公开(公告)号：US20160368100A1

公开(公告)日：2016-12-22

申请号：US15251453

申请日：2016-08-30

Applicant: CORNING INCORPORATED

Inventor： Sasha Marjanovic ,  Garrett Andrew Piech ,  Shyamala Shanmugam ,  Carlos Alberto Pons Siepermann ,  Sergio Tsuda ,  Zsigmond Varga ,  Robert Stephen Wagner

IPC: B23K26/384 ,  B23K26/402 ,  C03B33/09 ,  B23K26/04 ,  C03B33/02 ,  C03C15/00

CPC classification number: B23K26/384 ,  B23K26/04 ,  B23K26/0613 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/38 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B32B17/064 ,  C03B33/0222 ,  C03B33/091 ,  C03C15/00 ,  C03C17/00 ,  C03C2217/70 ,  C09K13/00 ,  Y02P40/57 ,  Y10T428/24273 ,  Y10T428/24322

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

公开(公告)号：US12233474B2

公开(公告)日：2025-02-25

申请号：US17329578

申请日：2021-05-25

Applicant: CORNING INCORPORATED

Inventor： Valdemaras Juzumas ,  Reinhard Moritz Malchus ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Vytautas Sabonis ,  Ralf Joachim Terbrueggen

IPC: B23K26/0622 ,  B23K26/06 ,  B23K26/18 ,  B23K26/53 ,  B23K103/00

Abstract: A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w o 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

公开(公告)号：US11972993B2

公开(公告)日：2024-04-30

申请号：US17320646

申请日：2021-05-14

Applicant: CORNING INCORPORATED

Inventor： Rachel Eileen Dahlberg ,  Tian Huang ,  Yuhui Jin ,  Garrett Andrew Piech ,  Daniel Ohen Ricketts

IPC: H01L23/15 ,  B23K26/00 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/00 ,  H01L21/48 ,  H01L23/498 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/073 ,  B23K26/36 ,  B23K103/00 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L23/15 ,  B23K26/0006 ,  B23K26/06 ,  B23K26/062 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  C03C15/00 ,  C03C23/0025 ,  B23K26/0617 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/0738 ,  B23K26/36 ,  B23K2103/54 ,  H01L21/486 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T428/24273

Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

公开(公告)号：US11648623B2

公开(公告)日：2023-05-16

申请号：US15325905

申请日：2015-07-14

Applicant: Corning Incorporated

Inventor： Jacques Gollier ,  Garrett Andrew Piech

IPC: B23K26/00 ,  B23K26/067 ,  B23K26/073 ,  C03B33/02 ,  G02B5/00 ,  G02B27/09 ,  B23K26/06 ,  G02B7/10 ,  B23K103/00 ,  G02B7/14

CPC classification number: B23K26/0006 ,  B23K26/0613 ,  B23K26/0648 ,  B23K26/0676 ,  B23K26/0732 ,  B23K26/0734 ,  B23K26/0738 ,  C03B33/0222 ,  G02B5/001 ,  G02B7/10 ,  G02B27/095 ,  G02B27/0911 ,  G02B27/0927 ,  G02B27/0977 ,  B23K2103/54 ,  G02B7/14

Abstract: A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6′) disposed within an optical path of the pulsed laser beam. The optical assembly (6′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

公开(公告)号：US20210379695A1

公开(公告)日：2021-12-09

申请号：US17329578

申请日：2021-05-25

Applicant: CORNING INCORPORATED

Inventor： Valdemaras Juzumas ,  Reinhard Moritz Malchus ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Vytautas Sabonis ,  Ralf Joachim Terbrueggen

IPC: B23K26/0622 ,  B23K26/18 ,  B23K26/06 ,  B23K26/53

Abstract: A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w o 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater.

公开(公告)号：US11186060B2

公开(公告)日：2021-11-30

申请号：US15205284

申请日：2016-07-08

Applicant: CORNING INCORPORATED

Inventor： Kristopher Allen Wieland ,  Garrett Andrew Piech ,  John Tyler Keech ,  Jeffrey Mathew Clark

IPC: B32B3/26 ,  B32B17/06 ,  B23K26/53 ,  C03C15/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  C03B33/02 ,  C03C17/06 ,  B23K26/06 ,  B23K103/00

Abstract: Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

公开(公告)号：US11059131B2

公开(公告)日：2021-07-13

申请号：US16430985

申请日：2019-06-04

Applicant: CORNING INCORPORATED

Inventor： Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/364 ,  C03C23/00 ,  B23K103/00

Abstract: A method for laser processing a substrate stack includes forming a defect in a transparent workpiece of the substrate stack having a black matrix layer. Forming the defect includes directing a portion of a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. The pulsed laser beam directed into the transparent workpiece of the substrate stack forms a pulsed laser beam focal line disposed within the transparent workpiece, where a center of the pulsed laser beam focal line is offset from an edge of the black matrix layer by a distance that is about 20% or less of a total thickness of the substrate stack and generates an induced absorption within the transparent workpiece.

公开(公告)号：US20210206693A1

公开(公告)日：2021-07-08

申请号：US17056590

申请日：2019-05-20

Applicant: CORNING INCORPORATED

Inventor： Michael Peter Gaj ,  Garrett Andrew Piech ,  Nickolaos Savidis

IPC: C03C23/00 ,  C03C15/02 ,  G02B3/14

Abstract: A liquid lens that includes: a lens body comprising a first window, a second window, and a cavity disposed between the first window and the second window; and a first liquid and a second liquid within the cavity of the lens body, the first liquid and the second liquid substantially immiscible with each other and having different refractive indices such that an interface between the first liquid and second liquid to form a lens. The sidewall of the cavity has an average surface roughness (Ra) of less than or equal to 200 nanometers (nm). The cavity is disposed within a plate. Further, each of the windows and the plate comprises a glass, glass-ceramic or ceramic composition. In addition, a linearity of a first bottom portion of the sidewall in proximity to the base of the plate can be from 0 μm±5 μm.

公开(公告)号：US10522963B2

公开(公告)日：2019-12-31

申请号：US15689456

申请日：2017-08-29

Applicant: Corning Incorporated

Inventor： Lovell Eglin Comstock, II ,  Jaques Gollier ,  Thien An Thi Nguyen ,  Garrett Andrew Piech ,  Mark Ranney Westcott

IPC: B23K26/04 ,  B23K26/53 ,  H01S3/06 ,  H01S3/00 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/06 ,  B23K26/067 ,  B23K26/073 ,  C03B33/02 ,  B23K103/00

Abstract: A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.

公开(公告)号：US10429553B2

公开(公告)日：2019-10-01

申请号：US15552417

申请日：2016-02-24

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Garrett Andrew Piech ,  James Andrew West

IPC: G02B5/02 ,  F21V8/00 ,  G02F1/1335 ,  G02B5/00

Abstract: An optical assembly includes a transparent substrate having a first major surface and a second major surface. The transparent substrate includes one or more damage layers disposed between a first non-damage layer and a second non-damage layer. Elongated laser-induced damage tracks are disposed within the damaged layer(s) to form at least one area pattern so that light directed toward the transparent substrate at an angle that exceeds a predetermined viewing angle (θ) is scattered by the plurality of laser-induced damage tracks. Alternatively, if light is directed toward the transparent substrate at an angle that is less than the predetermined viewing angle (θ), it is transmitted by the transparent substrate.