公开(公告)号：US08628338B2

公开(公告)日：2014-01-14

申请号：US13125741

申请日：2009-01-30

Applicant: Takashi Miyamoto

Inventor： Takashi Miyamoto

IPC: H01R12/00

CPC classification number: H05K1/18 ,  B60R25/00 ,  H01R4/028 ,  H01R12/58 ,  H01R12/716 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10757

Abstract: To reduce the number of terminals that protrude from a printed board and to lower a cost in production of the base. A printed board including an electrical junction unit provided with a set of terminals soldered on printed boards. The set of terminals comprise first type terminals each having a small sectional area and second type terminals each having a sectional area greater than that of each of the first type terminals. The electrical junction unit is any one of only the first type terminals, only the second type terminals, and a combination of the first and second type terminals. The first type terminals are inserted into and protrude from through-holes in a base and are soldered on the printed boards. The second type terminals are soldered on the printed boards without using the base.

Abstract translation: 减少从印刷电路板突出的端子数量，降低基座的生产成本。 一种印刷电路板，包括电连接单元，其具有焊接在印刷电路板上的一组端子。 该组端子包括各自具有小截面面积的第一类型端子和分别具有大于第一类型端子的截面积的第二类型端子。 电接合单元是仅第一类型端子，仅第二类型端子中的任何一种以及第一和第二类型端子的组合。 第一类型端子插入基底中的通孔并从其中突出并且被焊接在印刷板上。 第二类端子焊接在印刷电路板上而不使用基座。

公开(公告)号：US08300035B2

公开(公告)日：2012-10-30

申请号：US12481892

申请日：2009-06-10

Applicant: Kazuhiro Ogawa ,  Kazuhiko Yanagawa

Inventor： Kazuhiro Ogawa ,  Kazuhiko Yanagawa

IPC: G09G3/38

CPC classification number: G02F1/13452 ,  G02F1/134363 ,  H01L2924/0002 ,  H05K1/117 ,  H05K3/244 ,  H05K3/28 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/361 ,  H05K2201/09709 ,  H05K2201/10659 ,  H05K2201/10681 ,  H01L2924/00

Abstract: A display device includes a display panel, a printed circuit board, a plurality of semiconductor devices which are film-like substrates with an IC chip, and a monolithic anisotropic conductive film disposed on the printed circuit board. Each of the semiconductor devices has a first side portion and a second side portion opposite to the first side portion. The first side portion is connected to the printed circuit board via the monolithic anisotropic conductive film, and the second side portion is connected to the display panel. Further the first side portion of each of the semiconductor devices is respectively connected at separated portions of the monolithic anisotropic conductive film.

Abstract translation: 显示装置包括显示面板，印刷电路板，作为具有IC芯片的薄膜状基板的多个半导体装置以及布置在印刷电路板上的整体式各向异性导电膜。 每个半导体器件具有与第一侧部相对的第一侧部分和第二侧部分。 第一侧部通过单片式各向异性导电膜与印刷电路板连接，第二侧部与显示面板连接。 此外，每个半导体器件的第一侧部分别分别连接在单片各向异性导电膜的分离部分。

公开(公告)号：US08044305B2

公开(公告)日：2011-10-25

申请号：US11443763

申请日：2006-05-31

Applicant: Xingjian Cai ,  Ke Wang ,  Qing-lun Chen

Inventor： Xingjian Cai ,  Ke Wang ,  Qing-lun Chen

IPC: H05K1/16

CPC classification number: H05K1/115 ,  H05K1/0237 ,  H05K1/0245 ,  H05K1/112 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09636 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10659 ,  Y02P70/613

Abstract: A circuit board may include hybrid via structures configured to connect to components, such as connectors and electronic components, mounted on the circuit board. A hybrid via structure may include one or more micro-vias configured to provide an electrical connection to a signal trace in the circuit board and one or more through-vias configured to provide a ground connection to at least one reference plane in the circuit board. In one embodiment, a plurality of circuit boards including the hybrid via structures and signal traces may be connected to establish a channel supporting differential signaling and data transfer rates of at least about 5 Gb/s. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract translation: 电路板可以包括被配置为连接到安装在电路板上的诸如连接器和电子部件的组件的混合通孔结构。 混合通孔结构可以包括一个或多个微通孔，其被配置为提供与电路板中的信号迹线的电连接以及被配置为提供到电路板中的至少一个参考平面的接地连接的一个或多个通孔。 在一个实施例中，可以连接包括混合通路结构和信号迹线的多个电路板，以建立支持至少约5Gb / s的差分信令和数据传输速率的信道。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

