公开(公告)号：US06808798B2

公开(公告)日：2004-10-26

申请号：US10125734

申请日：2002-04-18

申请人： Masayuki Tobita

发明人： Masayuki Tobita

IPC分类号： B32B2712

CPC分类号： C08J5/046 ,  H01L23/3733 ,  H01L23/3737 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K3/305 ,  H05K2201/0278 ,  H05K2201/0329 ,  H05K2201/10734 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/2904 ,  Y10T428/2913 ,  Y10T428/2931 ,  Y10T428/31623 ,  H01L2924/00012 ,  H01L2224/0401

摘要： This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excellent in heat radiation ability which the semiconductor chips are mounted on the heat conductive resin substrate which the polybenzasol fibers are oriented in the thick direction (the Z direction) and/or the direction of the surface of the resin substrate, the heat conductive resin substance and the semiconductor package being provided with electrical insulation and high thermal conductivity, and being capable of controlling the thermal expansion coefficient.

公开(公告)号：US07264869B2

公开(公告)日：2007-09-04

申请号：US10162520

申请日：2002-06-04

申请人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

发明人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

IPC分类号： B32B27/04 ,  C01B31/00

CPC分类号： C09K5/14 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2123

摘要： A thermally conductive molded article is produced by molding a conductive composition into a predetermined shape. The composition includes a polymer matrix and carbon powders. The carbon powders are obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating. The carbon powders are aligned in a certain direction in the polymer matrix. Thus, the molded article can be produced easily and effectively that has excellent thermal conductivity in a given direction and that is suitable for use as a heat radiator, heat transfer member, or a component thereof in electronic hardware.

摘要翻译： 通过将导电性组合物成型为规定形状来制造导热性成形品。 该组合物包括聚合物基质和碳粉末。 碳粉是通过加热在其主链上具有芳香环的聚合物材料进行石墨化而获得的。 碳粉在聚合物基体中沿某一方向排列。 因此，可以容易且有效地制造模制品，其在给定方向上具有优异的导热性，并且适合用作电子硬件中的散热器，传热构件或其部件。

公开(公告)号：US06918983B2

公开(公告)日：2005-07-19

申请号：US10655239

申请日：2003-09-04

申请人： Masayuki Tobita ,  Shinya Tateda ,  Tsunehisa Kimura ,  Masahumi Yamato

发明人： Masayuki Tobita ,  Shinya Tateda ,  Tsunehisa Kimura ,  Masahumi Yamato

IPC分类号： H01L23/40 ,  C01B21/064 ,  C09J5/00 ,  C09J9/00 ,  C09J11/04 ,  C09J201/00 ,  H01L21/58 ,  B32B31/00

CPC分类号： H01L24/29 ,  C09J5/00 ,  C09J9/00 ,  C09J11/04 ,  H01L24/73 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/25 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0503 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.

摘要翻译： 本发明提供一种通过使用通过混合氮化硼粉末和粘合剂聚合物制成的导热粘合剂来改善固定方向的热传导的粘合方法，并且通过将导热粘合剂中的氮化硼粉末定向到磁性固定方向 气氛和电子部件，用于有效地散发由半导体器件2，电源4，光源或用于电气产品的其他部件产生的热量，以及辐射优异的电子部件。

公开(公告)号：US06451418B1

公开(公告)日：2002-09-17

申请号：US09532974

申请日：2000-03-22

申请人： Masayuki Tobita

发明人： Masayuki Tobita

IPC分类号： B32B2704

CPC分类号： C08J5/046 ,  H01L23/3733 ,  H01L23/3737 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K3/305 ,  H05K2201/0278 ,  H05K2201/0329 ,  H05K2201/10734 ,  H05K2203/124 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/249942 ,  Y10T428/2904 ,  Y10T428/2913 ,  Y10T428/2931 ,  Y10T428/31623 ,  H01L2924/00012 ,  H01L2224/0401

摘要： This invention relates to a heat conductive resin substrate which polybenzasol fibers are oriented in a thick direction and/or a direction of a surface of a resin substrate, further to the heat conductive resin substrate and a semiconductor package excellent in heat radiation ability which the semiconductor chips are mounted on the heat conductive resin substrate which the polybenzasol fibers are oriented in the thick direction (the Z direction) and/or the direction of the surface of the resin substrate, the heat conductive resin substance and the semiconductor package being provided with electrical insulation and high thermal conductivity, and being capable of controlling the thermal expansion coefficient.

