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公开(公告)号：US20120140210A1
公开(公告)日：2012-06-07
申请号：US13298747
申请日：2011-11-17
Applicant: Cheol Jun YOO , Young Hee SONG , Seong Deok HWANG
Inventor： Cheol Jun YOO , Young Hee SONG , Seong Deok HWANG
CPC classification number: G01R31/2635 , G01J1/0422 , G01J2001/4252
Abstract: A tray, a testing apparatus and a testing method using the same are disclosed. The testing apparatus includes a tray having a plurality of light sources received therein, the plurality of light sources outputting light when power is applied thereto; a plurality of optical receiver units arranged to correspond to the plurality of light sources and receiving the light outputted from each of the plurality of light sources; a plurality of probe units arranged to correspond to the plurality of light sources and applying power to each of the plurality of light sources; a power supply control unit selectively controlling power applied to the plurality of probe units; and an optical properties analyzing unit analyzing properties of optical signals from the light received by the optical receiver units.
Abstract translation: 公开了一种托盘，测试装置和使用其的测试方法。 该测试装置包括其中容纳有多个光源的托盘，当向其施加电力时，多个光源输出光; 多个光接收单元，被布置为对应于所述多个光源并接收从所述多个光源中的每一个输出的光; 多个探针单元，其布置成对应于所述多个光源并向所述多个光源中的每一个施加电力; 电源控制单元，选择性地控制施加到所述多个探针单元的电力; 以及光学性质分析单元，分析由光接收单元接收的光的光信号的特性。
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公开(公告)号：US20120138989A1
公开(公告)日：2012-06-07
申请号：US13309139
申请日：2011-12-01
Applicant: Cheol Jun YOO , Young Hee Song , Seong Deck Hwang , Sang Hyun Lee
Inventor： Cheol Jun YOO , Young Hee Song , Seong Deck Hwang , Sang Hyun Lee
CPC classification number: H01L33/62 , H01L24/97 , H01L25/0753 , H01L33/486 , H01L33/58 , H01L2224/32245 , H01L2224/48091 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/85
Abstract: A light emitting device package includes a plurality of lead frames separated from one another; at least one light emitting device provided with a wire bonding pad attached to a lower surface thereof opposite an upper light emission surface thereof, and mounted on the lead frames such that the wire bonding pad is positioned in a space between the lead frames; a bonding wire electrically connecting the wire bonding pad to the lead frame through the space between the lead frames; and a mold part encapsulating the lead frames, the light emitting device and the bonding wire, and having a reflection groove formed in an upper surface thereof to expose the light emission surface therethrough and a pad groove formed in a bottom surface thereof to expose a portion of the lead frame so as to form a solder pad thereon.
Abstract translation: 发光器件封装包括彼此分离的多个引线框架; 至少一个发光装置，其具有附接到与其上部发光表面相对的下表面的引线焊盘，并且安装在引线框上，使得引线接合焊盘位于引线框架之间的空间中; 接合线，通过引线框架之间的空间将引线接合焊盘电连接到引线框架; 以及封装引线框架，发光器件和接合线的模具部件，并且具有形成在其上表面中的反射槽以使发光表面透过，并且形成在其底表面中的焊盘槽暴露部分 以便在其上形成焊盘。
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公开(公告)号：US20120138974A1
公开(公告)日：2012-06-07
申请号：US13312572
申请日：2011-12-06
Applicant: Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
CPC classification number: H01L33/486 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/48227 , H01L2924/15321 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014
Abstract: There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.