公开(公告)号：US08040212B2

公开(公告)日：2011-10-18

申请号：US12507751

申请日：2009-07-22

Applicant: Alexandr Ikriannikov

Inventor： Alexandr Ikriannikov

IPC: H01F27/29 ,  H01F27/02 ,  H01F5/00 ,  H01F17/04 ,  H01F27/28

CPC classification number: H01F27/2847 ,  H01F17/06 ,  H01F27/292 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10659 ,  Y02P70/611

Abstract: An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

Abstract translation: 电感器包括由磁性材料形成的芯部和至少部分地缠绕在芯部的至少一部分周围的箔绕组。 绕组的第一端远离芯部形成延伸的输出舌片，其被配置和布置成补充或用作印刷电路板箔迹线的替代物。 绕组的第二端形成焊接片。 扩展输出舌片和焊片的至少一部分相对于芯的底表面形成在相同的高度。 另一个电感器包括由磁性材料形成的芯，至少部分地围绕或穿过芯的至少一部分的绕组，以及附接到芯的接地回路导体。 磁芯不会在接地回路导体周围形成磁路环路。

公开(公告)号：US08013355B2

公开(公告)日：2011-09-06

申请号：US11939552

申请日：2007-11-13

Applicant: Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

Inventor： Chun-Cheng Lin ,  Abram Chang ,  Sheng-Jia Sheu ,  Eddie Huang

IPC: H01L33/00 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H05K1/0203 ,  H01L33/647 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10659

Abstract: A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.

Abstract translation: 大功率发光二极管，大功率发光二极管包括发光二极管芯片，主模块，两个第一电极引脚，两个第二电极引脚和至少一个散热板。 主模块具有凹面，发光二极管芯片位于凹面。 第一电极引脚连接到主模块的第一侧，并且电连接到发光二极管芯片。 第二电极引脚布置在主模块的相对于第一电极引脚的第二侧，其中第二电极引脚和第一电极引脚电气相对。 第二电极引脚电连接到发光二极管芯片。 散热板与主模块的一部分连接在第一电极销和第二电极销之间。

公开(公告)号：US20110201216A1

公开(公告)日：2011-08-18

申请号：US13125741

申请日：2009-01-30

Applicant: Takashi Miyamoto

Inventor： Takashi Miyamoto

IPC: H01R12/71

CPC classification number: H05K1/18 ,  B60R25/00 ,  H01R4/028 ,  H01R12/58 ,  H01R12/716 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10757

Abstract: To reduce the number of terminals that protrude from a printed board and to lower a cost in production of the base. A printed board including an electrical junction unit provided with a set of terminals soldered on printed boards. The set of terminals comprise first type terminals each having a small sectional area and second type terminals each having a sectional area greater than that of each of the first type terminals. The electrical junction unit is any one of only the first type terminals, only the second type terminals, and a combination of the first and second type terminals. The first type terminals are inserted into and protrude from through-holes in a base and are soldered on the printed boards. The second type terminals are soldered on the printed boards without using the base.

Abstract translation: 减少从印刷电路板突出的端子数量，降低基座的生产成本。 一种印刷电路板，包括电连接单元，其具有焊接在印刷电路板上的一组端子。 该组端子包括各自具有小截面面积的第一类型端子和分别具有大于第一类型端子的截面积的第二类型端子。 电接合单元是仅第一类型端子，仅第二类型端子中的任何一种以及第一和第二类型端子的组合。 第一类型端子插入基底中的通孔并从其中突出并且被焊接在印刷板上。 第二类端子焊接在印刷电路板上而不使用基座。

公开(公告)号：US07957157B2

公开(公告)日：2011-06-07

申请号：US12714275

申请日：2010-02-26

Applicant: Yuuichi Koga

Inventor： Yuuichi Koga

IPC: H05K7/18

CPC classification number: H01L21/563 ,  G06F1/183 ,  H01L22/32 ,  H01L23/3114 ,  H01L2224/16225 ,  H01L2224/73203 ,  H05K1/0268 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2203/163 ,  Y10T29/4913

Abstract: A printed circuit board including: a semiconductor package; a board; first to fourth electrodes on a second face of the semiconductor package; fifth to eighth electrodes on a mount region of the board; a first conductor connecting the first electrode with the second electrode; a second conductor connecting the third electrode with the fourth electrode; a third conductor connecting the sixth electrode with the seventh electrode; fourth conductors respectively connecting to the fifth electrode and the eighth electrode; conductive bonding portions bonding each of the electrodes on the second face with corresponding one of the electrodes on the mount region; and a determination circuit connected to the fourth conductors and configured to determine a difference between a value of current supplied to one of the fourth conductors and a value of current received through the other fourth conductor.

