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    LIGHT EMITTING DEVICES AND METHODS
    11.
    发明申请
    LIGHT EMITTING DEVICES AND METHODS 有权
    发光装置和方法

    公开(公告)号：US20130334548A1

    公开(公告)日：2013-12-19

    申请号：US13908597

    申请日：2013-06-03

    申请人： CREE, INC.

    发明人： Erin R. F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph G. Clark

    IPC分类号： H01L33/60

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

    摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。

    HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF
    15.
    发明申请
    HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF 审中-公开

    公开(公告)号：US20170294417A1

    公开(公告)日：2017-10-12

    申请号：US15399729

    申请日：2017-01-05

    申请人： Cree, Inc.

    发明人： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

    IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/00 ,  H01L27/15 ,  H01L33/50

    摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

    Method of providing light emitting device
    16.
    发明授权
    Method of providing light emitting device 有权
    提供发光装置的方法

    公开(公告)号：US08921869B2

    公开(公告)日：2014-12-30

    申请号：US13908597

    申请日：2013-06-03

    申请人： Cree, Inc.

    发明人： Erin R. F. Welch ,  Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Joseph G. Clark

    IPC分类号： H01L27/15

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.

    摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。

    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS
    17.
    发明申请
    LIGHT EMITTER COMPONENTS, SYSTEMS, AND RELATED METHODS 有权
    发光元件，系统和相关方法

    公开(公告)号：US20140268728A1

    公开(公告)日：2014-09-18

    申请号：US13838654

    申请日：2013-03-15

    申请人： CREE, INC.

    发明人： Christopher P. Hussell ,  Sung Chul Joo ,  Erin Welch ,  Peter Scott Andrews ,  Joseph G. Clark ,  John A. Edmond ,  Jesse C. Reiherzer

    IPC分类号： F21K99/00

    CPC分类号： F21K9/90 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.

    摘要翻译： 公开了具有改善的光学效率和较低制造成本的光发射器部件，系统和相关方法。 在一个方面，光发射器部件可以包括具有细长主体和第一和第二端的基板。 可以在衬底上提供至少第一迹线和第二迹线。 在一些方面，第一迹线可以设置在基板的第一端附近，并且第二迹线可以设置在基板的第二端附近，而第一迹线或第二迹线的其它部分没有设置在第一和第二迹线之间 基片的端部。 在一些方面，可以在衬底上提供一串LED芯片。 LED芯片串可以设置在基板的第一和第二端之间。 在某些方面也可以提供角度曲线，间隙和光发射器部件。