Abstract translation: 提供了一种发光器件封装，包括：具有形成在其至少一个表面上并包括开口的电路图案的衬底; 通过用波长转换材料填充所述开口的至少一部分而形成的波长转换层; 以及设置在所述波长转换层的表面上并电连接到所述电路图案的至少一个发光器件。
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公开(公告)号：US08933474B2
公开(公告)日：2015-01-13
申请号：US13564330
申请日：2012-08-01
Applicant: Cheol Jun Yoo , Young Hee Song
Inventor： Cheol Jun Yoo , Young Hee Song
CPC classification number: H01L33/60 , H01L2224/13 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/18301 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
Abstract translation: 提供一种发光二极管（LED）封装及其制造方法。 LED封装包括：基板，包括电路层，安装在基板上的LED以及设置在除了基板上的LED安装区域之外的区域中的多个突出反射单元，其被配置为反射从LED产生的光。
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公开(公告)号：US08710513B2
公开(公告)日：2014-04-29
申请号：US13365922
申请日：2012-02-03
Applicant: Cheol-jun Yoo , Young-hee Song
Inventor： Cheol-jun Yoo , Young-hee Song
IPC: H01L33/62
CPC classification number: H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/00014
Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。
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Patent Agency Ranking
16.发明授权Phosphor film, method of forming the same, and method of coating phosphor layer on LED chips 有权磷光体膜，其形成方法以及在LED芯片上涂布荧光体层的方法公开(公告)号：US08546159B2
公开(公告)日：2013-10-01
申请号：US13217828
申请日：2011-08-25
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
CPC classification number: B32B3/10 , B32B3/08 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L33/50 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2933/0041 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00
Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.
Abstract translation: 公开了荧光体膜，形成荧光体膜的方法以及在发光芯片上涂布磷光体层的方法。 荧光体膜包括：基膜; 形成在所述基底膜上的荧光体层，其包含未完全固化的树脂材料和与所述不完全固化的树脂材料混合的荧光体颗粒; 以及形成在荧光体层上并保护荧光体层的覆盖膜。
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公开(公告)号：US20130049239A1
公开(公告)日：2013-02-28
申请号：US13599714
申请日：2012-08-30
Applicant: Cheol Jun YOO
Inventor： Cheol Jun YOO
CPC classification number: B29C45/34 , B29C45/14336 , B29L2011/0016
Abstract: A lens fabrication apparatus includes: a lens mold having a connection portion formed on one side thereof and disposed on a light emission surface of a light emitting unit; and a vacuum forming unit discharging air from within the lens mold to the outside through the connection portion or injecting a material into the lens mold through the connection portion.
Abstract translation: 一种透镜制造装置，包括：透镜模具，其具有形成在其一侧的连接部，并设置在发光单元的发光面上; 以及真空成型单元，其通过连接部将透镜模内的空气排出到外部，或者通过连接部将材料注入到透镜模具中。
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公开(公告)号：US20120268916A1
公开(公告)日：2012-10-25
申请号：US13428977
申请日：2012-03-23
Applicant: Cheol Jun Yoo
Inventor： Cheol Jun Yoo
CPC classification number: H01L33/647 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , Y10T29/4913 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a light emitting device including electrode pads; a body part supporting the light emitting device, including a reflective groove exposing an upper surface of the light emitting device in an upper surface thereof, and exposing a lower surface of the light emitting device through a lower surface thereof; and a lens part provided on the body part and covering the light emitting device.
Abstract translation: 提供了一种发光器件封装及其制造方法。 发光器件封装包括包括电极焊盘的发光器件; 支撑发光器件的主体部分，包括在其上表面中暴露发光器件的上表面的反射槽，并且通过其下表面暴露发光器件的下表面; 以及设置在主体部分上并覆盖发光装置的透镜部分。
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公开(公告)号：US20120205699A1
公开(公告)日：2012-08-16
申请号：US13365922
申请日：2012-02-03
Applicant: Cheol-jun YOO , Young-hee Song
Inventor： Cheol-jun YOO , Young-hee Song
CPC classification number: H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/00014
Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。
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公开(公告)号：US20120161181A1
公开(公告)日：2012-06-28
申请号：US13328864
申请日：2011-12-16
Applicant: Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun YOO , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC: H01L33/58
CPC classification number: H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。
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