公开(公告)号：US20120141851A1

公开(公告)日：2012-06-07

申请号：US12960732

申请日：2010-12-06

Applicant: Suyu Hou ,  Anthony Giammarise ,  John Dowell ,  Roland Sedziol ,  Peter Kalish ,  Kristopher Frutschy ,  Neil Anthony Johnson ,  David Vanderwerker ,  George Hansen

Inventor： Suyu Hou ,  Anthony Giammarise ,  John Dowell ,  Roland Sedziol ,  Peter Kalish ,  Kristopher Frutschy ,  Neil Anthony Johnson ,  David Vanderwerker ,  George Hansen

IPC: H01M2/10

CPC classification number: H01M2/1088 ,  H01M2/1094 ,  H01M2/208 ,  Y10T29/4911

Abstract: An enclosure for an energy storage device is presently disclosed. The enclosure includes a cell housing having a base portion and at least one side portion seamlessly extending from the base portion to define a volume and having a peripheral edge defining an aperture distal from the base portion through which an electrochemical cell may be disposed within the volume, and a cover securable to the peripheral edge of the housing, where the housing and cover are configured to house at least one electrochemical cell at an operating temperature greater than about 100 degrees Celsius. The enclosure may also include an environmental housing configured to nestingly receive the cell housing, and an insulating element disposed between the environmental housing and the cell housing. Also disclosed is a method of packaging the energy storage device utilizing the enclosure.

Abstract translation: 目前公开了一种用于储能装置的外壳。 所述外壳包括电池壳体，所述电池壳体具有底座部分和至少一个侧部部分，所述至少一个侧部部分从所述基部部分无缝地延伸以限定容积并且具有限定远离所述基部的孔的周边边缘，电化学电池可以通过所述基部 以及可固定到壳体的周边边缘的盖子，其中壳体和盖被构造成容纳在大于约100摄氏度的工作温度下的至少一个电化学电池。 外壳还可以包括被配置为嵌套地容纳电池壳体的环境壳体，以及设置在环境壳体和电池壳体之间的绝缘元件。 还公开了利用外壳封装储能装置的方法。

公开(公告)号：US20070120149A1

公开(公告)日：2007-05-31

申请号：US11669361

申请日：2007-01-31

Applicant: Kristopher Frutschy ,  Chee-Yee Chung ,  Bob Sankman

Inventor： Kristopher Frutschy ,  Chee-Yee Chung ,  Bob Sankman

IPC: H01L27/10

CPC classification number: H01L23/50 ,  H01L23/49805 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/3011

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract translation: 用于安排半导体封装的电源。

公开(公告)号：US07173329B2

公开(公告)日：2007-02-06

申请号：US09964586

申请日：2001-09-28

Applicant: Kristopher Frutschy ,  Chee-Yee Chung ,  Bob Sankman

Inventor： Kristopher Frutschy ,  Chee-Yee Chung ,  Bob Sankman

IPC: H01L23/04 ,  H01L238/48 ,  H01L23/52 ,  H01L23/34

CPC classification number: H01L23/50 ,  H01L23/49805 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/3011

Abstract: Arrangements are used to supply power to a semiconductor package.

Abstract translation: 用于安排半导体封装的电源。

公开(公告)号：US06975518B2

公开(公告)日：2005-12-13

申请号：US10446462

申请日：2003-05-28

Applicant: Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffrey L. Reid

Inventor： Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffrey L. Reid

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/32 ,  H05K7/10 ,  H05K3/30 ,  H05K7/12

CPC classification number: H05K1/0263 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y10T29/4913

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract translation: 电子组件包括用于向集成电路（IC）封装（308）提供电流的一个或多个导电钳位件（302,304，图3）。 导电夹具连接到印刷电路板（PC）（312），该印刷电路板（312）通过一个夹具将电流提供给IC封装，并且通过另一个夹具接收来自IC封装的返回电流。 每个夹具接触PC板表面上的接触焊盘（330），并接触IC封装顶表面上的另一接触焊盘（334）。 封装内的通孔（338,339）和导电平面（340,342）然后将电流传送到连接到封装的IC（例如，IC 306）。 在另一个实施例中，夹具（904，图9）将导电结构（902）保持在PC板接触焊盘（908）和IC封装接触焊盘（914）之间的适当位置，电流主要承载在导电结构 ，而不是超过钳位。

公开(公告)号：US20050142695A1

公开(公告)日：2005-06-30

申请号：US10748344

申请日：2003-12-29

Applicant: Kristopher Frutschy

Inventor： Kristopher Frutschy

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/13147 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/19042 ,  H01L2924/00

Abstract: A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using induction heating to form the bond.

