公开(公告)号：US06563294B2

公开(公告)日：2003-05-13

申请号：US10112738

申请日：2002-04-01

申请人： Thomas P. Duffy ,  Ryan Goodfellow ,  David Susak

发明人： Thomas P. Duffy ,  Ryan Goodfellow ,  David Susak

IPC分类号： G05F140

CPC分类号： H02M7/493 ,  H02J1/102 ,  H02M3/157 ,  H02M3/1584 ,  H02M2001/008

摘要： A highly phased power regulation (converter) system having an improved control feature is provided. A controller, such as a digital signal processor or microprocessor, receives digital information from a plurality of power conversion blocks and transmits control commands in response to the information. The controller is able to change the mode of operation of the system and/or re-phase the power blocks to accommodate a dynamic load requirement, occasions of high transient response or detection of a fault. In one embodiment, a microprocessor receives digital information and converted power from one or more power blocks. In this manner, the microprocessor is able to receive feedback on its own operation. The controller is also able to anticipate and predict conditions by analyzing precursor data. In this manner, the controller is able to modify the system as needed in anticipation of the forthcoming event.

公开(公告)号：US5395198A

公开(公告)日：1995-03-07

申请号：US901640

申请日：1992-06-19

申请人： Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

发明人： Thomas P. Duffy ,  Lewis C. Hecht ,  Merritt P. Sulger, deceased ,  Ernst E. Thiele ,  Mark V. Pierson ,  Lawrence E. Williams

IPC分类号： B23P21/00 ,  B25H3/02 ,  B65G49/07 ,  H01L21/00 ,  H01L21/673 ,  H01L21/677 ,  H01L21/683 ,  H05K3/00 ,  B65G49/06 ,  B65H1/00 ,  C23C16/00

CPC分类号： H01L21/67236 ,  H01L21/67126 ,  H01L21/67363 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67772

摘要： Disclosed is a system for handling large area, in-process, circuit panel layers. The circuit panel layers are thin and flimsy, and require rigid support for certain processing steps. The system includes a peripheral frame fixture for surrounding and supporting the in process circuit panel layer, and a a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The peripheral frame fixture includes a bottom plate having a central opening to expose the circuit panel layer, a top frame having a corresponding central opening to expose the opposite surface of the circuit panel layer, and a compressive apparatus, as screws, bolts, or the like, for applying a z axis compressive force to the bottom plate, the top frame, and a panel layer therebetween. Optionally, the fixture may include alignment pins or fiducials for aligning the bottom plate, a panel layer, and the top frame, and a robotic interface for a robotic arm to grasp and transfer the peripheral frame fixture. The system also includes a loading chuck for mounting the in-process circuit panel layer in the peripheral frame fixture. The loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture. This provides co-planarity of the in-process circuit panel layer, the bottom plate of the peripheral frame fixture, and the vacuum table. The vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture, and is coplanar with them. The vacuum table includes slidable bearing surfaces, with vacuum apertures for drawing a vacuum to hold the panel in place, and slide actuators for moving the slidable bearing surfaces to apply x-y axis tension to a panel on the bearing surfaces.

摘要翻译： 公开了一种用于处理大面积，在制程中的电路板层的系统。 电路板层薄而脆弱，并且对于某些加工步骤需要刚性支撑。 该系统包括用于围绕和支撑过程电路板层的外围框架固定装置，以及用于将工艺中电路板层安装在周边框架固定装置中的装载卡盘。 外围框架固定装置包括具有中央开口以暴露电路板层的底板，具有相应中心开口以露出电路板层的相对表面的顶部框架，以及压缩装置，如螺钉，螺栓或 用于将z轴压缩力施加到底板，顶部框架以及它们之间的面板层。 可选地，固定装置可以包括用于对准底板，面板层和顶部框架的对准销或基准，以及用于机器人臂来抓握和传送外围框架固定装置的机器人界面。 该系统还包括用于将工艺中电路板层安装在外围框架固定装置中的装载卡盘。 装载卡盘包括用于接收外围框架固定装置的底板的外围边缘。 这提供了工艺电路板层，外围框架固定装置的底板和真空工作台的共面性。 真空工作台位于由装载卡盘周边边缘和外围框架固定装置的外围框架所限定的区域内，与它们共面。 真空工作台包括可滑动的支承表面，具有用于拉伸真空以将面板保持在适当位置的真空孔，以及用于移动可滑动的支承表面以将x-y轴张力施加到支承表面上的面板的致动器。

