公开(公告)号：US09246449B2

公开(公告)日：2016-01-26

申请号：US14087555

申请日：2013-11-22

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： H03F3/217 ,  H01L29/78 ,  H03F1/02 ,  H03F3/68 ,  H03F3/185 ,  H01L23/367 ,  H01L23/495 ,  H01L23/00 ,  H01L27/092 ,  H01L29/40 ,  H01L29/423

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including, four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低侧器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。

公开(公告)号：US08778740B2

公开(公告)日：2014-07-15

申请号：US13897423

申请日：2013-05-19

申请人： Advanced Analogic Technologies Incorporated ,  Advanced Analogic Technologies (Hong Kong) Limited

发明人： Richard K. Williams ,  Keng Hung Lin

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L25/50 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12033 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： To avoid shorts between adjacent die pads in mounting a multi-die semiconductor package to a printed circuit board (PCB), one of the die pads is embedded in the polymer capsule, while the other die pad is exposed at the bottom of the package to provide a thermal escape path to the PCB. This arrangement is particularly useful when one of the dice in a multi-die package generates more heat than another die in the package. A process for fabricating the package includes a partial etch that defines the bottom surface of the embedded die pad and may include a through-etch that leaves one or more of the contacts or leads integrally connected to the embedded die pad.

摘要翻译： 为了避免将多芯片半导体封装安装到印刷电路板（PCB）上的相邻裸片焊盘之间的短路，其中一个裸片焊盘嵌入聚合物胶囊中，而另一个芯片焊盘在封装的底部露出， 提供热释放通路到PCB。 当多芯片封装中的一个芯片产生比封装中的另一个裸片更多的热量时，这种布置是特别有用的。 用于制造封装的工艺包括限定嵌入式裸片焊盘的底表面的部分蚀刻，并且可以包括使整个连接到嵌入式裸片焊盘的触点或引线中的一个或多个的通蚀刻。

公开(公告)号：US08593220B2

公开(公告)日：2013-11-26

申请号：US13788336

申请日：2013-03-07

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams

IPC分类号： H03F3/217

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低边器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。

公开(公告)号：US09905640B2

公开(公告)日：2018-02-27

申请号：US14875165

申请日：2015-10-05

申请人： SKYWORKS SOLUTIONS (HONG KONG) LIMITED ,  ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Wai Tien Chan ,  Donald Ray Disney ,  Richard K. Williams

IPC分类号： H01L21/70 ,  H01L29/06 ,  H01L21/265 ,  H01L21/761 ,  H01L21/762 ,  H01L21/763 ,  H01L21/8234 ,  H01L21/8238

CPC分类号： H01L29/0646 ,  H01L21/26513 ,  H01L21/761 ,  H01L21/76224 ,  H01L21/76237 ,  H01L21/76243 ,  H01L21/76267 ,  H01L21/763 ,  H01L21/823481 ,  H01L21/823878 ,  H01L21/823892 ,  H01L29/0649 ,  H01L2924/0002 ,  H01L2924/00

摘要： An isolation structure formed in a semiconductor substrate of a first conductivity type includes a floor isolation region of a second conductivity type opposite to the first conductivity type submerged in the substrate. A first trench extends downward from a surface of the substrate and overlaps onto the floor isolation region. The first trench includes walls lined with a dielectric material and contains a conductive material. The first trench and the floor isolation region electrically isolate a pocket of the first conductivity type from the substrate.

公开(公告)号：US09225239B2

公开(公告)日：2015-12-29

申请号：US14465040

申请日：2014-08-21

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： G05F1/40 ,  H02M3/07 ,  G05F3/16 ,  H02M3/337 ,  H02M1/00

CPC分类号： H02M3/07 ,  G05F3/16 ,  H02M3/337 ,  H02M2001/009

摘要： A multiple output charge pump that includes a first flying capacitor, a second flying capacitor, a first output node, a second output node, and a switching network. The first output node is configured to provide a first voltage, and the second output node is distinct from the first output node and is configured to provide a second voltage, different than the first voltage. The switching network is configured to provide a first mode of operation in which the first and second flying capacitors are connected in one of in series with one another between an input voltage and ground or in parallel with one another between the input voltage and ground, a second mode of operation in which the first and second flying capacitors are connected in parallel with one another between ground and the second output node, and a third mode of operation.

摘要翻译： 一种多输出电荷泵，包括第一飞行电容器，第二飞行电容器，第一输出节点，第二输出节点和交换网络。 第一输出节点被配置为提供第一电压，并且第二输出节点与第一输出节点不同，并且被配置为提供不同于第一电压的第二电压。 开关网络被配置为提供第一操作模式，其中第一和第二浮动电容器在输入电压和地之间彼此串联连接，或者在输入电压和地之间彼此并联连接， 第二操作模式，其中第一和第二浮动电容器在地和第二输出节点之间彼此并联连接，以及第三操作模式。

公开(公告)号：US08916965B2

公开(公告)日：2014-12-23

申请号：US13959197

申请日：2013-08-05

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams

IPC分类号： H01L23/34 ,  H01L23/495 ,  H01L23/498 ,  H01L23/433 ,  H01L23/31

CPC分类号： H01L23/49811 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49572 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.

