公开(公告)号：US20150145140A1

公开(公告)日：2015-05-28

申请号：US14087114

申请日：2013-11-22

Applicant: INVENSAS CORPORATION

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L21/683 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L23/5384 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/11 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface.

Abstract translation: 晶片与载体粘合无机械粘合形成IC。 在这种形成中，装置具有基板的底表面邻接支撑平台的顶表面而没有粘合剂。 材料围绕衬底设置在支撑平台的顶表面上。 该材料与衬底的侧表面接触以完全密封基底的底表面和支撑平台的顶表面之间的界面，以保持顶表面和底表面的邻接。

公开(公告)号：US20150069639A1

公开(公告)日：2015-03-12

申请号：US14486867

申请日：2014-09-15

Applicant: Invensas Corporation

Inventor： Ilyas Mohammed

IPC: H01L23/00

CPC classification number: H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01049

Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

Abstract translation: 制造微电子单元的方法包括在包括可图案化的金属元件的结构的导电接合表面的形式的第一表面上形成多个引线接合。 线接合形成有与第一表面和远离第一表面的端表面接合的基底。 线接合具有在基部和端面之间延伸的边缘表面。 该方法还包括在导电层的第一表面的一部分上方并且在引线接合部分之上形成电介质封装层，使得引线接合的未封装部分由未被所述边缘表面覆盖的端面或边缘表面的部分限定 封装层。 金属元件被图案化以在引线键合下形成第一导电元件，并且通过封装层的一部分彼此绝缘。

公开(公告)号：US08975738B2

公开(公告)日：2015-03-10

申请号：US13674280

申请日：2012-11-12

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L23/48 ,  H01L23/485 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/485 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00

Abstract: A structure may include a spacer element overlying a first portion of a first surface of a substrate; first terminals at a second surface of the substrate opposite the first surface; and second terminals overlying a third surface of the spacer element facing away from the first surface. Traces extend from the second terminals along an edge surface of the spacer element that extends from the third surface towards the first surface, and may be electrically coupled between the second terminals and the first terminals or electrically conductive elements at the first surface. The spacer element may at least partially define a second portion of the first surface, which is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some of the conductive elements are at the second portion and may permit connection with such microelectronic element.

Abstract translation: 结构可以包括覆盖衬底的第一表面的第一部分的间隔元件; 在所述基板的与所述第一表面相对的第二表面处的第一端子; 以及覆盖所述间隔元件的远离所述第一表面的第三表面的第二端子。 轨迹沿着沿着从第三表面朝向第一表面延伸的间隔元件的边缘表面从第二端子延伸，并且可以在第一表面处电耦合在第二端子和第一端子或导电元件之间。 间隔元件可以至少部分地限定第一表面的第二部分，其不同于第一部分，并且具有尺寸适于容纳微电子元件的整个区域的面积。 一些导电元件位于第二部分并且可以允许与这种微电子元件的连接。

公开(公告)号：US08951845B2

公开(公告)日：2015-02-10

申请号：US14163145

申请日：2014-01-24

Applicant: Invensas Corporation

Inventor： Kazuo Sakuma ,  Ilyas Mohammed ,  Philip Damberg

IPC: H01L21/44

CPC classification number: H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/14136 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33051 ,  H01L2224/331 ,  H01L2224/33505 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8184 ,  H01L2224/8185 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of fabricating a microelectronic package can include mounting a microelectronic element to a substrate with a joining material. The mounting can include bonding a front surface of the microelectronic element to a first surface of the substrate with a joining material, and joining contacts arranged within a contact-bearing region of the front surface of the microelectronic element with corresponding substrate contacts at the substrate first surface, the joining creating electrical contact between the microelectronic element and the substrate. The method can also include forming an underfill between the substrate first surface and the contact-bearing region of the front surface of the microelectronic element, the underfill reinforcing the joints between the contacts and the substrate contacts, the joining material having a Young's modulus less than 75% of a Young's modulus of the underfill.

Abstract translation: 制造微电子封装的方法可以包括使用接合材料将微电子元件安装到衬底上。 安装件可以包括用接合材料将微电子元件的前表面接合到基板的第一表面，以及将布置在微电子元件的前表面的接触区域内的接触件与在基板处的相应的基板触点接合 表面，该接合在微电子元件和衬底之间产生电接触。 该方法还可以包括在基板第一表面和微电子元件的前表面的接触区之间形成底部填充物，底部填充物增强了触点和基板触点之间的接合，该接合材料的杨氏模量小于 底部填充物的杨氏模量的75％。

公开(公告)号：US20140131851A1

公开(公告)日：2014-05-15

申请号：US13674280

申请日：2012-11-12

Applicant: INVENSAS CORPORATION

Inventor： Belgacem Haba ,  Ilyas Mohammed

IPC: H01L23/485 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/485 ,  H01L21/4803 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/02 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/014 ,  H01L2924/00

Abstract: A structure may include a spacer element overlying a first portion of a first surface of a substrate; first terminals at a second surface of the substrate opposite the first surface; and second terminals overlying a third surface of the spacer element facing away from the first surface. Traces extend from the second terminals along an edge surface of the spacer element that extends from the third surface towards the first surface, and may be electrically coupled between the second terminals and the first terminals or electrically conductive elements at the first surface. The spacer element may at least partially define a second portion of the first surface, which is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some of the conductive elements are at the second portion and may permit connection with such microelectronic element.

Abstract translation: 结构可以包括覆盖衬底的第一表面的第一部分的间隔元件; 在所述基板的与所述第一表面相对的第二表面处的第一端子; 以及覆盖所述间隔元件的远离所述第一表面的第三表面的第二端子。 轨迹沿着沿着从第三表面朝向第一表面延伸的间隔元件的边缘表面从第二端子延伸，并且可以在第一表面处电耦合在第二端子和第一端子或导电元件之间。 间隔元件可以至少部分地限定第一表面的第二部分，其不同于第一部分，并且具有尺寸适于容纳微电子元件的整个区域的面积。 一些导电元件位于第二部分并且可以允许与这种微电子元件的连接。