公开(公告)号：US20230120136A1

公开(公告)日：2023-04-20

申请号：US18065270

申请日：2022-12-13

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L21/67 ,  B32B38/18 ,  H01L25/075 ,  H01L29/167 ,  H01L33/62

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

公开(公告)号：US11476239B2

公开(公告)日：2022-10-18

申请号：US17072240

申请日：2020-10-16

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibi ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10923023B1

公开(公告)日：2021-02-16

申请号：US15380860

申请日：2016-12-15

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Xia Li ,  John A. Higginson ,  Vaibhav D. Patel ,  Kapil V. Sakariya ,  Imran Hashim ,  Tore Nauta ,  Thomas Charisoulis

IPC: G09G3/32 ,  H01L27/32

Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.

公开(公告)号：US10814496B2

公开(公告)日：2020-10-27

申请号：US15839691

申请日：2017-12-12

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC: B25J15/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B25J7/00 ,  B25J15/04

Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US10276419B1

公开(公告)日：2019-04-30

申请号：US15183608

申请日：2016-06-15

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  John A. Higginson

IPC: H01L21/683 ,  B81C99/00 ,  H02N13/00 ,  B25J15/00

Abstract: A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

公开(公告)号：US10022859B2

公开(公告)日：2018-07-17

申请号：US15054977

申请日：2016-02-26

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J9/10 ,  H01L21/67 ,  B25J15/00 ,  B25J9/00 ,  B25J17/02 ,  H01L23/00 ,  B25J7/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

公开(公告)号：US09831383B2

公开(公告)日：2017-11-28

申请号：US14071106

申请日：2013-11-04

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

IPC: H01L29/18 ,  H01L33/08 ,  H01L23/00 ,  H01L33/00 ,  H01L33/40 ,  H01L21/67 ,  H01L27/15

CPC classification number: H01L33/08 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/95145 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

公开(公告)号：US09828244B2

公开(公告)日：2017-11-28

申请号：US14502994

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01H59/00 ,  H01L41/113 ,  B81C99/00

CPC classification number: B81C99/002 ,  H01H59/0009 ,  H01L41/113

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

公开(公告)号：US20170125391A1

公开(公告)日：2017-05-04

申请号：US15405042

申请日：2017-01-12

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L23/31 ,  H01L33/54 ,  H01L27/12 ,  H01L33/06 ,  H01L33/62 ,  H01L25/00 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US12131922B1

公开(公告)日：2024-10-29

申请号：US17089585

申请日：2020-11-04

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Patrick J. Czarnota ,  Paul A. Parks ,  Nile A. Light

IPC: H01L21/68 ,  B65G47/90 ,  H01L21/67 ,  H01L21/683 ,  B25J7/00 ,  B25J9/00 ,  B25J15/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6831 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0085

Abstract: A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.