公开(公告)号：US20120101343A1

公开(公告)日：2012-04-26

申请号：US13276325

申请日：2011-10-19

申请人： Thomas P. Duffy ,  Gerald T. Harder ,  Kevin Mori

发明人： Thomas P. Duffy ,  Gerald T. Harder ,  Kevin Mori

IPC分类号： A61B1/06

CPC分类号： A61B5/489

摘要： A trans-illumination device includes at least first and second sets of LEDs of two or more different colors arranged in a light head placed against a patient's skin. The LEDs are mounted to a printed circuit board in the light head. An electronic control circuit is coupled to the light head by an electrical cable to selectively operate the LEDs in two or more user-selected modes, with the ability to adjust the relative intensities of the different colors to best suit the physiology of the patient. The light head may have a U-shape to surround an area of interest while providing ready access thereto. The light head may be used with a disposable, detachable cover having lenses for directing light from the LEDs into the patient's tissues.

摘要翻译： 透射照明装置包括布置在靠在患者皮肤上的光头中的至少第一组和第二组两种或多种不同颜色的LED。 LED安装在光头中的印刷电路板上。 电子控制电路通过电缆耦合到光头，以选择性地以两种或多种用户选择的模式操作LED，具有调整不同颜色的相对强度以最适合于患者生理学的能力。 光头可以具有U形以围绕感兴趣的区域，同时提供对其的准备访问。 光头可以与一次性可拆卸的盖一起使用，其具有用于将来自LED的光引导到患者组织中的透镜。

公开(公告)号：US06965502B2

公开(公告)日：2005-11-15

申请号：US10103980

申请日：2002-03-22

申请人： Thomas P. Duffy ,  Ryan Goodfellow ,  Malay Trivedi ,  Kevin Mori ,  Benjamim Tang

发明人： Thomas P. Duffy ,  Ryan Goodfellow ,  Malay Trivedi ,  Kevin Mori ,  Benjamim Tang

IPC分类号： G06F1/30 ,  H02H9/00

CPC分类号： G06F1/305

摘要： The present invention provides a power regulation system and method with high speed signal settling capabilities for providing rapid active transient response to a microelectronic device. An active transient response system includes a power supply configured to receive external and/or internal signals indicating the occurrence of transient load conditions and to respond to the transient load conditions based on one or more of these signals. The system may further include a transient suppressor configured for early detection of transients, assisting in transient suppression, and early signaling of transient activity to the power supply.The system provides rapid recovery to steady state operation from the active transient response mode by using a digital compensator to quickly modifying the duty cycle and provide a voltage offset proportional to the transient microprocessor load step. Recovery is further improved by current rephasing techniques.

摘要翻译： 本发明提供了一种具有高速信号稳定能力的功率调节系统和方法，用于向微电子器件提供快速的主动瞬态响应。 有源瞬态响应系统包括被配置为接收指示瞬态负载状况的发生的外部和/或内部信号的电源，并且基于这些信号中的一个或多个来响应瞬态负载条件。 该系统还可以包括被配置为用于早期检测瞬态，辅助瞬态抑制以及对电源的瞬时活动的早期信号的瞬态抑制器。 该系统通过使用数字补偿器快速修改占空比并提供与瞬态微处理器负载阶跃成比例的电压偏移，从主动瞬态响应模式快速恢复到稳态运行。 通过目前的重塑技术进一步改善了恢复。

公开(公告)号：US5599747A

公开(公告)日：1997-02-04

申请号：US495248

申请日：1995-06-27

申请人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  David E. Houser ,  Gerald W. Jones ,  Jeffrey McKeveny ,  Kenneth L. Potter

发明人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  David E. Houser ,  Gerald W. Jones ,  Jeffrey McKeveny ,  Kenneth L. Potter

IPC分类号： H01L23/12 ,  H01L23/14 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K7/02 ,  H01L21/60

CPC分类号： H05K1/021 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49822 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H05K1/182 ,  H05K2201/09127 ,  H05K2201/09981 ,  H05K2203/049 ,  H05K3/0061 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this member to define a temporary support portion therein. Metallization and circuitization may then occur, following which the temporary support portion is removed. This temporary support thus assures effective support for the photoresist used as part of the circuitization process. Thus, the photoresist is capable of being applied in sheetlike form for spanning the relatively small openings of the dielectric without sagging, bowing, etc., which may adversely impact subsequent processing steps.

