Methods of manufacturing a capacitor and a semiconductor device
    13.
    发明申请
    Methods of manufacturing a capacitor and a semiconductor device 审中-公开
    制造电容器和半导体器件的方法

    公开(公告)号:US20060115954A1

    公开(公告)日:2006-06-01

    申请号:US11265937

    申请日:2005-11-03

    CPC classification number: H01L28/91 H01L27/10817 H01L27/10852

    Abstract: In methods of manufacturing a capacitor and a semiconductor device, a mold layer is formed on a substrate having a contact plug. The mold layer includes an opening exposing the contact plug. A conductive layer is formed on the contact plug, an inner sidewall of the opening and the mold layer. A photoresist pattern is formed to substantially fill the opening. A cylindrical lower electrode is formed by partially removing the conductive layer. The mold layer is selectively removed while the photoresist pattern prevents damage to the lower electrode, the contact plug and the substrate. The photoresist pattern is removed, and then a dielectric layer and an upper electrode are sequentially formed on the lower electrode. Damage to the lower electrode and the contact plug are effectively prevented due to the presence of the photoresist pattern during selective removal of the mold layer.

    Abstract translation: 在制造电容器和半导体器件的方法中,在具有接触插塞的基板上形成模层。 模具层包括露出接触塞的开口。 在接触插塞,开口的内侧壁和模具层上形成导电层。 形成光致抗蚀剂图案以基本上填充开口。 通过部分去除导电层形成圆柱形下电极。 选择性地去除模具层,同时光刻胶图案防止损坏下部电极,接触插塞和基板。 去除光致抗蚀剂图案,然后在下电极上依次形成电介质层和上电极。 由于在选择性去除模具层期间存在光致抗蚀剂图案,因此有效地防止了下电极和接触插塞的损坏。

    Method of manufacturing a semiconductor device
    14.
    发明申请
    Method of manufacturing a semiconductor device 审中-公开
    制造半导体器件的方法

    公开(公告)号:US20060073670A1

    公开(公告)日:2006-04-06

    申请号:US11243397

    申请日:2005-10-03

    CPC classification number: H01L28/91 H01L21/7682 H01L27/10852 H01L27/10894

    Abstract: In one embodiment, first and second multi-layer pattern structures are formed over first and second regions of a substrate, respectively. The first and second multi-layer pattern structures include first and second support layer patterns, respectively. The first and second multi-layer pattern structures define first and second openings, respectively. The first and second openings partially expose a portion of the first region and a portion of the second region, respectively. First and second liner patterns are formed on an inner face of the first opening and an inner face of the second opening, respectively. A first etching process is performed on the first multi-layer pattern structure until the first support layer pattern is removed. A second etching process is performed to remove the second multi-layer pattern structure except for the second support layer pattern.

    Abstract translation: 在一个实施例中,分别在衬底的第一和第二区域上形成第一和第二多层图案结构。 第一和第二多层图案结构分别包括第一和第二支撑层图案。 第一和第二多层图案结构分别限定第一和第二开口。 第一和第二开口分别部分地暴露第一区域的一部分和第二区域的一部分。 第一和第二衬里图案分别形成在第一开口的内表面和第二开口的内表面上。 对第一多层图案结构进行第一蚀刻处理,直到第一支撑层图案被去除。 执行第二蚀刻处理以除去除了第二支撑层图案之外的第二多层图案结构。

    Method of forming patterns of semiconductor device
    19.
    发明授权
    Method of forming patterns of semiconductor device 有权
    形成半导体器件图案的方法

    公开(公告)号:US08263487B2

    公开(公告)日:2012-09-11

    申请号:US12655344

    申请日:2009-12-29

    Abstract: A method of forming fine patterns of a semiconductor device by using carbon (C)-containing films includes forming an etching target film on a substrate including first and second regions; forming a plurality of first C-containing film patterns on the etching target film in the first region; forming a buffer layer which covers top and side surfaces of the plurality of first C-containing film patterns; forming a second C-containing film; removing the second C-containing film in the second region; exposing the plurality of first C-containing film patterns by removing a portion of the buffer layer in the first and second regions; and etching the etching target film by using the plurality of first C-containing film patterns, and portions of the second C-containing film which remain in the first region, as an etching mask.

    Abstract translation: 通过使用含碳(C)的膜来形成半导体器件的精细图案的方法包括在包括第一和第二区域的衬底上形成蚀刻靶膜; 在所述第一区域中的所述蚀刻目标膜上形成多个第一含C膜的图案; 形成覆盖所述多个第一含C膜图案的顶表面和侧表面的缓冲层; 形成第二含C膜; 去除第二区域中的第二含C膜; 通过去除第一和第二区域中的缓冲层的一部分来暴露多个第一含C膜的图案; 并且通过使用多个第一含C膜膜图案和残留在第一区域中的第二含C膜的部分来蚀刻蚀刻目标膜作为蚀刻掩模。

    Optical element holder and projection exposure apparatus having the same
    20.
    发明授权
    Optical element holder and projection exposure apparatus having the same 有权
    光学元件支架和投影曝光装置

    公开(公告)号:US07457058B2

    公开(公告)日:2008-11-25

    申请号:US11451580

    申请日:2006-06-13

    CPC classification number: G02B7/00 G03F7/701 G03F7/70825

    Abstract: In an optical member holder and a projection exposure apparatus having the same, a light beam radiated from a light source may be formed into light having a desired shape by selecting one of a plurality of optical elements. An optical element holder may include a support member to support the plurality of optical elements, a first driving section to move or rotate the support member to select one of the optical elements, and a second driving section to rotate the selected optical element to adjust an arrangement direction thereof. The light formed by the selected optical element may be directed through a reticle.

    Abstract translation: 在具有该光学构件保持器和投影曝光设备的光学构件保持器和投影曝光设备中,从光源辐射的光束可以通过选择多个光学元件之一形成具有所需形状的光。 光学元件保持器可以包括用于支撑多个光学元件的支撑构件,用于移动或旋转支撑构件以选择一个光学元件的第一驱动部分和第二驱动部分,以旋转所选择的光学元件以调整 排列方向。 由所选择的光学元件形成的光可以被引导通过掩模版。

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