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公开(公告)号:US12272527B2
公开(公告)日:2025-04-08
申请号:US15974948
申请日:2018-05-09
Applicant: ASM IP Holding B.V.
Inventor: Xing Lin , Chuang Wei , Wentao Wang , Peipei Gao , Fei Wang , Bubesh Babu Jotheeswaran
Abstract: A system and method suitable for removing both carbon-based contaminants and oxygen-based contaminants from a substrate within a single process chamber are disclosed.
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公开(公告)号:US20240376597A1
公开(公告)日:2024-11-14
申请号:US18660759
申请日:2024-05-10
Applicant: ASM IP Holding B.V.
Inventor: Fan Gao , Krishnaswamy Mahadevan , Peipei Gao , Xing Lin , Jingxuan Lyu
IPC: C23C16/448 , C23C16/52 , C30B25/14 , H01L21/02
Abstract: A liquid precursor container is provided. The liquid precursor container includes an inner container, an outer container, and a baffle member. The inner container has an inner base portion, an inner intermediate portion extending upwards from the inner base portion, and an inner lid portion coupled to the inner base portion by the inner intermediate portion. The outer container has an outer base portion spaced apart from the inner base portion of the inner container and an outer intermediate portion extending upwards from the outer base portion and about the inner intermediate portion of the inner container. The baffle member is arranged between the inner intermediate portion of the inner container and the outer intermediate portion of the outer container, extends upwards from the outer base portion of the outer container, and terminates between the inner lid portion and the inner base portion of the inner container.
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13.
公开(公告)号:US12006572B2
公开(公告)日:2024-06-11
申请号:US17060507
申请日:2020-10-01
Applicant: ASM IP Holding B.V.
Inventor: Xing Lin , Peipei Gao , Prajwal Nagaraj , Mingyang Ma , Wentao Wang , Ion Hong Chao , Alexandros Demos , Paul Ma , Hichem M'Saad
IPC: H01J37/32 , C23C16/40 , C23C16/455 , C23C16/50
CPC classification number: C23C16/45582 , C23C16/403 , C23C16/405 , C23C16/45536 , C23C16/45565 , C23C16/50 , H01J37/32357 , H01J37/3244
Abstract: A reactor system including a gas distribution assembly and method of using the reactor system are disclosed. The gas distribution assembly includes a gas distribution device, a gas expansion area, and a showerhead plate downstream of the gas distribution device and the expansion area.
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公开(公告)号:US20240175138A1
公开(公告)日:2024-05-30
申请号:US18518393
申请日:2023-11-22
Applicant: ASM IP HOlding B.V.
Inventor: Fan Gao , Peipei Gao , Xing Lin , Arun Murali , Gregory Deye , Frederick Aryeetey , Amir Kajbafvala , Caleb Miskin , Alexandros Demos
CPC classification number: C23C16/52 , C23C16/4412 , C23C16/46 , H01L21/67017 , H01L21/67126 , H01L21/67253
Abstract: Systems and methods controlling the pressure differential between two sealed chambers connected by a gate valve in preparation for a gate valve opening event. Such systems and methods may adjust gas pressure in at least one of the chambers, if needed, until the pressure differential between the two chambers is at a predetermined pressure differential level. In some more specific examples, one chamber may constitute a substrate handling chamber, the other chamber may constitute a reaction chamber (e.g., for depositing one or more layers on a surface of a substrate), and the gate valve opening event may allow a substrate to be transferred from one chamber to the other (e.g., from the reaction chamber into the substrate handling chamber).
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15.
公开(公告)号:US20240112930A1
公开(公告)日:2024-04-04
申请号:US18476117
申请日:2023-09-27
Applicant: ASM IP Holding, B.V.
Inventor: Fan Gao , Peipei Gao , Wentao Wang , Kai Zhou , Kishor Patil , Han Ye , Xing Lin , Alexandros Demos
CPC classification number: H01L21/67115 , B23K26/034 , B23K26/0626 , B23K26/0643 , C23C16/4584 , C23C16/46 , C23C16/483 , C23C16/52 , G05D23/1931 , H01L21/67109
Abstract: A chamber arrangement includes a chamber body, a substrate support, and a laser source. The substrate support is arranged within the chamber body and supported for rotation about a rotation axis relative to the chamber body. The laser source is arranged outside of the chamber body and optically coupled to the substrate support along a lasing axis. The lasing axis intersects the substrate support at a location radially outward from an outer periphery of a substrate seated on the substrate support. A semiconductor processing system and a material layer deposition method are also described.
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公开(公告)号:US20240071805A1
公开(公告)日:2024-02-29
申请号:US18238577
申请日:2023-08-28
Applicant: ASM IP Holding B.V.
Inventor: Han Ye , Peipei Gao , Wentao Wang , Aniket Chitale , Xing Lin , Alexandros Demos , Yanfu Lu
IPC: H01L21/687 , H01L21/67
CPC classification number: H01L21/68735 , H01L21/67069
Abstract: Methods, systems, and assemblies suitable for gas-phase processes are disclosed. An exemplary assembly includes a susceptor ring and at least one injector tube. The injector tube can be disposed within the susceptor ring to provide a gas to a lower chamber area of a reactor. Methods, systems, and assemblies can be used to obtain desired etching and purging of the lower chamber area.
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17.
公开(公告)号:US20220367175A1
公开(公告)日:2022-11-17
申请号:US17875907
申请日:2022-07-28
Applicant: ASM IP Holding B.V.
Inventor: Xing Lin , Peipei Gao , Fei Wang , John Tolle , Bubesh Babu Jotheeswaran , Vish Ramanathan , Eric Hill
Abstract: A system and method for removing both carbon-based contaminants and oxygen-based contaminants from a semiconductor substrate within a single process chamber is disclosed. The invention may comprise utilization of remote plasma units and multiple gas sources to perform the process within the single process chamber.
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18.
公开(公告)号:US20190019670A1
公开(公告)日:2019-01-17
申请号:US16000109
申请日:2018-06-05
Applicant: ASM IP Holding B.V.
Inventor: Xing Lin , Peipei Gao , Fei Wang , John Tolle , Bubesh Babu Jotheeswaran , Vish Ramanathan , Eric Hill
Abstract: A system and method for removing both carbon-based contaminants and oxygen-based contaminants from a semiconductor substrate within a single process chamber is disclosed. The invention may comprise utilization of remote plasma units and multiple gas sources to perform the process within the single process chamber.
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