公开(公告)号：US20070051974A1

公开(公告)日：2007-03-08

申请号：US11501784

申请日：2006-08-10

申请人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

发明人： Katsunori Azuma ,  Toshiaki Morita ,  Hiroshi Hozoji ,  Kazuhiro Suzuki ,  Toshiya Satoh ,  Osamu Otsuka

IPC分类号： H01L31/111

CPC分类号： H05K7/1432 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/40091 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/45124 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2224/37099

摘要： The power conversion apparatus uses the semiconductor device. Said semiconductor device includes a first group of power semiconductor elements at least one of which is electrically connected between a first potential and a third potential, a second group of power semiconductor elements at least one of which is electrically connected between a second potential and the third potential, and a third group of power semiconductor elements at least one of which is electrically connected between the first potential and the third potential. The second group is disposed between the first group and third group. Thereby, a low-loss semiconductor device having both inductance reducibility and heat generation balancing capability and also an electric power conversion apparatus using the same is provided.

摘要翻译： 电力转换装置使用半导体装置。 所述半导体器件包括第一组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间，第二组功率半导体元件，其中至少一个功率半导体元件电连接在第二电位与第三电位之间 电位和第三组功率半导体元件，其中至少一个功率半导体元件电连接在第一电位和第三电位之间。 第二组置于第一组和第三组之间。 因此，提供了具有电感还原性和发热平衡能力的低损耗半导体器件以及使用其的电力转换装置。

公开(公告)号：US06946723B2

公开(公告)日：2005-09-20

申请号：US09809181

申请日：2001-03-16

申请人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Atsushi Kazama ,  Ichiro Anjo ,  Asao Nishimura

发明人： Toshiya Satoh ,  Masahiko Ogino ,  Tadanori Segawa ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei ,  Atsushi Kazama ,  Ichiro Anjo ,  Asao Nishimura

IPC分类号： H01L23/29 ,  H01L21/301 ,  H01L21/3205 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L23/31 ,  H01L23/485 ,  H01L23/52 ,  H01L23/522 ,  H01L23/495

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor device having a semiconductor element is obtained by cutting a semiconductor wafer, having an electrode pad formed on one side thereof, along a scribe line. The semiconductor device has a semiconductor element protective layer on the semiconductor element so as to form an opening above the pad, a stress cushioning layer on the layer so as to form an opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and a conductor protective layer on the layer. The layer, the layer, and the conductor protective layer form respective end faces on the end surface of the semiconductor element inside the scribe line and expose a surface of the semiconductor element from the end face of the end surface to a point inside of the scribe line, thereby to expose the scribe line.

摘要翻译： 具有半导体元件的半导体器件通过沿着划线切割具有在其一侧形成的电极焊盘的半导体晶片来获得。 半导体器件在半导体元件上具有半导体元件保护层，以便在焊盘上形成开口，该层上的应力缓冲层在焊盘上形成开口，从电极到达该层的引线部分 通过开口焊盘，引线部分上的外部电极以及该层上的导体保护层。 层，层和导体保护层在划线内部的半导体元件的端面上形成相应的端面，并将半导体元件的表面从端表面的端面暴露于刻痕内侧 线，从而暴露划线。

公开(公告)号：US06784541B2

公开(公告)日：2004-08-31

申请号：US10302986

申请日：2002-11-25

申请人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

发明人： Shuji Eguchi ,  Akira Nagai ,  Haruo Akahoshi ,  Takumi Ueno ,  Toshiya Satoh ,  Masahiko Ogino ,  Asao Nishimura ,  Ichiro Anjo ,  Hideki Tanaka

IPC分类号： H01L2334

CPC分类号： H01L23/42 ,  H01L21/56 ,  H01L21/565 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/20752

摘要： In a multi-chip module, a plurality of semiconductor chips are mounted on a single wiring board. Upper surfaces of the chips are covered with a single heat spread plate, and the whole space around the chips sandwiched between the wiring board and the heat spread plate is filled with resin. The semiconductor chips are interconnected through the resin so that any stress exerted on any chips is dispersed. This diminishes the occurrence of cracks caused by stress concentration. Since the chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.

摘要翻译： 在多芯片模块中，多个半导体芯片安装在单个布线板上。 芯片的上表面被单个散热板覆盖，并且夹在布线板和扩散板之间的芯片周围的整个空间填充有树脂。 半导体芯片通过树脂相互连接，从而分散施加在任何芯片上的任何应力。 这减少了由应力集中引起的裂纹的发生。 由于芯片和扩散板与树脂粘合在一起，即使芯片的尺寸有变化，两者也可以容易地结合。 此外，所有芯片和散热板的接合可以在单个工艺中完成。

公开(公告)号：US06710446B2

公开(公告)日：2004-03-23

申请号：US10136305

申请日：2002-05-02

申请人： Akira Nagai ,  Takumi Ueno ,  Haruo Akahoshi ,  Syuji Eguchi ,  Masahiko Ogino ,  Toshiya Satoh ,  Asao Nishimura ,  Ichiro Anjoh

