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    Wafer-level passivation structure of micro-device, micro-device including the same, and methods of manufacturing wafer-level passivation structure and micro-device
    144.
    发明授权
    Wafer-level passivation structure of micro-device, micro-device including the same, and methods of manufacturing wafer-level passivation structure and micro-device 有权
    微器件的晶圆级钝化结构，包括微晶元件的晶体级钝化结构以及晶圆级钝化结构和微器件的制造方法

    公开(公告)号：US09242852B2

    公开(公告)日：2016-01-26

    申请号：US13562968

    申请日：2012-07-31

    Applicant: Jeong-yub Lee

    Inventor： Jeong-yub Lee

    IPC: B81B7/02 ,  B81C1/00 ,  G02B3/12 ,  G02B26/08

    CPC classification number: B81C1/00269 ,  B81C2201/112 ,  B81C2203/019 ,  B81C2203/036 ,  G02B3/12 ,  G02B26/0833 ,  Y10T428/23 ,  Y10T428/234

    Abstract: A wafer-level passivation structure of a micro-device, a micro-device including the same, and methods of manufacturing the wafer-level passivation structure and the micro-device may be provided. In particular, the passivation structure may include a spacer that is disposed on a substrate, covers a portion of the first surface, and has an elastic property, and an anti-adhesion layer that is disposed on a surface of the substrate between the spacer. The spacer may form a lattice pattern. The spacer may be formed of a silicon. The anti-adhesion layer may be a metallic film, an oxide film, or a nitride film.

    Abstract translation: 可以提供微器件的晶片级钝化结构，包括微晶器件的微器件以及制造晶片级钝化结构和微器件的方法。 特别地，钝化结构可以包括设置在基板上，覆盖第一表面的一部分并且具有弹性的间隔物，以及设置在间隔件之间的基板的表面上的防粘附层。 间隔物可以形成格子图案。 间隔物可以由硅形成。 抗粘附层可以是金属膜，氧化膜或氮化物膜。

    Low-voltage MEMS shutter assemblies
    145.
    发明授权
    Low-voltage MEMS shutter assemblies 有权
    低压MEMS快门组件

    公开(公告)号：US09235046B2

    公开(公告)日：2016-01-12

    申请号：US13754548

    申请日：2013-01-30

    Applicant: Pixtronix, Inc.

    Inventor： Javier Villarreal ,  Timothy J. Brosnihan ,  Jasper L. Steyn ,  Richard S. Payne ,  Stephen R. Lewis

    IPC: G06F3/038 ,  G09G5/00 ,  G02B26/02 ,  G09G3/22 ,  B81B3/00

    CPC classification number: G02B26/02 ,  B81B3/007 ,  B81B2201/045 ,  B81B2203/0163 ,  B81B2203/051 ,  B81C2201/053 ,  B81C2201/112 ,  G02B26/023 ,  G09G3/22

    Abstract: This disclosure provides systems, methods and apparatus for providing relatively thinner and less stiff compliant beams for a shutter assembly. A protective coating is deposited and patterned over the shutter assembly before it is released from a sacrificial mold over which the shutter assembly is formed. Because some primary surfaces of the compliant beams are in contact with the sacrificial mold, these primary surfaces are not coated with the protective coating. Therefore, when the shutter assembly is finally released, the resulting compliant beams are relatively thinner and less stiff providing a reduction in an actuation voltage used to operate the shutter assembly. In some instances, the protective coating is patterned into discontinuous segments before release.

    Abstract translation: 本公开提供了用于为快门组件提供相对较薄且较不硬的柔性梁的系统，方法和装置。 在从快门组件形成的牺牲模具释放之前，将保护涂层沉积并在其上形成图案。 由于柔性梁的一些主表面与牺牲模具接触，所以这些主表面没有涂覆保护涂层。 因此，当快门组件最终被释放时，所产生的柔性梁相对较薄并且较不硬，从而降低用于操作闸板组件的致动电压。 在一些情况下，保护性涂层在释放之前被图案化成不连续段。

    Method for MEMS structure with dual-level structural layer and acoustic port
    146.
    发明授权
    Method for MEMS structure with dual-level structural layer and acoustic port 有权
    具有双层结构层和声学端口的MEMS结构方法

    公开(公告)号：US09227842B2

    公开(公告)日：2016-01-05

    申请号：US14084569

    申请日：2013-11-19

    Applicant: Invensense, Inc.

    Inventor： Michael Julian Daneman ,  Mei-Lin Chan ,  Martin Lim ,  Fariboz Assaderaghi ,  Erhan Polatkan Ata

    IPC: H01L21/00 ,  B81C1/00

    CPC classification number: B81C1/00246 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/112 ,  B81C2203/0118 ,  B81C2203/0742 ,  B81C2203/0792 ,  H01L2224/83805

    Abstract: A method for fabricating a MEMS device includes depositing and patterning a first sacrificial layer onto a silicon substrate, the first sacrificial layer being partially removed leaving a first remaining oxide. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. Further, a second sacrificial layer is formed on top of the conductive structure layer. Patterning and etching of the silicon substrate is performed stopping at the second sacrificial layer. Additionally, the MEMS substrate is bonded to a CMOS wafer, the CMOS wafer having formed thereupon a metal layer. An electrical connection is formed between the MEMS substrate and the metal layer.