Abstract translation: 描述将半导体管芯接合到衬底的方法。 该方法包括以适当的配置布置半导体管芯，互连件和衬底，并且使用感应加热来形成接合。

公开(公告)号：US06661660B2

公开(公告)日：2003-12-09

申请号：US09970954

申请日：2001-10-04

Applicant: Ravi Prasher ,  Abhay A. Watwe ,  Gregory M. Chrysler ,  Kristopher Frutschy ,  Leo Ofman ,  Ajit V. Sathe

Inventor： Ravi Prasher ,  Abhay A. Watwe ,  Gregory M. Chrysler ,  Kristopher Frutschy ,  Leo Ofman ,  Ajit V. Sathe

IPC: H05K720

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

公开(公告)号：US20070048904A1

公开(公告)日：2007-03-01

申请号：US11590163

申请日：2006-10-30

Applicant: Kristopher Frutschy

Inventor： Kristopher Frutschy

IPC: H01L21/00

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/10 ,  H01L24/13 ,  H01L24/97 ,  H01L2224/0554 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/7598 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Methods and systems for attaching a chip to a next level package by directing radiant energy at the chip back side while substantially preventing irradiation of the next level package are described.

公开(公告)号：US07045890B2

公开(公告)日：2006-05-16

申请号：US09964494

申请日：2001-09-28

Applicant: Hong Xie ,  Kristopher Frutschy ,  Koushik Banerjee ,  Ajit Sathe

Inventor： Hong Xie ,  Kristopher Frutschy ,  Koushik Banerjee ,  Ajit Sathe

IPC: H05K1/16 ,  H05K7/20 ,  H01L23/34 ,  H01L23/367 ,  H01L23/12

CPC classification number: H01L23/36 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

Abstract: A heat spreader and stiffener device has a stiffener portion extending towards a center of the heat spreader and stiffener device and mountable to a die-side surface of a substrate.

Abstract translation: 散热器和加强装置具有朝向散热器和加强装置的中心延伸并可安装到基板的模具侧表面的加强部分。

公开(公告)号：US06877223B2

公开(公告)日：2005-04-12

申请号：US10176302

申请日：2002-06-20

Applicant: David G. Figueroa ,  Chee-Yee Chung ,  Kristopher Frutschy ,  Farzaneh Yahyaei-Moayyed

Inventor： David G. Figueroa ,  Chee-Yee Chung ,  Kristopher Frutschy ,  Farzaneh Yahyaei-Moayyed

IPC: H01R13/658 ,  H01R43/00

CPC classification number: H01R13/6585 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49211 ,  Y10T29/49222

Abstract: A method for fabricating a socket (300, FIG. 3) includes fabricating a conductive structure (310, FIG. 3) and embedding the conductive structure in a housing (302). The housing includes multiple openings (304) formed in the top surface. Each opening (304) provides access to conductive contacts (502, FIG. 5), which provide an electrical interface between a device that is inserted into the socket and the next level of interconnect (e.g., a PC board). In one embodiment, the embedded conductive structure (310) is electrically connected to one or more ground conducting contacts (708, FIG. 7B). The conductive structure includes column walls (312), which run in parallel with columns of contacts, and row walls (314), which run in parallel with rows of contacts and which intersect the column walls. In this manner, the conductive structure forms multiple chambers (402, FIG. 4).

Abstract translation: 用于制造插座（300，图3）的方法包括制造导电结构（310，图3）并将导电结构嵌入壳体（302）中。 壳体包括形成在顶表面中的多个开口（304）。 每个开口（304）提供对导电触点（502，图5）的访问，其提供插入到插座中的装置与下一级互连（例如，PC板）之间的电接口。 在一个实施例中，嵌入式导电结构（310）电连接到一个或多个接地导电触头（图7B的708）。 导电结构包括与触点列平行延伸的柱壁（312）和平行于触点行并与柱壁相交的行壁（314）。 以这种方式，导电结构形成多个室（图4中的402）。

公开(公告)号：US20050026465A1

公开(公告)日：2005-02-03

申请号：US10630583

申请日：2003-07-29

Applicant: Kristopher Frutschy

Inventor： Kristopher Frutschy

IPC: H05K7/10 ,  H01R12/00

CPC classification number: H05K7/1061 ,  H01R12/523 ,  H01R12/585

Abstract: A socket for a microelectronic component is provided. The socket has a base with metal power and ground layers, and further includes a plurality of electrically conductive socket members, some of which are connected in parallel to the metal power layer, others being connected in parallel to the metal ground layer, while others are insulated from both the metal power and ground layers for purposes of providing signals. Each electrically conductive socket member has a protrusion that breaks through an inner insulating layer that defines an opening into which the electrically conductive socket member is inserted. The protrusions are at different heights, so that some of the protrusions make contact with the metal power layer, while others are connected to the metal ground layer or to a dielectric core layer.

Abstract translation: 提供了一种用于微电子部件的插座。 插座具有带有金属电源和接地层的底座，并且还包括多个导电插座构件，其中一些导电插座构件与金属功率层平行地连接，而另一些与金属接地层并联连接，而另一些 与金属电源和接地层绝缘，以提供信号。 每个导电插座构件具有突出部，该突起突破限定了插入导电插座构件的开口的内部绝缘层。 突起处于不同的高度，使得一些突起与金属功率层接触，而其它突起与金属接地层或介电芯层连接。