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公开(公告)号：US5322565A
公开(公告)日：1994-06-21
申请号：US810246
申请日：1991-12-19
申请人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
发明人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
CPC分类号： H01L21/6715 , H05K3/4053 , H05K2201/09981 , H05K2203/082 , H05K3/1233
摘要： A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
摘要翻译： 公开了一种能够自动打印在陶瓷基板等的顶表面和底表面之间延伸的通孔的方法和装置。 衬底的周边被放置在支撑件上，支撑件定位衬底的底表面与与衬底的内部部分相互作用的构件间隔开。 相互作用的构件具有与衬底中的通孔相对应的孔，并且其大致垂直于衬底移动到与衬底的底表面并置的位置，并且其孔与位于衬底中的孔对准的位置 基质。 将导电材料施加到衬底的顶表面，并且将真空施加到相互作用构件中的孔以将导电材料拉过衬底中的通孔。 然后中断真空并且相互作用的构件被移回到与衬底的底表面间隔开的位置。
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公开(公告)号：US07352070B2
公开(公告)日：2008-04-01
申请号：US10608702
申请日：2003-06-27
IPC分类号： H01L23/29
CPC分类号： H01L23/295 , H01L21/563 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler having a platelet geometric structure. The platelet structure of the filler allows a desirable coefficient of thermal expansion to be achieved using a very low level of filler material. This low level of filler material facilitates lower viscosity during forming of the encapsulation and/or overmolding, thereby facilitating complete filling of a mold cavity and underfilling of space between a circuit board and a semi-conductor chip electrically connected to the circuit board. In addition, the low viscosity has processing advantages that reduce the potential for damage to electrical components during encapsulation, overmolding and/or underfilling.
摘要翻译： 具有完全包封，包覆成型和/或底部填充的具有均匀且基本上不含梯度的热膨胀系数的改进的包封的，包覆成型的和/或未充满电的电组件包括聚合物基质和具有血小板几何结构的无机填料。 填料的血小板结构允许使用非常低水平的填充材料来实现所需的热膨胀系数。 这种低水平的填充材料在形成封装和/或包覆成型期间有助于较低的粘度，从而有助于模制空腔的完全填充和电路板与电连接到电路板的半导体芯片之间的空间不足。 此外，低粘度具有加工优点，减少在封装，包覆成型和/或底部填充期间损坏电气部件的可能性。
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公开(公告)号：US07334243B2
公开(公告)日：2008-02-19
申请号：US11214634
申请日：2005-08-30
IPC分类号： G11B33/14
CPC分类号： G11B17/028 , G11B17/0282 , G11B33/142
摘要： The present invention relates to the cooling of electronic components such as CD or DVD players and recorders and the disc or discs within. Specifically, the present invention relates to the internal cooling of a disc playing or recording device and the disc or discs within.
摘要翻译： 本发明涉及电子部件如CD或DVD播放器和记录器以及其中的盘或盘的冷却。 具体地说，本发明涉及盘片播放或记录装置的内部冷却以及其内的盘或盘。
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14.发明授权Circuit board with localized stiffener for enhanced circuit component reliability 有权具有局部加强件的电路板，用于增强电路部件的可靠性公开(公告)号：US07094975B2
公开(公告)日：2006-08-22
申请号：US10717839
申请日：2003-11-20
IPC分类号： H05K1/03
CPC分类号： H05K1/0206 , H01L2224/16225 , H01L2224/73204 , H05K1/0271 , H05K3/0061 , H05K2201/068 , H05K2201/10204 , H05K2201/10545 , H05K2201/10674 , H05K2201/2009
摘要： A circuit board assembly comprising a laminate substrate and a surface mount device having a CTE less than that of the laminate substrate and attached with at least one solder joint to a first surface of the laminate substrate. The assembly further includes a localized stiffener attached to a second surface of the laminate substrate so as to be directly opposite the circuit device. The localized stiffener is formed of a material and is shaped so that, when attached to the laminate substrate, the stiffener is capable of increasing the thermal cycle fatigue life of the one or more solder joints that attach the device to the substrate.
摘要翻译： 一种电路板组件，包括层压基板和表面安装装置，所述表面安装装置的CTE小于层压基板的CTE，并且与至少一个焊接接头连接到层叠基板的第一表面。 组件还包括附着到层叠基板的第二表面以便与电路装置直接相对的局部加强件。 局部加强件由材料形成并且被成形为使得当附接到层叠基板时，加强件能够增加将该装置附接到基板的一个或多个焊点的热循环疲劳寿命。
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15.发明授权
公开(公告)号：US5334422A
公开(公告)日：1994-08-02
申请号：US13851
申请日：1993-02-05
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/498 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/092 , H05K3/22 , H05K3/3452 , Y10T29/49121 , Y10T29/49126
摘要： A method of forming solder stops on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop.
