公开(公告)号：US07829986B2

公开(公告)日：2010-11-09

申请号：US11278411

申请日：2006-04-01

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/495

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing an integrated circuit package system is provided including: forming a strip level net spacer including support bars, tie bars and paddles; configuring the support bars, the tie bars and the paddles to form four or more open regions around each of the paddles; and interconnecting the support bars, the tie bars and the paddles to provide structural support to vertically stacked semiconductor devices formed above first semiconductor devices and directly attached to the paddles.

摘要翻译： 提供了一种用于制造集成电路封装系统的方法，包括：形成包括支撑杆，连接杆和桨叶的带状水平网间隔件; 配置支撑杆，连接杆和桨叶以在每个叶片周围形成四个或更多个开放区域; 并且连接支撑杆，连接杆和桨叶，以向在第一半导体器件上方形成并直接连接到桨叶上的垂直堆叠的半导体器件提供结构支撑。

公开(公告)号：US20070215672A1

公开(公告)日：2007-09-20

申请号：US11276945

申请日：2006-03-17

申请人： Soo-San Park

发明人： Soo-San Park

IPC分类号： A47J36/02

CPC分类号： H01L21/67092 ,  H05K13/0417 ,  Y10S438/976 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

摘要： A system for removal of an integrated circuit from a mount material including holding and stretching the mount material using linear and rotary motion, and removing the integrated circuit from the mount material when the mount material is stretched by linear and rotary motion.

摘要翻译： 一种用于从安装材料移除集成电路的系统，包括使用线性和旋转运动来保持和拉伸安装材料，以及当安装材料通过线性和旋转运动拉伸时，从安装材料中去除集成电路。

公开(公告)号：US20120319266A1

公开(公告)日：2012-12-20

申请号：US13597086

申请日：2012-08-28

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L23/36 ,  H01L21/60 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US08102666B2

公开(公告)日：2012-01-24

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US08093727B2

公开(公告)日：2012-01-10

申请号：US12871031

申请日：2010-08-30

申请人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L23/538

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with a first offset; mounting a second integrated circuit device over the first integrated circuit device and adjacent to the integrated circuit package system; connecting the integrated circuit package system and the substrate; and forming a package encapsulation as a cover for the first integrated circuit device, the integrated circuit package system, and the second integrated circuit device.

摘要翻译： 一种用于制造集成电路封装包装系统的方法，包括：将第一集成电路器件安装在衬底上; 在第一集成电路装置上安装具有第一偏移的内封装的集成电路封装系统; 将第二集成电路装置安装在所述第一集成电路装置上并与所述集成电路封装系统相邻; 连接集成电路封装系统和基板; 以及形成作为第一集成电路器件，集成电路封装系统和第二集成电路器件的封装的封装封装。

公开(公告)号：US08067828B2

公开(公告)日：2011-11-29

申请号：US12046369

申请日：2008-03-11

申请人： Chan Hoon Ko ,  Soo-San Park

发明人： Chan Hoon Ko ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L23/02

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247

摘要： An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module cantilevered over the substrate by an electrical interconnect connected to the substrate, the electrical interconnect forming a gap between the inner stacking module and the structure controlled by the size of the electrical interconnect; and encapsulating the structure and inner stacking module with an encapsulation.

摘要翻译： 一种集成电路封装包装系统，包括：提供基板; 将结构安装在基板上; 通过连接到基板的电互连，支撑在基板上悬臂的内部叠层模块，电互连在内部堆叠模块和由电互连的尺寸控制的结构之间形成间隙; 并用封装封装结构和内部堆叠模块。

公开(公告)号：US20110089554A1

公开(公告)日：2011-04-21

申请号：US12582582

申请日：2009-10-20

申请人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

发明人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上安装具有金属间化合物特性的端子的无基板集成电路封装; 连接基板和无基板集成电路封装; 以及在所述无衬底的集成电路封装上形成基底封装，所述端子暴露。

公开(公告)号：US07659609B2

公开(公告)日：2010-02-09

申请号：US11849127

申请日：2007-08-31

申请人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

发明人： Jong-Woo Ha ,  BumJoon Hong ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L21/56

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package-in-package system includes: mounting an integrated circuit device over a package carrier; forming a subassembly including: providing an integrated circuit package system having a carrier interposer with an integrated circuit die thereover, and mounting a device under the carrier interposer; mounting the subassembly over the integrated circuit device; and encapsulating the subassembly and the integrated circuit device over the package carrier.

摘要翻译： 集成电路封装包装系统包括：将集成电路装置安装在封装载体上; 形成子组件，其包括：提供集成电路封装系统，其具有其上具有集成电路管芯的载体插入器，以及将器件安装在所述载体插入器下; 将组件安装在集成电路装置上; 并将该组件和该集成电路器件封装在该封装载体上。

公开(公告)号：US07652376B2

公开(公告)日：2010-01-26

申请号：US12235521

申请日：2008-09-22

申请人： Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

发明人： Soo-San Park ,  Hyeog Chan Kwon ,  Sang-Ho Lee ,  Jong-Woo Ha

IPC分类号： H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L23/3128 ,  H01L25/03 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

摘要翻译： 提供了一种集成电路封装系统，其包括在晶片上提供形成有接合焊盘的晶片。 焊料凸块沉积在一个或多个焊盘上。 接合焊盘和焊料凸块嵌入在晶片上形成的模具化合物中。 在模具化合物中形成凹槽以暴露焊料凸块的一部分。 将晶片在凹槽处分成单独的模具结构。

公开(公告)号：US20090230532A1

公开(公告)日：2009-09-17

申请号：US12046369

申请日：2008-03-11

申请人： Chan Hoon Ko ,  Soo-San Park

发明人： Chan Hoon Ko ,  Soo-San Park

IPC分类号： H01L23/49 ,  H01L21/56

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247

摘要： An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module cantilevered over the substrate by an electrical interconnect connected to the substrate, the electrical interconnect forming a gap between the inner stacking module and the structure controlled by the size of the electrical interconnect; and encapsulating the structure and inner stacking module with an encapsulation.

摘要翻译： 一种集成电路封装包装系统，包括：提供基板; 将结构安装在基板上; 通过连接到基板的电互连，支撑在基板上悬臂的内部叠层模块，电互连在内部堆叠模块和由电互连的尺寸控制的结构之间形成间隙; 并用封装封装结构和内部堆叠模块。