公开(公告)号：US20230208020A1

公开(公告)日：2023-06-29

申请号：US18176794

申请日：2023-03-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA ,  Hiromichi KITAJIMA

IPC: H01Q1/42 ,  H01Q1/52 ,  H01Q5/40

CPC classification number: H01Q1/422 ,  H01Q1/526 ,  H01Q5/40

Abstract: A radio-frequency module includes: a module substrate; a first circuit component and a second circuit component that are disposed inside the module substrate; and a metal shield plate set to a ground potential. The module substrate includes a dielectric part including a first dielectric material, and a dielectric part including a second dielectric material and located inward of the dielectric part, the second dielectric material having a relative permittivity different from that of the first dielectric material. The metal shield plate is disposed between the first circuit component and the second circuit component and in the dielectric part.

公开(公告)号：US20230187809A1

公开(公告)日：2023-06-15

申请号：US17987116

申请日：2022-11-15

Applicant: TAOGLAS GROUP HOLDINGS LIMITED

Inventor： Vladimir FURLAN

IPC: H01Q1/12 ,  H01Q1/52 ,  H01Q1/32 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q21/26 ,  H01Q9/28 ,  H01Q13/10 ,  H01Q21/28 ,  H01Q1/22 ,  H01P3/08 ,  H01P5/10

CPC classification number: H01Q1/1271 ,  H01Q1/526 ,  H01Q1/3233 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q21/26 ,  H01Q9/285 ,  H01Q13/10 ,  H01Q21/28 ,  H01Q1/2283 ,  H01P3/085 ,  H01Q1/52 ,  H01Q1/12 ,  H01P5/1007

Abstract: Disclosed is an antenna including a radiating element, a co-planar ground plane element and a transmission line extending across at least a portion of the radiating element and the ground plane element. The transmission line includes a dielectric layer. The dielectric layer has a portion of a first major surface adjacent to the ground plane and a second major surface opposite and separated from the first surface. A shield is formed on the second major surface. At least one via extends through the dielectric layer to connect the shield to the ground plane. A feed line extends longitudinally through the dielectric layer from a feed point at a proximal end of the transmission line towards a distal end of the transmission line, the feed line being shielded along a portion of its length extending across the ground plane element by the shield with the distal end of the transmission line lying in register with the radiating element and coupling the feed line to the radiating element.

公开(公告)号：US20230187712A1

公开(公告)日：2023-06-15

申请号：US17547310

申请日：2021-12-10

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Fiona E. Meyer-Teruel ,  Aseim M. Elfrgani ,  Christopher A. O'Brien ,  Sony Mathews ,  Hatem Elgothamy

IPC: H01M10/42 ,  H01Q1/52 ,  H04B7/24 ,  H02K7/00 ,  H02K11/00 ,  H02K11/33 ,  H05K9/00 ,  H05K1/14 ,  H01M50/209 ,  H01M50/519 ,  H01M50/569 ,  H01M10/48 ,  H01M50/249 ,  B60L53/20 ,  B60K1/04

CPC classification number: H01M10/4257 ,  H01Q1/526 ,  H04B7/24 ,  H02K7/006 ,  H02K11/0094 ,  H02K11/33 ,  H05K9/006 ,  H05K9/0084 ,  H05K1/142 ,  H01M50/209 ,  H01M50/519 ,  H01M50/569 ,  H01M10/482 ,  H01M50/249 ,  B60L53/20 ,  B60K1/04 ,  H05K2201/10098 ,  H05K2201/10037 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2220/20

Abstract: An enclosed electrical device such as a battery pack for an electric powertrain system includes an enclosure having a tray and cover. The tray and cover together define an enclosure cavity. A radio frequency (RF) receiving node is located within the cavity. Printed circuit board assemblies (PCBAs) include an RF transmitting node. The PCBAs(s) are spaced apart from one another within the cavity. An RF shield guide layer is positioned between the PCBAs and the cover, such that the RF shield guide layer covers the PCBAs without covering the RF transmitting node. A battery pack and an electric powertrain system include the RF shield guide layer.

公开(公告)号：US20230178877A1

公开(公告)日：2023-06-08

申请号：US18071701

申请日：2022-11-30

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： Yuchun Deng ,  Qingxue Xu ,  Chenglong Yin ,  Deyu Liu

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q1/52

CPC classification number: H01Q1/246 ,  H01Q1/38 ,  H01Q1/526

Abstract: A printed-circuit board assembly (PCBA), a radio unit, and a base station. The PCBA comprises a printed circuit board and a plurality of electronic devices disposed on the printed circuit board. The PCBA further comprises a dielectric layer and a conductive layer that cover the electronic devices to shield the plurality of electronic devices, wherein the dielectric layer is arranged between the electronic devices and the conductive layer. According to the disclosure, the dielectric layer and conductive layer disposed on one side of the printed circuit board can shield the electronic devices, which makes it unnecessary to provide a shielding cover made of metal, thus decreasing the weight and volume of the PCBA and reducing the cost. Moreover, the PCBA is easy to manufacture, as the dielectric layer and the conductive layer can be bonded to the printed circuit board through a known process such as vacuum thermoforming.

