公开(公告)号：US20230252265A1

公开(公告)日：2023-08-10

申请号：US18126233

申请日：2023-03-24

Applicant: Silicon Storage Technology, Inc. ,  The Regents of the University of California

Inventor： Farnood Merrikh Bayat ,  Xinjie Guo ,  Dmitri Strukov ,  Nhan Do ,  Hieu Van Tran ,  Vipin Tiwari ,  Mark Reiten

IPC: G06N3/04 ,  G06N3/063 ,  G11C11/54 ,  G11C16/34 ,  G11C29/38 ,  G06N3/045 ,  G11C16/08 ,  G11C16/12 ,  G11C16/16 ,  G06F3/06

CPC classification number: G06N3/04 ,  G06N3/063 ,  G11C11/54 ,  G11C16/3436 ,  G11C29/38 ,  G06N3/045 ,  G11C16/08 ,  G11C16/12 ,  G11C16/16 ,  G06F3/061 ,  G06F3/0655 ,  G06F3/0688

Abstract: A method of scanning N×N pixels using a vector-by-matrix multiplication array by (a) associating a filter of M×M pixels adjacent first vertical and horizontal edges, (b) providing values for the pixels associated with different respective rows of the filter to input lines of different respective N input line groups, (c) shifting the filter horizontally by X pixels, (d) providing values for the pixels associated with different respective rows of the horizontally shifted filter to input lines, of different respective N input line groups, which are shifted by X input lines, (e) repeating steps (c) and (d) until a second vertical edge is reached, (f) shifting the filter horizontally to be adjacent the first vertical edge, and shifting the filter vertically by X pixels, (g) repeating steps (b) through (e) for the vertically shifted filter, and (h) repeating steps (f) and (g) until a second horizontal edge is reached.

公开(公告)号：US20230223077A1

公开(公告)日：2023-07-13

申请号：US18124334

申请日：2023-03-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C11/54 ,  H01L29/423 ,  G11C16/14 ,  H01L29/788 ,  G11C16/10 ,  G11C16/04

CPC classification number: G11C11/54 ,  H01L29/42324 ,  G11C16/14 ,  H01L29/7883 ,  H01L29/42328 ,  G11C16/10 ,  G06N3/045 ,  H10B41/30 ,  G11C16/0483

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

公开(公告)号：US11652162B2

公开(公告)日：2023-05-16

申请号：US17021678

申请日：2020-09-15

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Chien-Sheng Su ,  Nhan Do ,  Chunming Wang

IPC: H01L29/66 ,  H01L29/788 ,  H01L27/07 ,  H01L29/08 ,  H01L21/28 ,  H01L49/02 ,  H01L29/423

CPC classification number: H01L29/66825 ,  H01L27/0705 ,  H01L28/00 ,  H01L29/0847 ,  H01L29/40114 ,  H01L29/42328 ,  H01L29/66545 ,  H01L29/788 ,  G11C2216/10 ,  H01L29/6653

Abstract: A simplified method for forming a non-volatile memory cell using two polysilicon depositions. A first polysilicon layer is formed on and insulated from the semiconductor substrate in a first polysilicon deposition process. An insulation block is formed on the first polysilicon layer. Spacers are formed adjacent first and second sides of the insulation block, and with the spacer adjacent the first side is reduced. Exposed portions of the first poly silicon layer are removed while maintaining a polysilicon block of the first polysilicon layer disposed under the insulation block. A second polysilicon layer is formed over the substrate and the insulation block in a second polysilicon deposition process. Portions of the second polysilicon layer are removed while maintaining a first polysilicon block (disposed adjacent the first side of the insulation block), and a second polysilicon block (disposed adjacent the second side of the insulation block).

公开(公告)号：US11521683B2

公开(公告)日：2022-12-06

申请号：US17191392

申请日：2021-03-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Thuan Vu ,  Stanley Hong ,  Anh Ly ,  Vipin Tiwari ,  Nhan Do

IPC: G11C16/04 ,  G06N3/08 ,  H01L27/11521 ,  H01L29/788 ,  G06N3/04

Abstract: Numerous embodiments are disclosed for a high voltage generation algorithm and system for generating high voltages necessary for a particular programming operation in analog neural memory used in a deep learning artificial neural network. Compensation measures can be utilized that compensate for changes in voltage or current as the number of cells being programmed changes.