发明人： Akira Nagai ,  Takumi Ueno ,  Haruo Akahoshi ,  Syuji Eguchi ,  Masahiko Ogino ,  Toshiya Satoh ,  Asao Nishimura ,  Ichiro Anjoh

IPC分类号： H01L2348

CPC分类号： H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/02145 ,  H01L2224/0231 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/08225 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor device and a manufacturing method thereof, which device includes a semiconductor element arranged to form integrated circuitry, a plurality of electrode pads formed on the side of the integrated circuitry formation surface of the semiconductor element, bump electrodes for electrically connecting to the electrode pads through a conductive layer, and a stress relaxation layer formed between the integrated circuitry formation surface and electrode pads on one hand and the bump electrodes and conductive layer on the other hand, the stress relaxation layer being adhered thereto, wherein more than one third of the stress relaxation layer from a surface thereof is cut away for removal and wherein the stress relaxation layer is subdivided into a plurality of regions. Accordingly, it is possible to provide a semiconductor device capable of offering high density mounting schemes with increased reliability while reducing production costs.

摘要翻译： 一种半导体器件及其制造方法，该器件包括布置成形成集成电路的半导体元件，形成在半导体元件的集成电路形成表面侧的多个电极焊盘，用于电连接到电极焊盘的凸起电极 通过导电层和在集成电路形成表面和电极焊盘之间形成的应力松弛层，另一方面，凸块电极和导电层，应力松弛层粘附到其上，其中超过三分之一 将其表面的应力松弛层切除以除去，其中应力松弛层被细分成多个区域。 因此，可以提供能够提供可靠性高的高密度安装方案的半导体器件，同时降低生产成本。

公开(公告)号：US5649273A

公开(公告)日：1997-07-15

申请号：US611850

申请日：1996-03-06

申请人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

发明人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

IPC分类号： G03G9/087 ,  G03G15/20

CPC分类号： G03G15/2064 ,  G03G15/2053 ,  G03G15/2057 ,  G03G2215/2016 ,  G03G2215/2035 ,  G03G2215/2038

摘要： Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device is composed of a belt-type heating member and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The belt-type heating member comprises a metallic endless belt having fine irregularities formed on its surface and a surface layer made of a resin. The surface roughness of the fine irregularities ranges between 10 and 45 .mu.m, when measured by a ten-point averaging method.

摘要翻译： 用于电子照相设备的图像定影装置，能够抑制固定的调色剂图像的光泽，从而在长时间内稳定地产生高质量和高定影强度的图像。 定影装置由带式加热构件和加压辊组成，它们彼此接触并在其间形成旋转以在其间形成夹持，通过该辊隙支撑未定影的调色剂图像的纸将调色剂图像固定在纸上。 带式加热构件包括在其表面上形成有细小凹凸的金属环形带和由树脂制成的表面层。 当通过十点平均法测量时，细微不规则的表面粗糙度在10至45μm之间。

公开(公告)号：US5519479A

公开(公告)日：1996-05-21

申请号：US517706

申请日：1995-08-22

申请人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

发明人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

IPC分类号： G03G9/087 ,  G03G15/20

CPC分类号： G03G15/2064 ,  G03G15/2053 ,  G03G15/2057 ,  G03G2215/2016 ,  G03G2215/2035 ,  G03G2215/2038

摘要： Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device has a fixing roller and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The fixing roller has a cylindrical core having fine irregularities formed on its surface and a surface layer made of a resin. The surface of the cylindrical core has a greater elastic modulus than that of the surface layer.

摘要翻译： 用于电子照相设备的图像定影装置，能够抑制固定的调色剂图像的光泽，从而在长时间内稳定地产生高质量和高定影强度的图像。 定影装置具有定影辊和加压辊，它们彼此接触并旋转以在它们之间形成一个辊隙，通过该辊隙支撑未定影的调色剂图像的纸张使调色剂图像固定在纸上。 定影辊具有在其表面上形成有细小凹凸的圆筒形芯和由树脂制成的表面层。 圆柱形芯的表面具有比表面层更大的弹性模量。

公开(公告)号：US5363180A

公开(公告)日：1994-11-08

申请号：US883363

申请日：1992-05-15

申请人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

发明人： Ryuuichi Shimizu ,  Tsuneaki Kawanishi ,  Toshiya Satoh ,  Teruaki Mitsuya ,  Takashi Suzuki

IPC分类号： G03G9/087 ,  G03G15/20

CPC分类号： G03G15/2064 ,  G03G15/2053 ,  G03G15/2057 ,  G03G2215/2016 ,  G03G2215/2035 ,  G03G2215/2038

摘要： Image fixing device for use in electrophotographic apparatus, capable of suppressing gloss of fixed toner image, thus stably producing images of high quality and high level of fixing intensity over a long period of time. The fixing device has a fixing roller and a pressing roller which are contacted with each other and rotate to form therebetween a nip through which a paper supporting unfixed toner image is passed to have the toner image fixed to the paper. The fixing roller has a cylindrical core having fine irregularities formed on its surface and a surface layer made of a resin. The surface of the cylindrical core has a greater elastic modulus than that of the surface layer.

