公开(公告)号：US09172012B2

公开(公告)日：2015-10-27

申请号：US13796045

申请日：2013-03-12

Applicant: CREE, Inc.

Inventor： Peter S. Andrews ,  Kurt S. Wilcox ,  Theodore Lowes ,  Bernd P. Keller

IPC: H01L21/00 ,  H01L33/00 ,  H01L33/58 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L33/40 ,  H01L23/00

CPC classification number: H01L33/58 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one embodiment, a light emitter package can include a ceramic submount. An array of light emitter chips can be disposed over a portion of the submount, and each light emitter chip can include a horizontal chip structure having positive and negative electrical contacts disposed on a same side. The positive and negative electrical contacts can be adapted to electrically communicate to conductive portions of the submount. Light emitter packages can further include a lens overmolded on the submount and covering a portion of the array.

Abstract translation: 提供了具有多个发光二极管（LED）芯片等发光二极管的发光二极管封装及相关方法。 在一个实施例中，光发射器封装可以包括陶瓷基座。 发光芯片阵列可以设置在基座的一部分上，并且每个发光芯片可以包括具有设置在同一侧上的正和负电触头的水平芯片结构。 正和负电触点可以适于与基座的导电部分电连通。 光发射器封装还可以包括在基座上包覆模制并覆盖阵列的一部分的透镜。

公开(公告)号：US20150200336A1

公开(公告)日：2015-07-16

申请号：US14201490

申请日：2014-03-07

Applicant: CREE, INC.

Inventor： Chandon Bhat ,  Fan Zhang ,  Theodore Lowes ,  Peter Andrews

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/46 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/11 ,  H01L2933/0066

Abstract: This disclosure relates to surface mount devices, such as light emitting devices, and methods of manufacture thereof, including recessed contact pads in relation to a mount surface, such that contact bumps and a reflective material are disposed to form a planar mounting surface. Embodiments according to the present disclosure include a light emitting device, wherein the device comprises at a reflective layer, forming at least a portion of a mounting surface. The device also includes one or more contact pads on the device, such that the contact pads are recessed in relation to the reflective layer. Contact bumps are formed on the contact pads, protruding beyond the contact pads, wherein the contact bumps compose at least a portion of the mounting surface. Methods of manufacture including methods utilizing virtual wafer structures are also disclosed.

Abstract translation: 本公开涉及诸如发光器件的表面贴装器件及其制造方法，包括相对于安装表面的凹陷接触焊盘，使得接触凸块和反射材料被设置成形成平面安装表面。 根据本公开的实施例包括发光器件，其中所述器件包括在反射层处，形成安装表面的至少一部分。 器件还包括器件上的一个或多个接触焊盘，使得接触焊盘相对于反射层凹陷。 接触凸块形成在接触垫上，突出超过接触垫，其中接触凸块组成安装表面的至少一部分。 还公开了包括使用虚拟晶片结构的方法的制造方法。

公开(公告)号：US20130329429A1

公开(公告)日：2013-12-12

申请号：US13902080

申请日：2013-05-24

Applicant: Cree, Inc.

Inventor： Theodore Lowes ,  Deborah Kircher

IPC: F21K99/00 ,  H01L33/60 ,  H01L33/08

CPC classification number: H01L33/08 ,  F21K9/62 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: LED packages are disclosed having encapsulants which can have at least one reflective surface. Due to the reflection of light, the encapsulant can serve as a mixing chamber and thus can produce light of a more uniform color. The encapsulant can take many different shapes, including that of a cylinder and that of a rectangular prism. Encapsulants can also include scatterers to further mix the light.

Abstract translation: 公开了具有可具有至少一个反射表面的密封剂的LED封装。 由于光的反射，密封剂可以用作混合室，因此可以产生更均匀颜色的光。 密封剂可以采用许多不同的形状，包括圆柱体和矩形棱镜的形状。 胶囊剂还可以包括散射体进一步混合光线。

公开(公告)号：US09798072B2

公开(公告)日：2017-10-24

申请号：US14839557

申请日：2015-08-28

Applicant: Cree, Inc.

Inventor： Steve Wilcenski ,  Kurt S. Wilcox ,  Theodore Lowes

IPC: F21V8/00 ,  F21Y105/00 ,  F21Y115/10

CPC classification number: G02B6/0065 ,  F21Y2105/00 ,  F21Y2115/10 ,  G02B6/0033 ,  G02B6/005

Abstract: According to one aspect, an optical waveguide comprises a waveguide body exhibiting total internal reflection, a substrate, and a plurality of light extraction features disposed on a surface of the substrate. The light extraction features are non-adhesively bonded to the waveguide body or may be disposed on opposing sides of the substrate. A method of forming an optical element is also disclosed.

公开(公告)号：US09666762B2

公开(公告)日：2017-05-30

申请号：US13796954

申请日：2013-03-12

Applicant: CREE, Inc.

Inventor： Theodore Lowes ,  Bernd P. Keller

IPC: H01L33/44 ,  H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64 ,  H01L33/58 ,  H01L33/40 ,  H01L23/00

CPC classification number: H01L33/48 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one aspect, a light emitter package can include a submount, an array of light emitter chips disposed on a portion of the submount, and a lens provided over the submount and covering at least portions of the array. In some aspects, at least some of the light emitter chips can be adapted to emit light of a first dominant wavelength. In further aspects, at least some other light emitter chips are adapted to emit light of a second dominant wavelength that is different than the first dominant wavelength. In some aspects, the lens can be asymmetric. In some aspects, a collective center of the chips, or a center of an array of chips can be offset from a center of the asymmetric lens.