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公开(公告)号：US5080929A
公开(公告)日：1992-01-14
申请号：US503407
申请日：1990-04-02
申请人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
发明人： Joseph M. Zachman , Clyde E. Ragan , Steven L. Alexander , Bruce A. Myers , Charles T. Eytcheson
CPC分类号： H01L21/6715 , H05K3/4053 , H05K2201/09981 , H05K2203/082 , H05K3/1233
摘要： A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
摘要翻译： 公开了一种能够自动打印在陶瓷基板等的顶表面和底表面之间延伸的通孔的方法和装置。 衬底的周边被放置在支撑件上，支撑件定位衬底的底表面与与衬底的内部部分相互作用的构件间隔开。 相互作用的构件具有与衬底中的通孔相对应的孔，并且其大致垂直于衬底移动到与衬底的底表面并置的位置，并且其孔与位于衬底中的孔对准的位置 基质。 将导电材料施加到衬底的顶表面，并且将真空施加到相互作用构件中的孔以将导电材料拉过衬底中的通孔。 然后中断真空并且相互作用的构件被移回到与衬底的底表面间隔开的位置。
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公开(公告)号：US4894015A
公开(公告)日：1990-01-16
申请号：US238943
申请日：1988-08-31
CPC分类号： H05K3/363 , H01R12/724 , H01R12/62 , H05K1/0393 , H05K1/092 , H05K1/141 , H05K2201/0394 , H05K2201/049 , H05K2201/09063 , H05K2201/10189 , H05K3/3447 , H05K3/3463 , Y10T29/49147 , Y10T29/49151
摘要： A flexible circuit interconnector connects a circuit board having a ceramic substrate to pin connectors at the connector end of a circuit board connector housing. The interconnect has a thin flexible sheet of polymeric, electrical insulating material with a mating end and a connector end. The mating end includes a plurality of spaced holes therethrough for receiving tail ends of the pin connectors. A plurality of electrically conductive runners provided on one side of the flexible sheet electrically connect the pin connectors to printed conductors on the ceramic substrate. The thin flexible sheet has a viewing slot at the connector end thereof which is bridged by the runners and it has a bend which accommodates differential thermal expansion in the circuit board and connector. The method of assembly includes prebending the interconnect to accommodate thermal expansion between the connector housing and the ceramic substrate; placing the slot over the ceramic substrate to view the conductor print pattern; aligning each of the runners with one conductor in the print pattern; one step soldering each of the runners to separate conductors in the print pattern to complete electrical circuits; cleaning flux from the soldered parts and thereafter connecting the mating end of the flexible circuit interconnector to the pin connectors of the circuit board connector housing.
摘要翻译： 柔性电路互连器将具有陶瓷基板的电路板连接到电路板连接器壳体的连接器端处的引脚连接器。 互连具有薄的柔性片状聚合物电绝缘材料，其具有配合端和连接器端。 配合端包括多个间隔开的孔，用于接收销连接器的尾端。 设置在柔性片的一侧上的多个导电流道将引脚连接器电连接到陶瓷基板上的印刷导体。 薄柔性片在其连接器端具有观察槽，其由滑道桥接，并且其具有适应电路板和连接器中的差分热膨胀的弯曲。 组装方法包括预弯曲互连以适应连接器壳体和陶瓷衬底之间的热膨胀; 将所述槽放置在所述陶瓷基板上以观察所述导体印刷图案; 将每个跑步者与打印图案中的一个导体对准; 一步焊接每个流道以分离打印图案中的导体以完成电路; 清洁焊接部件的焊剂，然后将柔性电路互连器的配合端连接到电路板连接器壳体的销连接器。
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18.发明授权公开(公告)号：US08480798B1
公开(公告)日：2013-07-09
申请号：US12980528
申请日：2010-12-29
申请人： Bruce A. Myers , David W. Ihms
发明人： Bruce A. Myers , David W. Ihms
IPC分类号： B01D53/14
CPC分类号： F01N3/0857 , B01D53/92 , B01D2257/504 , F01N3/04 , F01N3/0871 , F01N2240/02 , F01N2570/10 , Y02C10/06 , Y02T10/20
摘要： A system for separating and storing carbon dioxide (CO2) in exhaust produced by an internal combustion engine. The system uses a scrubber tank containing a carbon dioxide absorbent fluid to capture CO2 in the exhaust. The system also includes a carbon dioxide storage means configured to temporarily store the captured CO2, and a CO2 recovery facility to refine the captured CO2 for future use or prepare the CO2 for permanent storage. The system is intended for installation on vehicles such as automobiles to reduce the amount of CO2 emitted by automobiles into the environment, but could also be used for other applications such as stationary power generators.
摘要翻译： 一种用于在由内燃机产生的废气中分离和储存二氧化碳（CO 2）的系统。 该系统使用含有二氧化碳吸收剂流体的洗涤槽来捕获排气中的CO 2。 该系统还包括被配置为临时存储所捕获的CO 2的二氧化碳储存装置，以及二氧化碳回收装置，以精炼所捕获的二氧化碳以备将来使用，或者为了永久储存准备二氧化碳。 该系统旨在安装在诸如汽车的车辆上，以减少汽车向环境中排出的二氧化碳量，但也可用于其他应用，如固定发电机。
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19.发明授权Liquid cooled power electronic circuit comprising stacked direct die cooled packages 有权液冷电力电子电路包括堆叠的直接模具冷却封装公开(公告)号：US07608924B2
公开(公告)日：2009-10-27
申请号：US11800003
申请日：2007-05-03
申请人： Bruce A. Myers , Joseph M. Ratell
发明人： Bruce A. Myers , Joseph M. Ratell
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/367 , H01L23/3677 , H01L23/4012 , H01L25/117 , H01L2924/0002 , H01L2924/00
摘要： A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.
摘要翻译： 多个直接模具冷却的半导体功率器件封装件以冷却剂和电接口两者垂直堆叠形成液冷电力电子电路。 这些包装件是单独相同的，并且在堆叠之前选择性地取向以形成所需的电路连接并横向错开封装引线。
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公开(公告)号：US07307841B2
公开(公告)日：2007-12-11
申请号：US11191822
申请日：2005-07-28
CPC分类号： H01L23/473 , H01L23/44 , H01L2224/16225 , H01L2224/48091 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H05K7/20236 , H05K7/20909 , H01L2924/00014 , H01L2924/00
摘要： An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.
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