摘要翻译： 通过以半导体封装中的凸起引线框架方式将裸片安装在半导体封装中，通过将SOI裸片的有源层连接到金属引线上的焊料或其它金属凸块来改善来自绝缘体上硅（SOI）裸片的热传递 将封装安装在印刷电路板或其他支撑结构上。

公开(公告)号：US08841891B2

公开(公告)日：2014-09-23

申请号：US13674053

申请日：2012-11-11

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams

IPC分类号： G05F3/16 ,  H02M3/07 ,  H02M3/337

CPC分类号： H02M3/07 ,  G05F3/16 ,  H02M3/337 ,  H02M2001/009

摘要： A multiple output DC-to-DC voltage converter using a new time-multiplexed-capacitor converter algorithm and related circuit topologies is herein disclosed. One embodiment of this invention includes a flying capacitor, a first output node, a second output node, and a switching network. The switching network configured to provide the following modes of circuit operation: 1) a first mode where the positive electrode of the flying capacitor is connected to an input voltage and the negative electrode of the flying capacitor is connected to ground; 2) a second mode where the negative electrode of the flying capacitor is connected to the input voltage and the positive electrode of the flying capacitor is connected to the first output node; and 3) a third mode where the positive electrode of the flying capacitor is connected to ground and the negative electrode of the flying capacitor is connected to the second output node.

摘要翻译： 本文公开了使用新的时间复用电容转换器算法和相关电路拓扑的多输出DC-DC电压转换器。 本发明的一个实施例包括飞行电容器，第一输出节点，第二输出节点和交换网络。 配置为提供以下电路操作模式的开关网络：1）将飞跨电容器的正电极连接到输入电压并且飞跨电容器的负电极连接到地的第一模式; 2）第二模式，其中飞跨电容器的负电极连接到输入电压，并且飞跨电容器的正电极连接到第一输出节点; 以及3）第三模式，其中飞跨电容器的正电极连接到地，并且飞跨电容器的负电极连接到第二输出节点。

公开(公告)号：US08704503B2

公开(公告)日：2014-04-22

申请号：US13735940

申请日：2013-01-07

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams ,  Kevin D'Angelo ,  Charles Coles

IPC分类号： G05F1/44

CPC分类号： H02H3/20 ,  G05F1/46 ,  H02M1/32 ,  H02M3/005 ,  H02M2003/1557

摘要： A SEPIC converter with over-voltage protection includes a high-side inductor that connects a node Vw to a node Vx. The node Vx is connected, in turn to ground by a power MOSFET. The node Vx is also connected to a node Vy by a first capacitor. The node Vy is connected to ground by a low-side inductor. A rectifier diode further connects the node Vy and a node Vout and an output capacitor is connected between the node Vout and ground. A PWM control circuit is connected to drive the power MOSFET. An over-voltage protection MOSFET connects an input supply to the PWM control circuit and the node Vw. A comparator monitors the voltage of the input supply. If that voltage exceeds a predetermined value Vref the comparator output causes the over-voltage protection MOSFET to disconnect the node Vw and the PWM control circuit from the input supply.

摘要翻译： 具有过电压保护的SEPIC转换器包括将节点Vw连接到节点Vx的高侧电感器。 节点Vx通过功率MOSFET连接到地。 节点Vx也通过第一电容器连接到节点Vy。 节点Vy通过低侧电感器接地。 整流二极管还连接节点Vy和节点Vout，输出电容器连接在节点Vout和地之间。 连接PWM控制电路来驱动功率MOSFET。 过压保护MOSFET将输入电源连接到PWM控制电路和节点Vw。 比较器监视输入电源的电压。 如果该电压超过预定值Vref，则比较器输出使过电压保护MOSFET从输入电源断开节点Vw和PWM控制电路。

公开(公告)号：US09609708B2

公开(公告)日：2017-03-28

申请号：US14987203

申请日：2016-01-04

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams ,  Kevin Peter D'Angelo ,  David Alan Brown ,  George A. Hariman

IPC分类号： H05B33/08

CPC分类号： H05B33/0827 ,  H05B33/0884

摘要： A distributed system for driving strings of series-connected LEDs for backlighting, display and lighting applications that includes multiple intelligent satellite LED driver ICs connected to an interface IC via a serial lighting interface bus. The interface IC translates information obtained from a host microcontroller into instructions for the satellite LED driver ICs pertaining to such parameters as duty factor, current levels, phase delay and fault settings. Fault conditions in the LED driver ICs can be transmitted back to the interface IC. An analog current sense feedback system which also links the LED driver ICs determines the supply voltage for the LED strings.

公开(公告)号：US20160360144A1

公开(公告)日：2016-12-08

申请号：US15160205

申请日：2016-05-20

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams ,  Kevin Peter D'Angelo ,  David Alan Brown

IPC分类号： H04N5/57

CPC分类号： H04N5/57 ,  H05B33/083 ,  H05B33/0842 ,  H05B37/0254

摘要： An LED driver IC for driving external strings of LEDs includes a prefix register and a data register connected in series with each other and with the prefix and data registers in other driver ICs. The prefix and data registers of the driver ICs are connected in a daisy chain arrangement with an interface IC. The interface IC loads data identifying a functional latch into the prefix register and data defining a functional condition into the data register of each driver IC. The data in the data register is then transferred to the functional latch to control the functional condition within the LED driver IC.

摘要翻译： 用于驱动LED的外部串的LED驱动器IC包括彼此串联连接的前缀寄存器和数据寄存器，以及其他驱动器IC中的前缀和数据寄存器。 驱动器IC的前缀和数据寄存器以菊花链方式连接到接口IC。 接口IC将识别功能锁存器的数据加载到前缀寄存器中，并将定义功能条件的数据加载到每个驱动器IC的数据寄存器中。 然后将数据寄存器中的数据传送到功能锁存器，以控制LED驱动器IC内的功能状态。