公开(公告)号：US11521682B2

公开(公告)日：2022-12-06

申请号：US17095661

申请日：2020-11-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Nhan Do ,  Vipin Tiwari ,  Mark Reiten

IPC: G11C16/04 ,  G06F17/16 ,  G06N3/063 ,  G06N3/08 ,  G06N3/04 ,  G11C7/04

Abstract: Numerous embodiments are disclosed for providing temperature compensation in an analog memory array. A method and related system are disclosed for compensating for temperature changes in an array of memory cells by measuring an operating temperature within the array of memory cells and changing a threshold voltage of a selected memory cell in the array of memory cells to compensate for a change in the operating temperature.

公开(公告)号：US11507816B2

公开(公告)日：2022-11-22

申请号：US16576533

申请日：2019-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G06N3/063 ,  G06F17/16 ,  G11C11/54 ,  G11C11/56

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

公开(公告)号：US20220336020A1

公开(公告)日：2022-10-20

申请号：US17850447

申请日：2022-06-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Steven Lemke ,  Hieu Van Tran ,  Yuri Tkachev ,  Louisa Schneider ,  Henry A. Om'mani ,  Thuan Vu ,  Nhan Do ,  Vipin Tiwari

IPC: G11C16/10 ,  G06N3/063 ,  G11C16/26 ,  G11C16/14

Abstract: Examples for ultra-precise tuning of a selected memory cell are disclosed. In one example, a method of programming a first memory cell in a neural memory to a target value is disclosed, the method comprising programming a second memory cell by applying programming voltages to terminals of the second memory cell; and determining if an output of the first memory cell has reached the target value.

公开(公告)号：US20220320125A1

公开(公告)日：2022-10-06

申请号：US17845782

申请日：2022-06-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Hung Quoc Nguyen ,  Nhan Do

IPC: H01L27/11526 ,  H01L27/11519 ,  H01L27/11521 ,  G11C16/04 ,  G11C16/14 ,  G11C16/26 ,  H01L29/423 ,  H01L29/788

Abstract: A memory device with memory cell pairs each having a single continuous channel region, first and second floating gates over first and second portions of the channel region, an erase gate over a third portion of the channel region between the first and second channel region portions, and first and second control gates over the first and second floating gates. For each of the pairs of memory cells, the first region is electrically connected to the second region of an adjacent pair of memory cells in the same active region, and the second region is electrically connected to the first region of an adjacent pair of the memory cells in the same active region.

公开(公告)号：US11444091B2

公开(公告)日：2022-09-13

申请号：US17129865

申请日：2020-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Jack Sun ,  Chunming Wang ,  Xian Liu ,  Andy Yang ,  Guo Xiang Song ,  Leo Xing ,  Nhan Do

IPC: H01L21/00 ,  H01L27/11531 ,  H01L27/11524 ,  H01L29/66 ,  H01L29/423 ,  H01L27/11529

Abstract: A method of forming a semiconductor device by recessing the upper surface of a semiconductor substrate in first and second areas but not a third area, forming a first conductive layer in the first and second areas, forming a second conductive layer in all three areas, removing the first and second conductive layers from the second area and portions thereof from the first area resulting in pairs of stack structures each with a control gate over a floating gate, forming a third conductive layer in the first and second areas, forming a protective layer in the first and second areas and then removing the second conductive layer from the third area, then forming blocks of conductive material in the third area, then etching in the first and second areas to form select and HV gates, and replacing the blocks of conductive material with blocks of metal material.

公开(公告)号：US11443175B2

公开(公告)日：2022-09-13

申请号：US16150606

申请日：2018-10-03

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Vipin Tiwari ,  Nhan Do

IPC: G06N3/063 ,  G11C11/56 ,  G06N3/04 ,  G06F3/06 ,  G06F17/16 ,  G06N3/08 ,  G11C13/00 ,  G11C16/04 ,  G11C16/28

Abstract: Numerous embodiments are disclosed for compensating for differences in the slope of the current-voltage characteristic curve among reference transistors, reference memory cells, and flash memory cells during a read operation in an analog neural memory in a deep learning artificial neural network. The embodiments are able to compensate for slope differences during both sub-threshold and linear operation of reference transistors.