公开(公告)号：US10535642B2

公开(公告)日：2020-01-14

申请号：US16145879

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  H01L25/16 ,  G06F3/041 ,  G06F1/16 ,  G09G3/32 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US20200005720A1

公开(公告)日：2020-01-02

申请号：US16512286

申请日：2019-07-15

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/34 ,  G09G3/3233 ,  H01L25/075 ,  H01L25/16 ,  G09G3/3266 ,  G09G3/3216 ,  G09G3/20 ,  G09G3/32

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

公开(公告)号：US20190259739A1

公开(公告)日：2019-08-22

申请号：US16284125

申请日：2019-02-25

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/60 ,  H01L27/02 ,  H01L33/08 ,  H01L33/44 ,  H01L33/52 ,  H01L33/48 ,  H01L33/20 ,  H01L27/12 ,  H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L33/30 ,  H01L33/06

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US10297712B2

公开(公告)日：2019-05-21

申请号：US14312554

申请日：2014-06-23

Applicant: APPLE INC.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  H01L33/04 ,  F21V7/00 ,  H01L29/06 ,  H01L33/00 ,  H01L27/15 ,  H01L33/28 ,  H01L33/30 ,  H01L25/075 ,  H01L33/20

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：US10147711B2

公开(公告)日：2018-12-04

申请号：US15908505

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  H01L25/16 ,  G06F3/041 ,  G06F1/16 ,  G09G3/32 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US10121864B2

公开(公告)日：2018-11-06

申请号：US15282200

申请日：2016-09-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L29/167 ,  H01L25/075 ,  H01L33/62 ,  H01L23/00 ,  H01L21/67 ,  B32B38/18

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US20180190211A1

公开(公告)日：2018-07-05

申请号：US15908499

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/34 ,  G09G3/20 ,  H01L25/16 ,  H01L25/075 ,  G09G3/32

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

公开(公告)号：US09959815B2

公开(公告)日：2018-05-01

申请号：US15479962

申请日：2017-04-05

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/20 ,  H01L25/16 ,  G09G3/34 ,  G09G3/32 ,  H01L25/075

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

公开(公告)号：US09895902B2

公开(公告)日：2018-02-20

申请号：US15279083

申请日：2016-09-28

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu

IPC: G01P15/125 ,  B41J2/385 ,  H01L25/075 ,  B25J15/00 ,  H01L21/683 ,  B81C99/00 ,  B41J2/39 ,  H01L21/67 ,  H01L33/00 ,  H01L23/00

CPC classification number: B41J2/385 ,  B25J15/0052 ,  B25J15/0085 ,  B41J2/39 ,  B81B2201/038 ,  B81C99/002 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/29036 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

公开(公告)号：US20170206845A1

公开(公告)日：2017-07-20

申请号：US15479962

申请日：2017-04-05

Applicant: Apple Inc.

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Kelly McGroddy

IPC: G09G3/34 ,  H01L25/075 ,  H01L25/16 ,  G09G3/32

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.