公开(公告)号：US12160982B2

公开(公告)日：2024-12-03

申请号：US17435489

申请日：2020-02-27

Applicant: AUDI AG ,  Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

公开(公告)号：US11990697B2

公开(公告)日：2024-05-21

申请号：US17623378

申请日：2020-09-07

Applicant: AUDI AG

Inventor： Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniel Ruppert

IPC: H01R12/58 ,  H01R12/52 ,  H05K1/18 ,  H05K3/30 ,  H01R12/57

CPC classification number: H01R12/58 ,  H01R12/52 ,  H05K1/18 ,  H05K3/308 ,  H01R12/57 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/1059

Abstract: Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

公开(公告)号：US11195778B2

公开(公告)日：2021-12-07

申请号：US15781326

申请日：2016-11-24

Applicant: AUDI AG ,  ABB Schweiz AG

Inventor： Andreas Apelsmeier ,  Günter Vetter

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/367 ,  H01L23/00 ,  H01L23/14

Abstract: An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.

公开(公告)号：US10992208B2

公开(公告)日：2021-04-27

申请号：US15945776

申请日：2018-04-05

Applicant: AUDI AG

Inventor： Andreas Apelsmeier ,  Stephan Brüske

IPC: H02K11/33 ,  H02M1/32 ,  H02P29/024 ,  H02K11/25 ,  H02K11/27

Abstract: A converter device for an electrical machine, including a switch with a plurality of switching elements to generate a multiphase alternating current for the electrical machine and a plurality of phase conductors for conducting an alternating current generated in each case by the switch to the electrical machine, wherein a number of first phase conductors that is one less in number than the total number of phase conductors are coordinated with a current measuring means, and a control device is provided, which is designed to determine a calculated value describing a current along the second phase conductor from first measured values of the current measuring means, wherein the control device is designed to check the plausibility of the calculated value on the basis at least one second measured value of a short circuit detecting device coordinated with a switching element.

公开(公告)号：US10784180B2

公开(公告)日：2020-09-22

申请号：US15992469

申请日：2018-05-30

Applicant: AUDI AG

Inventor： Andreas Apelsmeier ,  Benjamin Söhnle ,  Stephan Brüske

IPC: H01L23/367 ,  G01R15/20 ,  H01L23/538 ,  H01L25/07 ,  H01L23/055 ,  H01L23/36 ,  B60R16/03 ,  G01R31/00 ,  H02M7/00

Abstract: An electronics device with at least one component to be cooled, a cooling element for cooling the component to be cooled, at least one power supply line, and a respective current sensor for recording a current strength of a current flowing through the respective power supply line, wherein the cooling element has a recess, in which the current sensor engages or in which the current sensor is arranged.

公开(公告)号：US10742141B2

公开(公告)日：2020-08-11

申请号：US16025132

申请日：2018-07-02

Applicant: AUDI AG

Inventor： Andreas Apelsmeier ,  Maximilian Schiedermeier

IPC: H02P5/74 ,  B60K1/02 ,  H02M7/5395 ,  B60L50/51 ,  B60L15/00 ,  B60L50/60 ,  H01L29/16 ,  H01L29/739 ,  H01L29/78 ,  H01L29/861

Abstract: An electrical drive system having multiple drive units for motor vehicles, especially for pure electric vehicles, and a method for operating the drive system.

公开(公告)号：US09905533B2

公开(公告)日：2018-02-27

申请号：US15514304

申请日：2015-07-08

Applicant: AUDI AG

Inventor： Günter Vetter ,  Andreas Apelsmeier ,  Henning Suckel

IPC: H01L23/52 ,  H01L23/00 ,  H01L21/48 ,  H01L23/492

CPC classification number: H01L24/83 ,  H01L21/4871 ,  H01L23/492 ,  H01L24/32 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/29007 ,  H01L2224/29036 ,  H01L2224/291 ,  H01L2224/32013 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: A method for producing a semiconductor arrangement, said method includes fastening a semiconductor on a base element by means of a sintered layer, wherein a side of the sintered layer which faces the base element is configured planar; and perforating a region of the base element, which directly contacts the sinter, wherein the perforating includes generating a plurality of through-openings having a closed border in the region of the base element for adjusting a stiffness of at least a portion of the base element in a targeted manner