摘要:
Provided are transistors, semiconductor integrated circuit interconnections and methods of forming the same. The transistors, semiconductor integrated circuit interconnections and methods of forming the same may improve electrical characteristics between gate electrodes or interconnection electrodes and simplify a semiconductor fabrication process related to gate electrodes or interconnection electrodes. A material layer having first and second regions may be prepared. A trench may be formed in a selected portion of the first region. Transistors or semiconductor integrated circuit interconnections may be in the first and second regions, respectively. One of the transistors or the semiconductor integrated circuit interconnections may be formed in the trench. The transistors or the semiconductor integrated circuit interconnections may be electrically insulated from each other.
摘要:
A semiconductor device comprising a barrier insulating layer and a related method of fabrication is disclosed. The semiconductor device semiconductor substrate includes a plurality of active regions, wherein active regions are defined by a device isolation layer and are disposed along a first direction; a plurality of bit line electrodes connected to the active regions, wherein each of the bit line electrodes extends along a second direction; and a plurality of first barrier insulating layers. Each of the first barrier insulating layers extends along a third direction, at least one of the first barrier insulating layers is disposed on a corresponding first portion of the device isolation layer disposed between two of the active regions, the two of the active regions are adjacent along the first direction, and the first direction and the second direction differ from one another.
摘要:
In a semiconductor memory device having a vertical channel transistor a body of which is connected to a substrate and a method of fabricating the same, the semiconductor memory device includes a semiconductor substrate including a plurality of pillars arranged spaced apart from one another, and each of the pillars includes a body portion and a pair of pillar portions extending from the body portion and spaced apart from each other. A gate electrode is formed to surround each of the pillar portions. A bitline is disposed on the body portion to penetrate a region between a pair of the pillar portions of each of the first pillars arranged to extend in a first direction. A wordline is disposed over the bitline, arranged to extend in a second direction intersecting the first direction, and configured to contact the side surface of the gate electrode. A first doped region is formed in the upper surface of each of the pillar portions of the pillar. A second doped region is formed on the body portion of the pillar and connected electrically to the bitline. Storage node electrodes are connected electrically to the first doped region and disposed on each of the pillar portions.
摘要:
A semiconductor device may include a substrate having a cell active region. A cell gate electrode may be formed in the cell active region. A cell gate capping layer may be formed on the cell gate electrode. At least two cell epitaxial layers may be formed on the cell active region. One of the at least two cell epitaxial layers may extend to one end of the cell gate capping layer and another one of the at least two cell epitaxial layers may extend to an opposite end of the cell gate capping layer. Cell impurity regions may be disposed in the cell active region. The cell impurity regions may correspond to a respective one of the at least two cell epitaxial layers.
摘要:
Embodiments of a semiconductor device having storage nodes include an interlayer insulating layer disposed on a semiconductor substrate; a conductive pad disposed in the interlayer insulating layer to contact with a predetermined portion of the substrate, an upper portion of the conductive pad protruding above the interlayer insulating layer; an etch stop layer disposed on the conductive pad and the interlayer insulating layer; and storage nodes penetrating the etch stop layer and disposed on the conductive pad. A penetration path of wet etchant is completely blocked during the wet etch process that removes the mold oxide layer. Therefore, inadvertent etching of the insulating layer due to penetration of wet etchant is prevented, resulting in a stronger, more stable, storage node structure.
摘要:
A translational-loop transmitter generates RF signals using at most one phase-locked-loop (PLL) circuit. In one embodiment, a single PLL generates two local oscillation signals. The first oscillation signal is mixed with a baseband signal to generate an intermediate frequency signal. The second oscillation signal is input into the translational loop to adjust a voltage-controlled oscillator to the desired carrier frequency. In order to perform this type of modulation, the frequencies of the local oscillation signals are set so that they are harmonically related to one another relative to the carrier frequency. Other embodiments generate only one oscillation signal. Under these conditions, the intermediate frequency signal is generated using the oscillation signal, and a frequency divider in the translational loop is used to generate a control signal for adjusting the voltage-controlled oscillator to the carrier frequency. In still other embodiments, a transmitter signal is generated without using any phase-locked-loop circuits. This is accomplished by generating an intermediate frequency signal using a crystal oscillator, and then using a frequency divider in a feedback loop to generate a control signal for adjusting the voltage-controlled oscillator to the carrier frequency. By minimizing the number of phase-locked-loop circuits in the transmitter, the size, cost, and power requirements of mobile handsets may be significantly reduced.
摘要:
A buried bit line DRAM cell includes an active region having a protruding tap, formed in a semiconductor substrate. A device isolation region is formed in the substrate, outside the active region. A bit line laterally contacts the tap and is buried in the device isolation region. Accordingly, photolithography steps for forming a device isolation film twice and for forming a bit line contact can be omitted, thereby obtaining process simplicity and wider process margins.
摘要:
Channels of two transistors are vertically formed on portions of two opposite side surfaces of one active region, and gate electrodes are vertically formed on a device isolation layer contacting the channels of the active region. A common bit line contact plug is formed in the central portions of the active region, two storage node contact plugs are formed on both sides of the bit line contact plug, and an insulating spacer is formed on a side surface of the bit line contact plug. A word line, a bit line, and a capacitor are sequentially stacked on the semiconductor substrate, like a conventional semiconductor memory device. Thus, effective space arrangement of a memory cell is possible such that a 4F2 structure is constituted, and a conventional line and contact forming process can be applied such that highly integrated semiconductor memory device is readily fabricated.
摘要:
A digital Phase Locked Loop (PLL) in a wireless communication system is provided. The PLL includes a Digitally Controlled Oscillator (DCO), a divider, a Phase Frequency Detector (PFD), a Time to Digital Converter (TDC), a delay comparator, and a level scaler. The DCO generates a frequency signal depending on an input Digital Tuning Word (DTW). The divider divides the frequency signal at an integer ratio. The PFD generates a signal representing a phase difference between a divided frequency signal and a reference signal. The TDC measures a time interval of the phase difference using the signal representing the phase difference. The delay comparator calculates a time interval in the case where rising edges coincide from values measured by the TDC. The level scaler generates a DTW that operates the DCO using a digital code representing the time interval.
摘要:
There are provided a semiconductor device having a vertical transistor and a method of fabricating the same. The method includes preparing a semiconductor substrate having a cell region and a peripheral circuit region. Island-shaped vertical gate structures two-dimensionally aligned along a row direction and a column direction are formed on the substrate of the cell region. Each of the vertical gate structures includes a semiconductor pillar and a gate electrode surrounding a center portion of the semiconductor pillar. A bit line separation trench is formed inside the semiconductor substrate below a gap region between the vertical gate structures, and a peripheral circuit trench confining a peripheral circuit active region is formed inside the semiconductor substrate of the peripheral circuit region. The bit line separation trench is formed in parallel with the column direction of the vertical gate structures. A bit line separation insulating layer and a peripheral circuit isolation layer are formed inside the bit line separation trench and the peripheral circuit trench, respectively.