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公开(公告)号：US10598967B2
公开(公告)日：2020-03-24
申请号：US15615290
申请日：2017-06-06
Applicant: Cisco Technology, Inc.
Inventor： Donald Adams , Prakash B. Gothoskar , Vipulkumar Patel , Mark Webster
Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.
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公开(公告)号：US10545291B1
公开(公告)日：2020-01-28
申请号：US16115432
申请日：2018-08-28
Applicant: Cisco Technology, Inc.
Inventor： Sean P. Anderson , Dominic F. Siriani , Jock T. Bovington , Matthew J. Traverso , Vipulkumar Patel
Abstract: The embodiments herein describe an optical transmitter that integrates a SCOWA into a photonic chip that includes a modulator. The embodiments herein place the SCOWA between the laser and the modulator. To accommodate the large mode size of the waveguide in the SCOWA, the photonic chip includes a pair of spot size converters coupled to the input and output of the SCOWA. Rather than amplifying a modulated signal as is typical with an inline amplifier, the SCOWA amplifies a continuous wave (CW) optical signal generated by the laser which introduces less noise and improves the OSNR of the transmitter.
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公开(公告)号：US09939580B2
公开(公告)日：2018-04-10
申请号：US15203571
申请日：2016-07-06
Applicant: Cisco Technology, Inc.
Inventor： Stefan Martin Pfnuer , Matthew Joseph Traverso , Vipulkumar Patel
CPC classification number: G02B6/12002 , G02B6/423 , G02B6/4238 , G02B6/4245 , G02B6/4274 , G02B6/428 , G02B6/43 , G02B2006/121 , G02B2006/12102 , G02B2006/12121
Abstract: Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.
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公开(公告)号：US09864133B2
公开(公告)日：2018-01-09
申请号：US15208658
申请日：2016-07-13
Applicant: Cisco Technology ,Inc.
Inventor： Vipulkumar Patel , Mark Webster , Ravi Tummidi , Mary Nadeau
CPC classification number: G02B6/12004 , G02B6/12002 , G02B6/1228 , G02B6/124 , G02B6/125 , G02B6/305 , G02B6/34 , G02B6/4206 , G02B6/4274 , G02B6/4291
Abstract: The embodiments herein describe a photonic chip (formed from a SOI structure) which includes an optical interface for coupling the optical components in the photonic chip to an external optical device. In one embodiment, the optical interface is formed on a separate substrate which is later joined to the photonic chip. Through oxide vias (TOVs) and through silicon vias (TSVs) can be used to electrically couple the optical components in the photonic chip to external integrated circuits or amplifiers. In one embodiment, after the separate wafer is bonded to the photonic chip, a TOV is formed in the photonic chip to electrically connect metal routing layers coupled to the optical components in the photonic chip to a TSV in the separate wafer. For example, the TOV may extend across a wafer bonding interface where the two substrates where bonded to form an electrical connection with the TSV.
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公开(公告)号：US09766484B2
公开(公告)日：2017-09-19
申请号：US14248081
申请日：2014-04-08
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Donald Adams , Prakash Gothoskar , Vipulkumar Patel , Mark Webster
CPC classification number: G02F1/025 , G02B6/132 , G02B6/136 , G02F1/011 , G02F1/2257 , G02F2001/0152
Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.
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Patent Agency Ranking
16.发明授权Aligning optical components in a multichannel receiver or transmitter platform 有权在多通道接收器或发射器平台中对准光学部件公开(公告)号：US09419718B2
公开(公告)日：2016-08-16
申请号：US14462239
申请日：2014-08-18
Applicant: Cisco Technology, Inc.
Inventor： Prakash Gothoskar , Vipulkumar Patel , Kalpendu Shastri , Rao V. Yelamarty
CPC classification number: H04B10/40 , G02B6/4215 , G02B6/423 , G02B6/4244 , G02B6/4249
Abstract: Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.
Abstract translation: 本文所述的实施例描述了一种子座，其被蚀刻以包括具有对准光学滤光器和反射镜的至少两个相邻侧的相应空腔。 此外，空腔被布置在子安装座上，使得当滤光器和反射镜设置在空腔中时，它们以使得能够执行复用或解复用功能作为例如锯齿形复用器/ 解复用器 在一个实施例中，滤波器和反射镜被动地而不是主动对准。 然后可以将该子安装件放置在包括ROSA或TOSA的其它部件的基板上。 在一个实施例中，衬底也被蚀刻以包括两个相邻侧面的空腔以对准子安装座，使得一旦设置在空腔中，子安装座被动地对准。
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公开(公告)号：US09411105B2
公开(公告)日：2016-08-09
申请号：US14330487
申请日：2014-07-14
Applicant: Cisco Technology, Inc.
