公开(公告)号：US09001527B2

公开(公告)日：2015-04-07

申请号：US13485954

申请日：2012-06-01

Applicant: Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K5/02 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。

公开(公告)号：US20150029678A1

公开(公告)日：2015-01-29

申请号：US13950335

申请日：2013-07-25

Applicant: BAU-RU LU ,  MING-CHIA WU

Inventor： BAU-RU LU ,  MING-CHIA WU

IPC: H05K1/02 ,  H05K3/00 ,  H05K9/00

CPC classification number: H01L24/24 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2924/1206 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284

Abstract: A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.

Abstract translation: 一种无基底装置包括多个第一导电元件和密封剂。 密封剂封装多个第一导电元件，其中多个第一导电元件的位置由密封剂固定; 并且所述多个第一导电元件的多个端子暴露在所述密封剂的外部，其中所述多个第一导电元件不被基板支撑。

公开(公告)号：US08922312B2

公开(公告)日：2014-12-30

申请号：US13853083

申请日：2013-03-29

Applicant: Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F27/02

CPC classification number: H01F3/08 ,  H01F41/0246 ,  H01F2017/048

Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.

Abstract translation: 提供包括第一磁粉，第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。 导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。 第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度，第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。 通过第一磁性粉末和第二磁性粉末的硬度差，将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体 点绝缘密封剂。

公开(公告)号：US20140266568A1

公开(公告)日：2014-09-18

申请号：US14292325

申请日：2014-05-30

Applicant: CYNTEC CO. LTD.

Inventor： Hsing-Kai CHENG ,  Yu-Jen Lin ,  Yen-Ting Lin ,  Ta-Wen Lo

IPC: H01C1/012

CPC classification number: H01C7/13 ,  G01R1/203 ,  H01C1/148 ,  H01C7/003

Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.

Abstract translation: 电阻器装置包括具有相反的第一和第二表面的电阻器板; 第一金属层，包括第一和第二部分，其分别在相反的第一和第二侧设置在电阻器板的第一表面上; 以及第二金属层，其包括彼此分离的第一感测焊盘，第二感测焊盘，第一电流焊盘和第二电流焊盘，其中所述第一感测焊盘和所述第一电流焊盘设置在所述第一 金属层和第二感测焊盘和第二电流焊盘设置在第一金属层的第二部分上。 优选地设置保护层，覆盖电阻器板和未被第二金属层覆盖的第一金属层。

公开(公告)号：US20140218157A1

公开(公告)日：2014-08-07

申请号：US14251105

申请日：2014-04-11

Applicant: CYNTEC CO. LTD.

Inventor： Chun-Tiao LIU ,  Lan-Chin HSIEH ,  Tsung-Chan WU ,  Chi-Hsun LEE ,  Chih-Siang CHUANG

IPC: H01F27/29

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20≦PCL≦7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.

Abstract translation: 磁性装置包括T形磁芯，线圈和磁性体。 T型磁芯包括基座和支柱，由退火的软磁金属材料制成，T形磁芯的铁心损耗PCL（mW / cm3）满足：0.64×f0.95×Bm2。 20＆nlE; PCL＆nlE; 7.26×f1.41×Bm1.08，其中f（kHz）表示施加到T形磁芯的磁场的频率，Bm（kGauss）表示磁场的工作磁通密度 在频率。 磁体完全覆盖支柱，位于基座底面上方的基座的任何部分以及位于基座顶表面正上方的线圈的任何部分。

公开(公告)号：US08771436B2

公开(公告)日：2014-07-08

申请号：US13561266

申请日：2012-07-30

Applicant: Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F1/22 ,  H01F1/153 ,  H01F27/255

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder.

Abstract translation: 提供了包括磁体和电线的电子设备。 磁体具有与第一磁性粉末混合的第一磁性粉末和第二磁性粉末。 第一磁粉的维氏硬度大于第二磁粉的硬度，第一磁粉的平均粒径大于第二磁粉的平均粒径。

公开(公告)号：US20140016289A1

公开(公告)日：2014-01-16

申请号：US13935713

申请日：2013-07-05

Applicant: CYNTEC CO., LTD

Inventor： Chih-Tse Chen ,  Joseph D.S. Deng ,  Shih-Hsien Tseng

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。

公开(公告)号：US20130328653A1

公开(公告)日：2013-12-12

申请号：US13959441

申请日：2013-08-05

Applicant: CYNTEC CO., LTD.