公开(公告)号：US20150325759A1

公开(公告)日：2015-11-12

申请号：US14271116

申请日：2014-05-06

Applicant: CREE, INC.

Inventor： Kurt Wilcox ,  Theodore Lowes ,  Corey Goldstein ,  Jason Taylor ,  Chandan Bhat

IPC: H01L33/58 ,  F21V5/04 ,  H01L33/62 ,  H01L23/544 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L23/544 ,  F21V5/04 ,  G02B19/0009 ,  G02B19/0061 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Solid state fixtures and packages are disclosed that include an optical element, such as an encapsulant, having an integrated indicator which indicates one or more characteristics of the package to a user, such as package orientation, polarity, chip-type, etc. The host optical element can be substantially symmetrical but for the indicator. Indicators can be additive, such as a bump, or subtractive, such as a hole. The indicator can be visible to the human eye, and/or can be machine detectable, such as by pick-and-place technology. Indicators can be formed by many processes including molding and laser ablation/imprinting, which is particularly suited for use with a hard host material.

Abstract translation: 公开了固态固定装置和封装件，其包括诸如密封剂的光学元件，其具有集成的指示器，其指示封装朝向用户的一个或多个特性，例如封装方向，极性，芯片型等。主机 光学元件可以是基本上对称的，但是用于指示器。 指示器可以是添加剂，例如凹凸，或减色，例如孔。 指示器可以对人眼可见，和/或可以是机器可检测的，例如通过拾取和放置技术。 指示器可以通过许多工艺形成，包括成型和激光烧蚀/压印，其特别适用于硬质主体材料。

公开(公告)号：US09048396B2

公开(公告)日：2015-06-02

申请号：US13649052

申请日：2012-10-10

Applicant: CREE, INC.

Inventor： Theodore Lowes ,  Eric J. Tarsa ,  Sten Heikman ,  Bernd Keller ,  Jesse Reiherzer ,  Hormoz Benjamin

IPC: F21V9/16 ,  H01L33/50 ,  H01L33/54 ,  F21V9/00

CPC classification number: H01L33/54 ,  F21V9/00 ,  H01L33/502 ,  H01L33/504 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light within the package encapsulant. The packages can comprise a submount with one or more LEDs, and a blanket conversion material layer on the LEDs and the submount. The encapsulant can be on the submount, over the LEDs, and light reflected within the encapsulant will reach the conversion material, where it is absorbed and emitted omnidirectionally. Reflected light can now escape the encapsulant, allowing for efficient emission and a broader emission profile, when compared to conventional packages with hemispheric encapsulants or lenses. In certain embodiments, the LED package provides a higher chip area to LED package area ratio. By using an encapsulant with planar surfaces, the LED package can provide unique dimensional relationships between the various features and the LED package ratios, enabling more flexibility with different applications.

Abstract translation: 公开了紧凑且有效地发光的LED封装，并且可以包括具有折射和/或反射封装密封剂内的光的平坦表面的密封剂。 包装可以包括具有一个或多个LED的底座，以及LED和底座上的毯子转换材料层。 密封剂可以位于底座上，在LED上，并且在密封剂内反射的光将到达转化材料，其中它被全向吸收和发射。 当与具有半球密封剂或透镜的传统包装相比时，反射光现在可以逃避密封剂，从而有效地发射和更宽的发射特征。 在某些实施例中，LED封装为LED封装面积比提供更高的芯片面积。 通过使用具有平面表面的密封剂，LED封装可以在各种特征和LED封装比之间提供独特的尺寸关系，从而在不同应用中实现更大的灵活性。

公开(公告)号：US20130270581A1

公开(公告)日：2013-10-17

申请号：US13796954

申请日：2013-03-12

Applicant: CREE, Inc.

Inventor： Theodore Lowes ,  Bernd P. Keller

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/44 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Light emitter packages having multiple light emitter chips, such as light emitting diode (LED) chips, and related methods are provided. In one aspect, a light emitter package can include a submount, an array of light emitter chips disposed on a portion of the submount, and a lens provided over the submount and covering at least portions of the array. In some aspects, at least some of the light emitter chips can be adapted to emit light of a first dominant wavelength. In further aspects, at least some other light emitter chips are adapted to emit light of a second dominant wavelength that is different than the first dominant wavelength. In some aspects, the lens can be asymmetric. In some aspects, a collective center of the chips, or a center of an array of chips can be offset from a center of the asymmetric lens.

Abstract translation: 提供了具有多个发光二极管（LED）芯片等发光二极管的发光二极管封装及相关方法。 在一个方面，光发射器封装可以包括底座，设置在底座的一部分上的发光芯片的阵列，以及设置在所述基座上并且覆盖阵列的至少一部分的透镜。 在一些方面，光发射器芯片中的至少一些可适于发射第一主波长的光。 在另外的方面中，至少一些其它光发射器芯片适于发射不同于第一主波长的第二主波长的光。 在某些方面，透镜可以是不对称的。 在一些方面，芯片的集体中心或芯片阵列的中心可偏离非对称透镜的中心。