公开(公告)号：US11670856B2

公开(公告)日：2023-06-06

申请号：US17727333

申请日：2022-04-22

Applicant: NuCurrent, Inc.

Inventor： Vinit Singh ,  Ajit Rajagopalan ,  Alberto Peralta ,  Md. Nazmul Alam ,  Christine A. Frysz ,  Jason Luzinski ,  Glenn Riese ,  Jacob Babcock ,  Pavel Shostak

IPC: H01Q7/06 ,  H04B5/00 ,  H01Q1/52

CPC classification number: H01Q7/06 ,  H01Q1/526 ,  H04B5/0037 ,  H04B5/0081 ,  H04B5/0087

Abstract: Various embodiments of a multi-mode antenna are described. The antenna is preferably constructed having a first inductor coil and a second inductor coil. A plurality of shielding materials are positioned throughout the antenna to minimize interference of the magnetic fields that emanate from the coils from surrounding materials. The antenna comprises a coil control circuit having at least one of an electric filter and an electrical switch configured to modify the electrical impedance of either or both the first and second coils.

公开(公告)号：US20230167274A1

公开(公告)日：2023-06-01

申请号：US17990784

申请日：2022-11-21

Applicant: Ticona LLC

Inventor： Young Shin Kim

IPC: C08K7/10 ,  H01Q1/52 ,  H01Q1/50 ,  H01Q9/04 ,  C08K3/34 ,  C09D1/00

CPC classification number: C08K7/10 ,  H01Q1/526 ,  H01Q1/50 ,  H01Q9/0407 ,  C08K3/346 ,  C09D1/00

Abstract: An antenna module is provided. The antenna module comprises a dielectric on which is disposed one or more antenna elements configured to transmit and/or receive a radiofrequency signal; a communication circuit for processing the radiofrequency signal; an interconnect member that is electrically connected with the communication circuit and the antenna elements, wherein the interconnect member optionally contains a substrate on which a metal coating is disposed; and optionally, a shield member covering the communication circuit that contains a substrate on which a metal coating is disposed. The dielectric, the substrate of the interconnect member, and/or the substrate of the shield member contain a polymer composition comprising silicate fibers distributed within a polymer matrix that includes a thermotropic liquid crystalline polymer.

公开(公告)号：US11658418B2

公开(公告)日：2023-05-23

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras Eid ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Aleksandar Aleksov

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q19/22 ,  H01L23/367

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US11658391B2

公开(公告)日：2023-05-23

申请号：US17129084

申请日：2020-12-21

Applicant: QUALCOMM Incorporated

Inventor： Hong Bok We ,  Aniket Patil ,  Jeahyeong Han ,  Mohammad Ali Tassoudji

IPC: H01Q1/52 ,  H01Q21/00 ,  H01Q23/00 ,  H01Q1/22

CPC classification number: H01Q1/2283 ,  H01Q1/526 ,  H01Q21/0087 ,  H01L2223/6677 ,  H01Q23/00

Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.

公开(公告)号：US20230155281A1

公开(公告)日：2023-05-18

申请号：US18157177

申请日：2023-01-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koji FURUTANI

IPC: H01Q1/52 ,  H01Q1/22 ,  H01Q5/50

CPC classification number: H01Q1/526 ,  H01Q1/2283 ,  H01Q5/50

Abstract: A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a mold layer, and a shield layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The mold layer seals at least the second semiconductor device. The shield layer 80 covers the mold layer. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The mold layer does not cover a top face of the second semiconductor device.

公开(公告)号：US20230155273A1

公开(公告)日：2023-05-18

申请号：US17981176

申请日：2022-11-04

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong HAN ,  Rajneesh KUMAR ,  Suhyung HWANG ,  Jaehyun YEON ,  Mohammad Ali TASSOUDJI ,  Darryl Sheldon JESSIE ,  Ameya GALINDE

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/36 ,  H01Q1/52 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01Q1/2283 ,  H01L21/565 ,  H01L23/66 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5387 ,  H01Q1/36 ,  H01Q1/526 ,  H05K1/185 ,  H05K9/0081 ,  H01L21/4857

Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.