Abstract translation: 一种印刷电路板，包括：半导体封装; 董事会 在半导体封装的第二面上的第一至第四电极; 在板的安装区域上的第五至第八电极; 连接第一电极和第二电极的第一导体; 连接所述第三电极和所述第四电极的第二导体; 连接第六电极和第七电极的第三导体; 分别连接到第五电极和第八电极的第四导体; 导电接合部分将第二面上的每个电极与安装区域上的电极中的相应一个接合; 以及确定电路，连接到第四导体并且被配置为确定提供给第四导体中的一个的电流的值与通过另一第四导体接收的电流的值之间的差。

公开(公告)号：US20110043345A1

公开(公告)日：2011-02-24

申请号：US12598890

申请日：2008-05-07

Applicant: Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

Inventor： Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

IPC: G12B11/00

CPC classification number: H01R12/58 ,  H01R12/57 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10659

Abstract: The present invention relates to a dashboard indicator module comprising, in a casing, a rotary motor, an output shaft, mechanical reduction means associated with the motor, at least one electrical supply coil, electrical connection tabs linked to the coils leaving said casing and electrical contact elements, characterised in that said electrical contact elements can be fitted on the connection tabs in order to produce solderless connectors on the printed circuit or even removed from the connection tabs in order to allow the connection tabs of the motor to be soldered directly to the printed circuit.

Abstract translation: 本发明涉及一种仪表板指示器模块，其在壳体中包括旋转马达，输出轴，与马达相关联的机械减速装置，至少一个供电线圈，连接到离开所述壳体和电气的线圈的电连接翼片 接触元件，其特征在于，所述电接触元件可以装配在连接接片上，以便在印刷电路上产生无焊接连接器，或者甚至从连接接线片上移除，以便允许电机的连接接头直接焊接到 印刷电路

公开(公告)号：US20100039196A1

公开(公告)日：2010-02-18

申请号：US12540732

申请日：2009-08-13

Applicant: Kenichi YOKOYAMA ,  Shigemitsu AOKI

Inventor： Kenichi YOKOYAMA ,  Shigemitsu AOKI

IPC: H01H45/14

CPC classification number: H01H50/14 ,  H01H50/047 ,  H01H2001/5888 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10659 ,  Y02P70/613

Abstract: An electromagnetic relay including a body, a plurality of first surface-mount terminals projecting from the body, and at least one second terminal projecting from the body. Each first terminal includes a distal end portion adapted to be mounted on a surface of a circuit board. The second terminal includes a distal end portion adapted to be inserted into a through-hole of a circuit board. The distal end portion of the second terminal is positioned farther away from the body than the distal end portion of the first terminal.

Abstract translation: 一种电磁继电器，包括主体，从主体突出的多个第一表面安装端子和从主体突出的至少一个第二端子。 每个第一端子包括适于安装在电路板的表面上的远端部分。 第二端子包括适于插入电路板的通孔中的远端部分。 第二端子的远端部分比第一端子的远端部分远离主体定位。

公开(公告)号：US20100003843A1

公开(公告)日：2010-01-07

申请号：US12358541

申请日：2009-01-23

Applicant: Harry YEH

Inventor： Harry YEH

IPC: H01R13/62

CPC classification number: H01R12/725 ,  H05K1/117 ,  H05K1/182 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10659 ,  H05K2203/1572

Abstract: A SMT/DIP type connector structure having at least three rows of terminals is provided. The connector structure mainly includes a printed circuit board and a connector having at least a first row of terminals, a second row of terminals and a third row of terminals. The printed circuit board is disposed centrally with respect to the connector. The first row and second row of terminals are respectively mounted to top and bottom board sides of the printed circuit board by using SMT. The third row and further rows of terminals can be mounted to the top or bottom board side of the printed circuit board selectively by using SMT or DIP. This structure can increase the speed of mounting the connector to the printed circuit board and significantly reduce the overall height of the resulted product.

Abstract translation: 提供具有至少三行端子的SMT / DIP型连接器结构。 连接器结构主要包括印刷电路板和具有至少第一排端子，第二排端子和第三排端子的连接器。 印刷电路板相对于连接器居中设置。 通过使用SMT将第一排和第二排端子分别安装到印刷电路板的顶板和底板两侧。 可以通过使用SMT或DIP选择性地将第三行和另外的端子排安装到印刷电路板的顶板或底板侧。 这种结构可以增加将连接器安装到印刷电路板上的速度，并显着降低所得产品的整体高度。