公开(公告)号：US07960819B2

公开(公告)日：2011-06-14

申请号：US11486244

申请日：2006-07-13

申请人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

发明人： Ban P. Loh ,  Bernd Keller ,  Nicholas W. Medendorp, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A modular package for a light emitting device includes a leadframe having a top surface and including a central region having a bottom surface and having a first thickness between the top surface of the leadframe and the bottom surface of the central region. The leadframe may further include an electrical lead extending away from the central region. The electrical lead has a bottom surface and has a second thickness from the top surface of the leadframe to the bottom surface of the electrical lead. The second thickness may be less than the first thickness. The package further includes a package body on the leadframe surrounding the central region and exposing the bottom surface of the central region. The package body may be at least partially provided beneath the bottom surface of the lead and adjacent the bottom surface of the central region. Methods of forming modular packages and leadframes are also disclosed.

摘要翻译： 用于发光器件的模块化封装包括具有顶表面的引线框架，并且包括具有底表面的中心区域，并且在引线框架的顶表面和中心区域的底表面之间具有第一厚度。 引线框还可以包括远离中心区延伸的电引线。 电引线具有底表面并且具有从引线框架的顶表面到电引线的底表面的第二厚度。 第二厚度可以小于第一厚度。 所述封装还包括围绕所述中心区域并且暴露所述中心区域的底表面的所述引线框上的封装体。 封装体可以至少部分地设置在引线的底表面下方并且邻近中心区域的底表面。 还公开了形成模块化封装和引线框架的方法。

公开(公告)号：US20090321769A1

公开(公告)日：2009-12-31

申请号：US12491162

申请日：2009-06-24

申请人： Bernd Keller ,  Ban P. Loh

发明人： Bernd Keller ,  Ban P. Loh

IPC分类号： H01L33/00 ,  B05B7/24

CPC分类号： B41J3/407 ,  H01L21/6715 ,  H01L33/505 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2933/0041

摘要： Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

摘要翻译： 在液体介质中使用波长转换或荧光体颗粒的液滴涂覆半导体器件的方法和系统。 多个喷嘴将受控量的基质材料输送到半导体器件的表面，其中每个所述喷嘴具有用于基质材料通过的开口。 开口具有其中荧光体颗粒的直径小于或近似等于开口直径的一半的直径。 荧光体颗粒也基本上是球形或圆形。 喷嘴通常布置在打印头上，该打印头利用喷墨打印技术来覆盖具有基质材料层的半导体器件。 该方法和系统特别适用于用一层磷光体材料覆盖LED。

公开(公告)号：US20070278512A1

公开(公告)日：2007-12-06

申请号：US11443741

申请日：2006-05-31

申请人： Ban P. Loh ,  Nicholas W. Medendorp ,  Bernd Keller

发明人： Ban P. Loh ,  Nicholas W. Medendorp ,  Bernd Keller

IPC分类号： H01L33/00

CPC分类号： H01L33/58 ,  B29C45/14655 ,  B29C45/1671 ,  B29L2011/0016 ,  G02B19/0028 ,  G02B19/0052 ,  G02B19/0071 ,  H01L33/54 ,  Y10T156/10

摘要： A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.

摘要翻译： 封装的发光器件包括衬底，在衬底上的固态发光器件，在衬底上的第一大致环形透镜，并且相对于固态发光器件限定空腔并具有第一折射率，第二 透镜至少部分地在由第一透镜形成的空腔内，并且具有不同于第一折射率的第二折射率。 第二折射率可能高于第一折射率。 透镜可以安装在基板上和/或可以通过分配和固化液体密封剂材料而形成。

公开(公告)号：US07244965B2

公开(公告)日：2007-07-17

申请号：US10692351

申请日：2003-10-22

申请人： Peter S. Andrews ,  Ban P. Loh

发明人： Peter S. Andrews ,  Ban P. Loh

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive. In embodiments wherein the substrate is made from an electrically conductive material, the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material. The substrate has traces for connecting to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

摘要翻译： 公开了一种发光管芯封装。 模具封装包括基板，反射板和透镜。 衬底可以由导热但电绝缘的材料制成，或者由导热和导电的材料制成。 在衬底由导电材料制成的实施例中，衬底还包括形成在导电材料上的电绝缘的导热材料。 衬底具有用于连接到安装衬垫处的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装垫。 透镜基本上覆盖安装垫。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。 反射板包括反射表面，以在期望的方向上引导来自LED的光。

公开(公告)号：US08608349B2

公开(公告)日：2013-12-17

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： F21V3/00

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).

摘要翻译： 发光管芯封装包括基板，反射板和透镜。 衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。 反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。 透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。 在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

公开(公告)号：US08446004B2

公开(公告)日：2013-05-21

申请号：US12215319

申请日：2008-06-26

申请人： Ban P. Loh ,  Gerald H. Negley

发明人： Ban P. Loh ,  Gerald H. Negley

IPC分类号： H01L23/34

CPC分类号： H01L33/644 ,  H01L33/486 ,  H01L33/58 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

公开(公告)号：US20120061702A1

公开(公告)日：2012-03-15

申请号：US13149197

申请日：2011-05-31

申请人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Bernd P. Keller

发明人： Peter S. Andrews ,  Ban P. Loh ,  Nicholas W. Medendorp, JR. ,  Bernd P. Keller

IPC分类号： H01L33/58 ,  H01L33/52

CPC分类号： H01L33/54 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

摘要翻译： 用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域 并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。 第一和第二弯液面控制特征可以与管芯附接垫基本共面。 封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂 。 还公开了方法实施例。

公开(公告)号：US08123375B2

公开(公告)日：2012-02-28

申请号：US12093698

申请日：2006-11-17

申请人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

发明人： Gerald H. Negley ,  Paul E. Sims ,  Ban P. Loh

IPC分类号： F21V23/00

CPC分类号： H05B33/0803 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  G02F1/133603 ,  G02F2001/133613 ,  G09F9/35 ,  H01L2224/49175 ,  H01L2224/8592 ,  H05B33/0821 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0058 ,  Y10S362/80

摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.

摘要翻译： 固态照明瓦（10）包括具有平坦表面的基板。 第一多个固态发光器件（LED）在衬底上。 第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24） 瓦。 第二多个LED在基板上。 所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第一颜色的LED在所述瓷砖的第一端具有阴极接触（28），在所述第二颜色的第二端具有阳极接触（26） 瓦。

公开(公告)号：US20120025254A1

公开(公告)日：2012-02-02

申请号：US13253657

申请日：2011-10-05

申请人： Ban P. Loh ,  Nicholas W. Medendorp, JR.

发明人： Ban P. Loh ,  Nicholas W. Medendorp, JR.

IPC分类号： H01L33/58

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/34 ,  B29C2045/14844 ,  B29K2083/00 ,  B29K2995/0018 ,  B29L2011/0016 ,  H01L24/97 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

摘要翻译： 半导体发光器件封装方法包括制造在其上安装半导体发光器件的衬底。 衬底可以包括被配置为将半导体发光器件安装在其中的空腔。 半导体发光器件安装在基板上并电连接到基板的接触部分。 衬底被液体注射成型以形成在半导体发光器件上结合到衬底的光学元件。 之前可以在空腔中的电连接的半导体发光器件上施加软树脂。 还提供了半导体发光器件衬底条。

公开(公告)号：US20110186895A1

公开(公告)日：2011-08-04

申请号：US13023263

申请日：2011-02-08

申请人： Ban P. Loh

发明人： Ban P. Loh

IPC分类号： H01L33/60

CPC分类号： H01L33/58 ,  H01L33/54 ,  H01L33/641 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).