摘要翻译： 制造可用作芯片载体结构的电路化衬底的方法。 该方法包括提供电介质构件并部分地布置该构件以在其中限定临时支撑部分的步骤。 然后可以发生金属化和电路化，随后移除临时支撑部分。 因此，这种临时支撑物确保了作为电路化过程的一部分使用的光致抗蚀剂的有效支撑。 因此，光致抗蚀剂能够以片状形式施加以跨越电介质的相对小的开口而不会下垂，弯曲等，这可能不利地影响随后的处理步骤。

公开(公告)号：US5578796A

公开(公告)日：1996-11-26

申请号：US466081

申请日：1995-06-06

申请人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

发明人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

IPC分类号： H01L21/48 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K3/184 ,  H01L21/4807 ,  H05K3/4697 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/308 ,  H05K3/0061 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least one of said substrates. A plug is provided which is configured to removably fit into said opening and has a support surface thereon which is substantially coplanar with the circuit-receiving surface when said plug is positioned in the opening. The plug is inserted in the opening with the support surface substantially coplanar with the circuit-receiving surface. The substrates are laminated by application of pressure on the opposite surfaces of the substrates. The circuit-receiving surface and the support surface are covered with a sheet of dry film photoresist to seal around the opening with said plug member supporting said sheet of photoresist in the region of the opening. The dry film resist material is patterned and developed in a predetermined pattern, and the surface is circuitized with electrical circuitry. Any remaining photoresist is stripped, and said plug member is removed.

摘要翻译： 根据本发明，提供了将至少两个基板层合在一起并使层压体的至少一个表面电路化的方法。 对所述两个基板的每一个的相对表面施加压力。 开口从至少一个所述基板的电路接收表面延伸。 提供插头，其构造成可移除地装配到所述开口中并且具有其上的支撑表面，当所述插头位于开口中时，该支撑表面基本上与电路接收表面共面。 插头插入开口中，支撑表面基本上与电路接收表面共面。 通过在衬底的相对表面上施加压力来层压衬底。 电路接收表面和支撑表面被一片干膜光致抗蚀剂覆盖，以在开口的区域中用支撑所述光致抗蚀剂片的插塞构件围绕开口密封。 干膜抗蚀剂材料以预定图案被图案化和显影，并且表面被电路电路化。 剥离任何剩余的光致抗蚀剂，并且去除所述插塞构件。

公开(公告)号：US5542175A

公开(公告)日：1996-08-06

申请号：US359491

申请日：1994-12-20

申请人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

发明人： Ashwinkumar C. Bhatt ,  Thomas P. Duffy ,  Gerry A. Hackett ,  Jeffrey McKeveny

IPC分类号： H01L21/48 ,  H05K1/18 ,  H05K3/46 ,  H05K3/10

CPC分类号： H05K3/184 ,  H01L21/4807 ,  H05K3/4697 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/308 ,  H05K3/0061 ,  H05K3/4611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

摘要： According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least one of said substrates. A plug is provided which is configured to removably fit into said opening and has a support surface thereon which is substantially coplanar with the circuit-receiving surface when said plug is positioned in the opening. The plug is inserted in the opening with the support surface substantially coplanar with the circuit-receiving surface. The substrates are laminated by application of pressure on the opposite surfaces of the substrates. The circuit-receiving surface and the support surface are covered with a sheet of dry film photoresist to seal around the opening with said plug member supporting said sheet of photoresist in the region of the opening. The dry film resist material is patterned and developed in a predetermined pattern, and the surface is circuitized with electrical circuitry. Any remaining photoresist is stripped, and said plug member is removed.

摘要翻译： 根据本发明，提供了将至少两个基板层合在一起并使层压体的至少一个表面电路化的方法。 对所述两个基板的每一个的相对表面施加压力。 开口从至少一个所述基板的电路接收表面延伸。 提供插头，其构造成可移除地装配到所述开口中并且具有其上的支撑表面，当所述插头位于开口中时，该支撑表面基本上与电路接收表面共面。 插头插入开口中，支撑表面基本上与电路接收表面共面。 通过在衬底的相对表面上施加压力来层压衬底。 电路接收表面和支撑表面被一片干膜光致抗蚀剂覆盖，以在开口的区域中用支撑所述光致抗蚀剂片的插塞构件围绕开口密封。 干膜抗蚀剂材料以预定图案被图案化和显影，并且表面被电路电路化。 剥离任何剩余的光致抗蚀剂，并且去除所述插塞构件。