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公开(公告)号：US08679872B2
公开(公告)日：2014-03-25
申请号：US13312572
申请日：2011-12-06
Applicant: Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
CPC classification number: H01L33/486 , H01L33/505 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/48227 , H01L2924/15321 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014
Abstract: There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.
Abstract translation: 提供了一种发光器件封装，包括：具有形成在其至少一个表面上并包括开口的电路图案的衬底; 通过用波长转换材料填充所述开口的至少一部分而形成的波长转换层; 以及设置在所述波长转换层的表面上并电连接到所述电路图案的至少一个发光器件。
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2.发明申请PHOSPHOR FILM, METHOD OF MANUFACTURING THE SAME, COATING METHOD OF PHOSPHOR LAYER, METHOD OF MANUFACTURING LED PACKAGE, AND LED PACKAGE MANUFACTURED THEREBY 有权磷光体膜，其制造方法，磷光体层的涂布方法，制造LED封装的方法和制造的LED封装公开(公告)号：US20130149508A1
公开(公告)日：2013-06-13
申请号：US13818373
申请日：2011-08-24
Applicant: Chang Hoon Kwak , Il Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
Inventor： Chang Hoon Kwak , Il Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
IPC: H01L33/50
CPC classification number: H01L33/50 , B32B3/08 , B32B3/10 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L24/97 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H05B33/22 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005 , H01L2924/00012
Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.
Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。
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3.发明授权Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof 有权发光二极管及其制造方法，发光二极管模块及其制造方法公开(公告)号：US08785953B2
公开(公告)日：2014-07-22
申请号：US13428726
申请日：2012-03-23
Applicant: Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
Inventor： Hak Hwan Kim , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。
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公开(公告)号：US08933474B2
公开(公告)日：2015-01-13
申请号：US13564330
申请日：2012-08-01
Applicant: Cheol Jun Yoo , Young Hee Song
Inventor： Cheol Jun Yoo , Young Hee Song
CPC classification number: H01L33/60 , H01L2224/13 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/18301 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A light emitting diode (LED) package and a manufacturing method thereof are provided. The LED package includes a substrate including a circuit layer, an LED mounted on the substrate, and a plurality of protruded reflection units disposed in a region excluding an LED mounting region on the substrate and configured to reflect light generated from the LED.
Abstract translation: 提供一种发光二极管（LED）封装及其制造方法。 LED封装包括：基板，包括电路层，安装在基板上的LED以及设置在除了基板上的LED安装区域之外的区域中的多个突出反射单元，其被配置为反射从LED产生的光。
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Patent Agency Ranking
公开(公告)号：US20120268916A1
公开(公告)日：2012-10-25
申请号：US13428977
申请日：2012-03-23
Applicant: Cheol Jun Yoo
Inventor： Cheol Jun Yoo
CPC classification number: H01L33/647 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2924/01322 , H01L2924/181 , H01L2924/1815 , H01L2924/18165 , Y10T29/4913 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a light emitting device including electrode pads; a body part supporting the light emitting device, including a reflective groove exposing an upper surface of the light emitting device in an upper surface thereof, and exposing a lower surface of the light emitting device through a lower surface thereof; and a lens part provided on the body part and covering the light emitting device.
Abstract translation: 提供了一种发光器件封装及其制造方法。 发光器件封装包括包括电极焊盘的发光器件; 支撑发光器件的主体部分，包括在其上表面中暴露发光器件的上表面的反射槽，并且通过其下表面暴露发光器件的下表面; 以及设置在主体部分上并覆盖发光装置的透镜部分。
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6.发明授权Phosphor film, method of manufacturing the same, coating method of phosphor layer, method of manufacturing LED package, and LED package manufactured thereby 有权荧光体膜，其制造方法，荧光体层的涂布方法，LED封装的制造方法以及由此制造的LED封装公开(公告)号：US08795817B2
公开(公告)日：2014-08-05
申请号：US13818373
申请日：2011-08-24
Applicant: Chang Hoon Kwak , II Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
Inventor： Chang Hoon Kwak , II Woo Park , Kyu Jin Lee , Cheol Jun Yoo , Seong Jae Hong
CPC classification number: H01L33/50 , B32B3/08 , B32B3/10 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L24/97 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/00011 , H01L2924/181 , H01L2933/0041 , H05B33/22 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00 , H01L2924/01049 , H01L2924/01005 , H01L2924/00012
Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.
Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。
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7.发明授权Method of manufacturing semiconductor light emitting device and mask for application of paste used therefor 有权制造半导体发光元件的制造方法以及用于其的膏体的涂布面罩公开(公告)号：US08741675B2
公开(公告)日：2014-06-03
申请号：US13409641
申请日：2012-03-01
Applicant: Cheol Jun Yoo , Seong Jae Hong
Inventor： Cheol Jun Yoo , Seong Jae Hong
CPC classification number: H01L33/505 , H01L33/38 , H01L2933/0041
Abstract: Provided are a mask for an application of paste and a method of manufacturing a semiconductor light emitting device by using the same. The method includes preparing a light emitting structure including first and second conductive semiconductor layers and an active layer disposed therebetween, which has at least one electrode formed on a surface of the light emitting structure; disposing a mask having an open part exposing a portion of the surface of the light emitting structure therethrough and a recess part corresponding the electrode in a region thereof on a surface of the light emitting structure; and applying wavelength conversion material-containing paste to the surface of the light emitting structure through the open part.
Abstract translation: 提供了一种用于施加糊剂的掩模和使用该方法制造半导体发光器件的方法。 该方法包括制备包括第一和第二导电半导体层和设置在其间的有源层的发光结构，其具有形成在发光结构的表面上的至少一个电极; 在所述发光结构的表面上配置具有使所述发光结构体的表面的一部分露出的开口部的掩模和与所述电极对应的凹部， 并通过开放部分将波长转换材料的浆料涂覆到发光结构的表面。
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公开(公告)号：US08587010B2
公开(公告)日：2013-11-19
申请号：US13328864
申请日：2011-12-16
Applicant: Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
Inventor： Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
IPC: H01L33/00
CPC classification number: H01L33/60 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00
Abstract: Provided is a light emitting device package including: a plurality of lead frames disposed to be separated from one another; at least one light emitting device mounted on the lead frames and electrically connected to the lead frames through a bonding wire provided on a wire bonding pad, the wire bonding pad being disposed on the same surface as a light emission surface provided as an upper surface of the light emitting device; a body part formed to encapsulate and support the wire bonding pad, the bonding wire, the light emitting device and the lead frames, and having a reflective groove formed in an upper surface thereof to expose the light emission surface to the outside therethrough; and a lens part disposed on the body part, to cover the light emitting device.
Abstract translation: 提供了一种发光器件封装，包括：多个引线框架，被布置成彼此分离; 至少一个发光装置，其安装在引线框架上，并通过设置在引线接合焊盘上的接合线电连接到引线框架，所述引线接合焊盘设置在作为上表面设置的发光面的同一表面上 发光装置; 形成为封装并支撑引线接合焊盘，接合线，发光器件和引线框架的主体部分，并且具有形成在其上表面中的反射槽，以将发光表面暴露于外部; 以及设置在主体部分上的透镜部分，以覆盖发光器件。
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9.发明申请LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE MODULE, AND MANUFACTURING METHOD THEREOF 有权发光二极管，其制造方法，发光二极管模块及其制造方法公开(公告)号：US20120241797A1
公开(公告)日：2012-09-27
申请号：US13428726
申请日：2012-03-23
Applicant: Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
Inventor： Hak Hwan KIM , Min Jung Kim , Kyung Mi Moon , Jong Sup Song , Jae Sung You , Ill Heoung Choi , Cheol Jun Yoo
IPC: H01L33/50
CPC classification number: H01L33/62 , H01L21/568 , H01L33/505 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/73265 , H01L2224/73267 , H01L2224/92144 , H01L2224/97 , H01L2924/15153 , H01L2933/0041 , H01L2924/00014 , H01L2224/83
Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.
Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。
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