摘要翻译： 用于电子照相设备的图像定影装置，能够抑制固定的调色剂图像的光泽，从而在长时间内稳定地产生高质量和高定影强度的图像。 定影装置具有定影辊和加压辊，它们彼此接触并旋转以在它们之间形成一个辊隙，通过该辊隙支撑未定影的调色剂图像的纸张使调色剂图像固定在纸上。 定影辊具有在其表面上形成有细小凹凸的圆筒形芯和由树脂制成的表面层。 圆柱形芯的表面具有比表面层更大的弹性模量。

公开(公告)号：US20240174003A1

公开(公告)日：2024-05-30

申请号：US18521698

申请日：2023-11-28

申请人： Takuto KIDO ,  Toshiya SATOH ,  Yuichi TANIOKU ,  Akihiro SHIMA ,  Teiichiro ISHIKAWA ,  Yusuke MORIKAWA

发明人： Takuto KIDO ,  Toshiya SATOH ,  Yuichi TANIOKU ,  Akihiro SHIMA ,  Teiichiro ISHIKAWA ,  Yusuke MORIKAWA

IPC分类号： B41J11/00

CPC分类号： B41J11/00244 ,  B41J11/00242

摘要： A heating device, an image forming apparatus, and a liquid discharge apparatus. The heating device includes a heating roller having heat sources inside to heat a sheet. The heat sources include three or more first heat sources having a same distribution of thermal intensity and a second heat source having a distribution of thermal intensity different from the distribution of the thermal intensity of the first heat sources, and the second heat source is disposed inside a polygon whose vertices are the first heat sources when viewed from one end of the heating roller in a longitudinal direction of the heating roller. The image forming apparatus includes an image forming device to form an image on a sheet, and the heating device to heat the sheet. The liquid discharge apparatus includes a liquid discharge device to discharge liquid onto a sheet, and the heating device to heat the sheet.

公开(公告)号：US09703253B2

公开(公告)日：2017-07-11

申请号：US15131949

申请日：2016-04-18

申请人： Daisuke Tomita ,  Toshiya Satoh ,  Satoshi Hatori ,  Takeshi Fukao ,  Hajime Teraji ,  Norio Kudoh ,  Hiroyuki Uenishi

发明人： Daisuke Tomita ,  Toshiya Satoh ,  Satoshi Hatori ,  Takeshi Fukao ,  Hajime Teraji ,  Norio Kudoh ,  Hiroyuki Uenishi

IPC分类号： G03G21/10 ,  G03G15/08 ,  H04N1/00

CPC分类号： G03G21/105 ,  G03G15/0879 ,  H04N1/00909 ,  H04N2201/0094

摘要： A toner conveyance device includes a toner conveyance path through which toner is transported. The toner conveyance path includes a flexible portion, a toner conveyor inside the conveyance path to convey the toner, and a restrictor outside the toner conveyance path to restrict deformation of the toner conveyance path.

公开(公告)号：US20160231704A1

公开(公告)日：2016-08-11

申请号：US15016129

申请日：2016-02-04

申请人： Tomohiko Saito ,  Toshiya Satoh ,  Norio Kudoh ,  Hiroyuki Uenishi ,  Daisuke Tomita

发明人： Tomohiko Saito ,  Toshiya Satoh ,  Norio Kudoh ,  Hiroyuki Uenishi ,  Daisuke Tomita

IPC分类号： G03G15/00 ,  G03G21/00

CPC分类号： G03G21/0094 ,  G03G15/5008 ,  G03G21/203

摘要： An image forming apparatus includes an image bearer; a charger to charge a surface of the image bearer; an exposure device to expose the surface of the image bearer and form an electrostatic latent image on the image bearer; a developing device to adhere electrically charged toner to the electrostatic latent image on the image bearer, to thereby form a toner image; a microprocessor to control rotation of the image bearer; and a sensor to detect temperature and humidity. In a state of suspended rotation of the image bearer, the microprocessor controls the image bearer to rotate a predetermined amount at a predetermined interval and determines whether a rotation operation of the image bearer is to be performed, based on a detection result of the sensor.

摘要翻译： 图像形成装置包括图像载体; 用于对图像承载体的表面充电的充电器; 曝光装置，用于暴露图像载体的表面并在图像载体上形成静电潜像; 显影装置，用于将带电荷的调色剂粘附到图像载体上的静电潜像上，从而形成调色剂图像; 用于控制图像承载的旋转的微处理器; 和一个检测温度和湿度的传感器。 在图像承载的暂停旋转的状态下，微处理器以预定间隔控制图像承载旋转预定量，并且基于传感器的检测结果来确定是否要执行图像承载的旋转操作。