    Abstract translation: 一种用于制造MEMS器件的方法包括将第一牺牲层沉积并图案化到硅衬底上，第一牺牲层被部分去除留下第一剩余氧化物。 此外，该方法包括在硅衬底上沉积导电结构层，导电结构层与硅衬底的至少一部分进行物理接触。 此外，在导电结构层的顶部上形成第二牺牲层。 在第二牺牲层停止硅衬底的图案化和蚀刻。 此外，MEMS衬底被结合到CMOS晶片，其上形成有金属层的CMOS晶片。 在MEMS衬底和金属层之间形成电连接。

    Method for wafer-level surface micromachining to reduce stiction
    147.
    发明授权
    Method for wafer-level surface micromachining to reduce stiction 有权
    晶圆级微机械加工技术降低静摩擦的方法

    公开(公告)号：US09045328B2

    公开(公告)日：2015-06-02

    申请号：US13331582

    申请日：2011-12-20

    Applicant: Fang Liu ,  Kuang Yang

    Inventor： Fang Liu ,  Kuang Yang

    IPC: B81B3/00

    CPC classification number: B81B3/001 ,  B81B3/0005 ,  B81B3/0018 ,  B81C2201/112 ,  Y10T428/24355 ,  Y10T428/24521

    Abstract: An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

    Abstract translation: 具有非超疏水材料层或涂层的微丸阵列产生超疏水表面，并且还可具有15度或更小的接触角滞后。 因此，即使表面结构和材料本身不是超疏水的，具有这种阵列的表面也可能变得超疏水。

    LOW-VOLTAGE MEMS SHUTTER ASSEMBLIES
    148.
    发明申请
    LOW-VOLTAGE MEMS SHUTTER ASSEMBLIES 有权
    低压MEMS快门总成

    公开(公告)号：US20140210864A1

    公开(公告)日：2014-07-31

    申请号：US13754548

    申请日：2013-01-30

    Applicant: PIXTRONIX, INC.

    Inventor： Javier Villarreal ,  Timothy J. Brosnihan ,  Jasper L. Steyn ,  Richard S. Payne ,  Stephen R. Lewis

    IPC: G02B26/02 ,  G09G3/22

    CPC classification number: G02B26/02 ,  B81B3/007 ,  B81B2201/045 ,  B81B2203/0163 ,  B81B2203/051 ,  B81C2201/053 ,  B81C2201/112 ,  G02B26/023 ,  G09G3/22

    Abstract: This disclosure provides systems, methods and apparatus for providing relatively thinner and less stiff compliant beams for a shutter assembly. A protective coating is deposited and patterned over the shutter assembly before it is released from a sacrificial mold over which the shutter assembly is formed. Because some primary surfaces of the compliant beams are in contact with the sacrificial mold, these primary surfaces are not coated with the protective coating. Therefore, when the shutter assembly is finally released, the resulting compliant beams are relatively thinner and less stiff providing a reduction in an actuation voltage used to operate the shutter assembly. In some instances, the protective coating is patterned into discontinuous segments before release.

    Abstract translation: 本公开提供了用于为快门组件提供相对较薄且较不硬的柔性梁的系统，方法和装置。 在从快门组件形成的牺牲模具释放之前，将保护涂层沉积并在其上形成图案。 由于柔性梁的一些主表面与牺牲模具接触，所以这些主表面没有涂覆保护涂层。 因此，当快门组件最终被释放时，所产生的柔性梁相对较薄并且较不硬，从而降低用于操作闸板组件的致动电压。 在一些情况下，保护性涂层在释放之前被图案化成不连续段。

    DYNAMIC ACCESS POINT BASED POSITIONING
    149.
    发明申请
    DYNAMIC ACCESS POINT BASED POSITIONING 有权
    基于动态接入点的定位

    公开(公告)号：US20140171108A1

    公开(公告)日：2014-06-19

    申请号：US13852073

    申请日：2013-03-28

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Deric Wayne Waters ,  Ariton E. Xhafa ,  Mohamed Farouk Mansour

    IPC: H04W4/02

    CPC classification number: B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

    Abstract: A wireless device that includes an access point (AP) scanner, a transceiver, and a controller coupled to the AP scanner and transceiver. The AP scanner is configured to scan wireless network channels utilized by one or more APs to transmit data packets, probe responses, and beacons. The transceiver is configured to transmit one or more probe requests to the one or more APs and receive one or more probe responses and beacons from the one or more APs. The controller is configured to determine a proximate geographic position of the wireless device based on signal strength of the one or more probe responses and beacons received from the one or more APs. The controller also dynamically adapts a parameter utilized in determining the proximate geographic position of the wireless device.

    Abstract translation: 一种包括接入点（AP）扫描器，收发器和耦合到AP扫描器和收发器的控制器的无线设备。 AP扫描器被配置为扫描由一个或多个AP使用的无线网络信道以发送数据分组，探测响应和信标。 收发器被配置为向一个或多个AP发送一个或多个探测请求，并从一个或多个AP接收一个或多个探测响应和信标。 控制器被配置为基于从一个或多个AP接收的一个或多个探测响应和信标的信号强度来确定无线设备的邻近地理位置。 控制器还动态地适配用于确定无线设备的最近地理位置的参数。

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