摘要:
A nonvolatile SRAM cell (20) includes a six-transistor SRAM cell portion (22) and a three-transistor nonvolatile memory portion (30). The nonvolatile memory portion (30) is connected to one storage node (101) of the SRAM cell portion (22). The nonvolatile SRAM cell (20) is three-dimensionally integrated in four layers of polysilicon. The nonvolatile memory portion (30) includes a thin film memory cell (32) having an oxide-nitride-oxide structure (41), and is programmable with a relatively low programming voltage. The three-dimensional integration of the nonvolatile SRAM cell (20) and relatively low programming voltage results in lower power consumption and smaller cell size.
摘要:
The present invention includes a BiMOS device having an MOS transistor that triggers a bipolar transistor, wherein the base and channel region are formed within a well region that electrically floats. The present invention also includes a BiMOS device having separate regions for the collector and drain regions and for the base and channel regions. The present invention further includes processes for forming the BiMOS devices. The BiMOS device may include a floating well region. The BiMOS device may include both low voltage MOS logic transistors and a high voltage or high power bipolar transistor. A low voltage or low power bipolar transistor may also be used. Separate drain, collector, base, and channel regions allow the bipolar transistor performance to be optimized independently of the MOS transistor, which may have its performance independently optimized, too. A plurality of MOS logic transistors, such as an AND or an OR gate may be used in the BiMOS device.
摘要:
A thin film transistor with self-aligned source and drain regions is fabricated, in one embodiment, by forming an opening (124) in a dielectric layer (118) which overlies a substrate (116). A semiconductive sidewall spacer (130) is formed around the perimeter (126) of the opening (124) and adjacent to the sidewall (128) of the opening (124). A first electrode region (120) is electrically coupled to a first portion of the semiconductive sidewall spacer (130) at a first location along the perimeter (126) of the opening (124) which lies only in the second lateral half of the opening (124). A second electrode region (122) is electrically coupled to a second portion of the semiconductive sidewall spacer (130) at a second location along the perimeter (126) of the opening (124) which lies only in the first lateral half of the opening (124). A dielectric layer (132) is formed adjacent to the semiconductive sidewall spacer (130). A control electrode (134) is formed adjacent to the dielectric layer (132).
摘要:
A semiconductor device (20) makes contact between a first metal line (22) and an overlying second metal line (24) without the need for a conductive landing pad. Sidewall spacers (30) are formed adjacent sides of metal lines (22) such that during formation of a via (34) in an overlying dielectric layer (32), the sidewall spacer prevent trenching of underlying dielectric layer (28) if the via is misaligned. The sidewall spacers are formed of a dielectric material which has an etch rate which is significantly slower than the etch rate of dielectric layer (32). In another embodiment, portions of the sidewall spacers are selectively removed prior to depositing a second metal layer (42). Upon depositing the second metal layer, the side of metal line (22) is locally clad with the second metal to increase contact area and lowering contact resistance.
摘要:
A nested surface capacitor and method of formation. The nested surface capacitor has a substrate (14) and an overlying dielectric layer (16). Conductive layer (18) overlies the dielectric layer (16). Three conductive cylindrical structures respectively referred to as an inner cylinder (30), a central cylinder (22') and an outer cylinder (32) overlie the conductive layer (18). The inner cylinder (30) lies within the central cylinder (22'). The central cylinder (22') lies within the outer cylinder (32). Together, the conductive layer (18) and the cylinders (30, 22', and 32) form a first electrode for the nested surface capacitor. A dielectric layer (38) overlying the cylinders (30, 22', and 32) and the conductive layer (18) acts as a capacitor dielectric. A conductive layer (40) overlying the dielectric layer (38) forms a second electrode of the capacitor.
摘要:
The surface area of a polysilicon electrode is increased by sputtering non-coalescing islands (20) of aluminum onto a silicon dioxide layer (18), which is overlying the polysilicon electrode. The sputtering process allows uniform island formation to be achieved independent of the deposition surface. The non-coalescing islands are then used as a mask, and a portion of the buffer layer (22) and a portion of the polysilicon electrode (26) are etched to form pillar-like regions (30) within the polysilicon electrode.
摘要:
A semiconductor device is formed by a process in which a diffusant penetration layer and a diffusant source layer containing a boron dopant are formed overlaying the surface of a semiconductor substrate. The diffusant source layer is annealed to cause the boron dopant to controllably diffuse through the diffusant penetration layer to the semiconductor substrate to form a doped region at the surface. The diffusant source layer and the diffusant penetration layer are removed and a gate insulator is formed on the substrate surface overlaying the doped region. An N doped gate electrode is then formed overlaying the gate insulator.
摘要:
A self-aligned one transistor-capacitor memory cell is provided which uses an n-channel MOS transistor having separate drain and source regions with a first level polysilicon conductor coupled to the top plate of the capacitor and separate second level polysilicon conductors coupled to the gate and drain of the transistor. A reduction in a dimension of the memory cell is acheived compared to a similar memory cell which uses only one level of conductors.
摘要:
A dynamic random access memory obtains improved access time for reading data from a multiplicity of memory cells along a given selected row. This is obtained by allowing the output data line to remain active between activations of a column enable signal. An increase in data valid time at the memory output is obtained, while allowing increased latitude in memory address setup time.
摘要:
The current in a semiconductive light emitting diode (LED), driven by an insulated gate field effect transistor (IGFET) switch, is stabilized by a current control circuit including a comparator type feedback network, which stabilizes the voltage at a node located between said switch and the series connection of a ballast resistor and the LED.