Inventor： Tsung-Chan WU ,  Roger HSIEH ,  Yi-Min HUANG ,  Lan-Chin HSIEH ,  Yu-Ching KUO ,  Chia-Hui LAI

IPC: H01F3/08 ,  H01F27/02

CPC classification number: H01F27/24 ,  H01F3/08 ,  H01F17/045 ,  H01F27/022 ,  H01F27/255 ,  H01F27/2823 ,  H01F27/2828 ,  H01F2017/048

Abstract: A choke includes a single-piece core made of a same material, the single-piece core having a first board, a second board, and a pillar located between the first and second boards, a winding space located among the first board, the second board and the pillar, wherein the pillar has a non-circular and non-rectangular cross section having a first axis and a second axis substantially perpendicularly intersecting with each other at a center of the cross section of the pillar, and wherein a circumference of the cross section of the pillar includes two arc edges, four first substantially straight edges substantially parallel to the first axis, and two second substantially straight edges substantially parallel to the second axis, each of the first substantially straight edges being a joint of and in direct contact with one of the arc edges and one of the second substantially straight edges.

Abstract translation: 扼流器包括由相同材料制成的单件式芯，单件式芯具有第一板，第二板和位于第一板和第二板之间的支柱，位于第一板之间的绕组空间，第二板 板和支柱，其中所述支柱具有非圆形和非矩形横截面，所述横截面具有在所述柱的横截面的中心处彼此基本垂直相交的第一轴线和第二轴线，并且其中， 柱的横截面包括两个弧形边缘，基本上平行于第一轴线的四个第一基本上直的边缘和基本上平行于第二轴线的两个第二基本上直的边缘，每个第一基本上直的边缘是直接接触的接头 其中弧形边缘中的一个和第二基本上直的边缘中的一个。

公开(公告)号：US08601673B2

公开(公告)日：2013-12-10

申请号：US13302862

申请日：2011-11-22

Applicant: Shih-Hsien Tseng

Inventor： Shih-Hsien Tseng

IPC: H01F7/06

CPC classification number: H01F27/2804 ,  H01F41/046 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract translation: 一种制造具有高电感的电感器的方法包括在临时载体上形成可除去的聚合物层; 在可除去的聚合物层上形成包括第一线圈，第二线圈和电介质层的结构; 在可去除的聚合物层和结构上形成第一磁性胶层; 移除临时载体; 以及在所述结构和所述第一磁性胶层下面形成第二磁性胶层。

公开(公告)号：US20130229251A1

公开(公告)日：2013-09-05

申请号：US13853083

申请日：2013-03-29

Applicant: Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F3/08 ,  H01F41/02

CPC classification number: H01F3/08 ,  H01F41/0246 ,  H01F2017/048

Abstract: An electronic device comprising a first magnetic powder, a second magnetic powder and a conducting wire buried in the mixture of the first magnetic powder and the second magnetic powder is provided. The conducting wire comprises an insulating encapsulant and a conducting metal encapsulated by the insulating encapsulant. The Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, and the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder. By means of the hardness difference of the first magnetic powder and the second magnetic powder, the mixture of the first magnetic powder and the second magnetic powder and the conducting wire buried therein are combined to form an integral magnetic body at the temperature lower than the melting point of the insulating encapsulant.

Abstract translation: 提供包括第一磁粉，第二磁粉和埋在第一磁粉和第二磁粉混合物中的导线的电子装置。 导线包括由绝缘密封剂封装的绝缘密封剂和导电金属。 第一磁性粉末的维氏硬度大于第二磁性粉末的维氏硬度，第一磁性粉末的平均粒径大于第二磁性粉末的平均粒径。 通过第一磁性粉末和第二磁性粉末的硬度差，将第一磁性粉末和第二磁性粉末与埋入其中的导线的混合物组合在一起形成一个低于熔化温度的整体磁体 点绝缘密封剂。