Inventor： Sean Anderson , Weizhuo Li , Vipulkumar Patel
CPC classification number: G02B6/32 , G02B3/0087 , G02B6/124 , G02B6/1245 , G02B6/132 , G02B6/136 , G02B6/30 , G02B6/4206 , G02B2006/12095 , G02B2006/121 , G02B2006/12176 , G02B2006/12178 , G02B2006/12195
Abstract: An optical coupling may involve orienting a waveguide and a lens such that light rays are focused on a surface. The lens may involve the use of a material having a variable refractive index to focus rays of light along first axis and a curved surface to focus the rays of light along a second axis.
Abstract translation: 光学耦合可以包括使波导和透镜定向使得光线聚焦在表面上。 透镜可以包括使用具有可变折射率的材料来聚焦沿第一轴线的光线和弯曲表面以将光线沿着第二轴线聚焦。
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公开(公告)号：US09122037B2
公开(公告)日：2015-09-01
申请号：US13945134
申请日：2013-07-18
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Ravi Sekhar Tummidi , Vipulkumar Patel
CPC classification number: G02B6/46 , B32B37/16 , B32B38/0004 , B32B38/0012 , B32B38/10 , B32B2038/0016 , B32B2307/202 , B32B2307/40 , G02B6/12 , G02B6/2826 , G02B6/30 , Y10T156/1052
Abstract: An optical coupler may include a fiber optic structure that has a portion of an outer surface that is beveled at a predetermined angle relative to a longitudinal axis of the fiber optic structure. The beveled outer surface portion may be optically coupled with a waveguide core of an optical integrated circuit. The fiber optic structure may also include a second outer surface portion that is butt coupled to an end of an optical fiber to optically couple the second outer surface portion with the optical fiber.
Abstract translation: 光耦合器可以包括光纤结构，其具有相对于光纤结构的纵向轴线以预定角度倾斜的外表面的一部分。 斜面外表面部分可以与光学集成电路的波导芯光学耦合。 光纤结构还可以包括第二外表面部分，其与光纤的端部对接，以将第二外表面部分与光纤光学耦合。
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19.发明授权公开(公告)号：US09052445B2
公开(公告)日：2015-06-09
申请号：US13656528
申请日：2012-10-19
Applicant: Cisco Technology, Inc.
Inventor： Kishor Desai , Ravinder Kachru , Vipulkumar Patel , Bipin Dama , Kalpendu Shastri , Soham Pathak
IPC: H01L21/00 , G02B6/12 , H01L33/52 , G02B6/42 , G02B6/43 , H01L23/04 , H01L23/48 , H01L25/16 , H01L31/0203 , H05K1/02 , H01L21/50
CPC classification number: G02B6/4255 , G02B6/12 , G02B6/13 , G02B6/4201 , G02B6/4257 , G02B6/4292 , G02B6/43 , H01L21/50 , H01L23/04 , H01L23/48 , H01L25/167 , H01L31/0203 , H01L33/52 , H01L2924/15311 , H01L2924/16152 , H01L2924/1616 , H01L2924/165 , H01L2924/16788 , H05K1/0268 , H05K1/0274 , H05K2201/10121 , H01L2924/0105 , H01L2924/01079
Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.
Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。
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公开(公告)号：US20150021291A1
公开(公告)日：2015-01-22
申请号：US13945702
申请日：2013-07-18
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu Shastri , Ravi Sekhar Tummidi , Vipulkumar Patel
CPC classification number: G02B6/46 , B32B37/16 , B32B38/0004 , B32B38/0012 , B32B38/10 , B32B2038/0016 , B32B2307/202 , B32B2307/40 , G02B6/12 , G02B6/2826 , G02B6/30 , Y10T156/1052
Abstract: An optical coupler may include a fiber optic structure that has a portion of an outer surface that is beveled at a predetermined angle relative to a longitudinal axis of the fiber optic structure. The beveled outer surface portion may be optically coupled with a waveguide core of an optical integrated circuit. The fiber optic structure may also include a second outer surface portion that is butt coupled to an end of an optical fiber to optically couple the second outer surface portion with the optical fiber.
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