Flexible array substrate, manufacturing method thereof, flexible display device

    公开(公告)号:US11563033B2

    公开(公告)日:2023-01-24

    申请号:US16905105

    申请日:2020-06-18

    Abstract: Embodiments of the present disclosure provide a flexible array substrate, a manufacturing method thereof, and a flexible display device, which relate to the field of display technology, and can reduce the difficulty of wiring, decrease the IR drop, and improve the problem that the wiring is prone to breakage when bent. The flexible array substrate includes a substrate, the substrate including a first sub-substrate and a second sub-substrate which are stacked, the second sub-substrate including at least one via hole; a wiring layer disposed between the first sub-substrate and the second sub-substrate; and a pixel array layer disposed on a side of the second sub-substrate facing away from the first sub-substrate; the wiring layer including a wiring, wherein the pixel array layer is electrically connected to the wiring through the at least one via hole.

    DISPLAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE

    公开(公告)号:US20220320227A1

    公开(公告)日:2022-10-06

    申请号:US17310401

    申请日:2020-09-30

    Abstract: A display substrate, a display panel, and a display device are provided. The display substrate includes: a base substrate; a first semiconductor layer on the base substrate; and a second semiconductor layer on a side of the first semiconductor layer away from the base substrate. The display substrate further includes a plurality of thin film transistors on the base substrate, which at least include a first transistor, a second transistor and a third transistor. Each of the plurality of thin film transistors includes an active layer. The active layer of at least one of the first transistor and the second transistor is located in the second semiconductor layer and contains an oxide semiconductor material. The active layer of the third transistor is located in the first semiconductor layer and contains a polysilicon semiconductor material. At least one of the first transistor and the second transistor has a dual-gate structure.

    ARRAY SUBSTRATE, PREPARATION METHOD THEREOF AND DISPLAY PANEL

    公开(公告)号:US20210098503A1

    公开(公告)日:2021-04-01

    申请号:US17007477

    申请日:2020-08-31

    Abstract: A method for preparing an array substrate includes: forming first and second active layers, and first and second gate layers above a base substrate; forming first and second via holes for exposing the first active layer and etching the first active layer; forming a first source-drain electrode layer including a first source electrode layer contacting the first active layer through the first via hole and a first drain electrode layer contacting the first active layer through the second via hole; forming third and fourth via holes for exposing the second active layer; forming a second source-drain electrode layer including a second source electrode layer contacting the second active layer through the third via hole and a second drain electrode layer contacting the second active layer through the fourth via hole. The second source/drain electrode layer is electrically connected with the first source-drain electrode layer.

    A FLEXIBLE SUBSTRATE ATTACHING METHOD AND FLEXIBLE SUBSTRATE ATTACHMENT STRUCTURE
    19.
    发明申请
    A FLEXIBLE SUBSTRATE ATTACHING METHOD AND FLEXIBLE SUBSTRATE ATTACHMENT STRUCTURE 有权
    柔性基板附着方法和柔性基板附着结构

    公开(公告)号:US20160338189A1

    公开(公告)日:2016-11-17

    申请号:US14761986

    申请日:2015-02-10

    Inventor: Ce Ning Tao Gao

    Abstract: The present disclosure relates to the technical field of flexible substrate processing, and discloses a flexible substrate attaching method. The flexible substrate attaching method comprises the steps of: pre-fixing a flexible substrate on a carrier substrate with a first fixation structure; forming a thin film on the flexible substrate, and forming a pattern of the thin film via a patterning process; the pattern of the thin film contacting at least a part of the flexible substrate and at least a part of the carrier substrate simultaneously to play the function of consolidating the flexible substrate onto the carrier substrate. In this flexible substrate attaching method, a flexible substrate can be fixed on a carrier substrate in good effect and the flexible panel can be easily detached after the manufacture is completed. The present disclosure further provides a flexible substrate attachment structure.

    Abstract translation: 本公开涉及柔性基板加工的技术领域,并且公开了一种柔性基板附着方法。 柔性基板安装方法包括以下步骤:利用第一固定结构将柔性基板预固定在载体基板上; 在柔性基板上形成薄膜,并通过图案化工艺形成薄膜图案; 所述薄膜的图案与所述柔性基板的至少一部分和所述载体基板的至少一部分同时接触,以发挥将所述柔性基板固结到所述载体基板上的功能。 在这种柔性基板的贴合方法中,柔性基板能够以良好的效果固定在载体基板上,并且在制造完成后可以容易地分离柔性面板。 本公开进一步提供了柔性基板附接结构。

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