公开(公告)号：US20220064466A1

公开(公告)日：2022-03-03

申请号：US17524891

申请日：2021-11-12

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Jayaprakash SUNDARAMURTHY ,  Siuli SARKAR ,  Ravindra M. BHATKAL

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.

公开(公告)号：US11193031B2

公开(公告)日：2021-12-07

申请号：US16613344

申请日：2018-05-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Jayaprakash Sundaramurthy ,  Siuli Sarkar ,  Ravindra M. Bhatkal

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00 ,  C09D11/30

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

公开(公告)号：US20210350949A1

公开(公告)日：2021-11-11

申请号：US17382980

申请日：2021-07-22

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11090768B2

公开(公告)日：2021-08-17

申请号：US14698450

申请日：2015-04-28

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K1/00 ,  B23K1/19 ,  C22C13/00 ,  C22C13/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K1/20 ,  B23K103/12

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：US20190389012A1

公开(公告)日：2019-12-26

申请号：US16098367

申请日：2017-05-02

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana De Avila Ribas ,  Suresh Telu ,  Pritha Choudhury ,  Anil K.N. Kumar ,  Siuli Sarkar

IPC: B23K35/26 ,  C22C13/02 ,  B23K1/00

Abstract: Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.

公开(公告)号：US20190262951A1

公开(公告)日：2019-08-29

申请号：US16404909

申请日：2019-05-07

Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Siuli Sarkar ,  Sujatha Chegudi ,  Anil K. N. Kumar ,  Kamanio Chattopadhyay ,  Dominic Lodge ,  Morgana de Avila Ribas

IPC: B23K35/26 ,  B23K35/02 ,  B23K1/005 ,  B23K1/002 ,  C22C13/02 ,  C22C12/00

Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.

公开(公告)号：US10259980B2

公开(公告)日：2019-04-16

申请号：US14438888

申请日：2013-10-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  C09K5/14 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US10130995B2

公开(公告)日：2018-11-20

申请号：US15302712

申请日：2015-04-10

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Sutapa Mukherjee

IPC: B22F9/24 ,  B22F1/00 ,  B22F1/02 ,  C09C1/62 ,  B22F9/04 ,  C09J1/00 ,  C09J9/02 ,  C09J11/04 ,  H01L23/00

Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.

公开(公告)号：US10059827B2

公开(公告)日：2018-08-28

申请号：US15148320

申请日：2016-05-06

Applicant: Alpha Assembly Solutions Inc.

Inventor： Rajan Hariharan ,  James Hurley ,  Senthil Kanagavel ,  Jose Quinones ,  Martin Sobczak ,  Deborah Makita

IPC: C08K5/09 ,  B23K35/36 ,  H01B1/22 ,  H01L23/498 ,  H01L23/492 ,  H05K7/02 ,  C08K3/08 ,  H01L23/04 ,  H01L23/31 ,  H01L23/00 ,  B23K101/36

CPC classification number: C08K5/09 ,  B23K35/3612 ,  B23K2101/36 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2003/0837 ,  C08K2003/085 ,  H01B1/22 ,  H01L23/04 ,  H01L23/3178 ,  H01L23/4928 ,  H01L23/49883 ,  H01L24/80 ,  H01L2224/03332 ,  H01L2224/03442 ,  H01L2224/80011 ,  H01L2924/0002 ,  H05K7/02 ,  H01L2924/00

Abstract: A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.

公开(公告)号：US20180056455A1

公开(公告)日：2018-03-01

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: B23K35/36 ,  C08K5/549 ,  C08K3/04 ,  B23K35/02 ,  H01L23/00 ,  H01L23/29

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.