding limits on the gate-to-source voltage for the select transistor, the gate of the selection transistor can be driven in a two-step process. The gate of the selection transistor is first driven to a lower voltage within the limits of the gate-to-source voltage for the transistor when the source of the transistor is grounded or at a voltage near ground. A voltage is then applied across the memory cell, which results in the source of the selection transistor being raised above its initial ground or near-ground state. After the source of the selection transistor has been raised, the gate voltage of the selection transistor can also be raised at least as much as the source of the selection transistor has been elevated without violating the limits on the gate-to-source voltage for the selection transistor.
Abstract:
Precharging circuits and techniques are presented for use with magnetic memory devices in order to speed up access to the memory cells for reading and writing. Including precharging in the sense amplifiers used to access the memory cells enables self-referenced read operations to be completed more quickly than is possible without precharging. Similarly, precharging can also be used in conjunction with write-back operations in order to allow the data state stored by magnetic tunnel junctions included in the memory cells to be changed more rapidly.
Abstract:
Higher word line voltages facilitate write operations in spin-torque magnetic memory devices, but overdriving the gate of a selection transistor with such higher word line voltages can damage the selection transistor if the gate-to-source voltage for the selection transistor is too high. Therefore in order to support the word line voltage needed on the gate of the select transistor for an up-current write operation without exceeding limits on the gate-to-source voltage for the select transistor, the gate of the selection transistor can be driven in a two-step process. The gate of the selection transistor is first driven to a lower voltage within the limits of the gate-to-source voltage for the transistor when the source of the transistor is grounded or at a voltage near ground. A voltage is then applied across the memory cell, which results in the source of the selection transistor being raised above its initial ground or near-ground state. After the source of the selection transistor has been raised, the gate voltage of the selection transistor can also be raised at least as much as the source of the selection transistor has been elevated without violating the limits on the gate-to-source voltage for the selection transistor.
Abstract:
A cell bias control circuit maximizes the performance of devices in the read/write path of memory cells (magnetic tunnel junction device+transistor) without exceeding leakage current or reliability limits by automatically adjusting multiple control inputs of the read/write path at the memory array according to predefined profiles over supply voltage, temperature, and process corner variations by applying any specific reference parameter profiles to the memory array.
Abstract:
A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.
Abstract:
A technique for detecting tampering attempts directed at a memory device includes setting each of a plurality of detection memory cells to an initial predetermined state, where corresponding portions of the plurality of detection memory cells are included in each of the arrays of data storage memory cells on the memory device. A plurality of corresponding reference bits on the memory device permanently store information representative of the initial predetermined state of each of the detection memory elements. When a tamper detection check is performed, a comparison between the reference bits and the current state of the detection memory cells is used to determine whether any of the detection memory cells have changed state from their initial predetermined states. Based on the comparison, a tamper detect indication is flagged if a threshold level of change is determined. Once a tampering attempt is detected, responses on the memory device include disabling one or more memory operations, generating a mock current to emulate current expected during normal operation, and erasing data stored on the memory device.
Abstract:
In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.