摘要翻译： 本发明涉及一种导热树脂基板，其中聚苯并
苯酚纤维在树脂基板的厚度方向和/或表面方向上进一步定向到导热树脂基板和散热能力优异的半导体封装，半导体 芯片安装在导热树脂基板上，聚苯并苯酚纤维在厚度方向（Z方向）和/或树脂基板的表面方向上取向，导热树脂物质和半导体封装设置有电 绝缘性和高导热性，并且能够控制热膨胀系数。

公开(公告)号：US20070001292A1

公开(公告)日：2007-01-04

申请号：US11474235

申请日：2006-06-23

申请人： Mitsuru Ohta ,  Jun Yamazaki ,  Masayuki Tobita

发明人： Mitsuru Ohta ,  Jun Yamazaki ,  Masayuki Tobita

IPC分类号： H01L23/34

CPC分类号： H01L23/3733 ,  H01L23/3735 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A heat radiation member including a thermal diffusion sheet; and a thermally conductive polymer layer provided on at least a part of the thermal diffusion sheet. Thermal conductivity of the thermally conductive polymer layer in a thickness direction of the layer is higher than thermal conductivity of the thermally conductive polymer layer in a direction parallel to the surface of the layer. The heat radiation member is formed by joining an independently formed thermally conductive layer including a thermally conductive filler onto the thermal diffusion sheet. The thermally conductive filler are oriented in a specific direction. Alternatively, the heat radiation member is formed by placing a thermally conductive polymer composition containing a thermal conductive filler containing a thermally conductive filler onto the thermal diffusion sheet, orienting the thermally conductive filler in a specific direction, and curing the thermally conductive polymer composition while the orientation is maintained.

摘要翻译： 一种散热构件，包括热扩散片; 以及设置在所述热扩散片的至少一部分上的导热聚合物层。 导热聚合物层在该层的厚度方向上的导热率高于导热聚合物层在平行于该层表面的方向上的导热率。 通过将包含导热性填料的独立形成的导热层与热扩散片接合而形成散热构件。 导热填料沿特定方向取向。 或者，通过将含有导热性填料的导热性填料的导热性聚合物组合物放置在热扩散片上，使导热性填料向特定方向取向，使导热性高分子组合物固化，同时 维持方向。

公开(公告)号：US06761842B2

公开(公告)日：2004-07-13

申请号：US10370301

申请日：2003-02-18

申请人： Masayuki Tobita ,  Shinya Tateda ,  Tsunehisa Kimura ,  Masahumi Yamato

发明人： Masayuki Tobita ,  Shinya Tateda ,  Tsunehisa Kimura ,  Masahumi Yamato

IPC分类号： B29C3508

CPC分类号： H01L21/4871 ,  H01L23/3737 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/16195 ,  H01L2924/0665

摘要： A method of manufacturing a heat conductive molded part having determined heat conductivity properties is provided. The method includes providing a polymer composition containing boron nitride powder. A magnetic field is impressed to the polymer composition containing boron nitride powder, field orienting the boron nitride powder in the polymer composition to a fixed direction. The polymer composition is set containing boron nitride powder with the boron nitride powder oriented in the polymer composition to the fixed direction. The polymer composition may also be provided containing a solvent. The solvent is removed after field orienting the boron nitride powder in the polymer composition to the fixed direction The composition is then set with the field oriented boron nitride powder after having removed the solvent.

摘要翻译： 提供了具有确定的导热性能的导热模制部件的制造方法。 该方法包括提供含有氮化硼粉末的聚合物组合物。 向包含氮化硼粉末的聚合物组合物施加磁场，将聚合物组合物中的氮化硼粉末定向到固定方向。 将聚合物组合物设定为含有氮化硼粉末，其中氮化硼粉末在聚合物组合物中取向至固定方向。 还可以提供含有溶剂的聚合物组合物。 在将聚合物组合物中的氮化硼粉末定向到固定方向之后，去除溶剂。然后在去除溶剂之后，用场取向的氮化硼粉末设定组合物。

公开(公告)号：US6166402A

公开(公告)日：2000-12-26

申请号：US335702

申请日：1999-06-18

申请人： Kazuya Kodani ,  Toshiaki Matsumoto ,  Masayuki Tobita

发明人： Kazuya Kodani ,  Toshiaki Matsumoto ,  Masayuki Tobita

IPC分类号： H01L29/744 ,  H01L21/52 ,  H01L23/48 ,  H01L29/74 ,  H01L31/111

CPC分类号： H01L24/72 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/30107 ,  H01L2924/00

摘要： A double circular gate conductor 9 comprises a first circular gate conductor 7 connected to a gate electrode 2a, a second circular gate conductor 8, and a connecting conductor which connects the first circular gate conductor 7 and the second circular gate conductor 8, and is configured so as to equalize the voltage drop due to self-inductance or mutual inductance between the first circular gate conductor 7, second circular gate conductor 8 and cathode post electrode 4. In this manner it is possible to guarantee more or less uniform parallel inductance over the surface of the element.

摘要翻译： 双圆形栅极导体9包括连接到栅电极2a，第二圆形栅极导体8和连接第一圆形栅极导体7和第二圆形栅极导体8的连接导体的第一圆形栅极导体7，并被配置 以便均衡由于第一圆形栅极导体7，第二圆形栅极导体8和阴极柱状电极4之间的自感或互感引起的电压降。以这种方式，可以保证或多或少均匀的并联电感 表面的元素。

公开(公告)号：US06794035B2

公开(公告)日：2004-09-21

申请号：US10255275

申请日：2002-09-26

申请人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

发明人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

IPC分类号： B32B516

CPC分类号： C08K3/04 ,  C01B32/00 ,  C01B32/20 ,  C01P2002/72 ,  C01P2004/61 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  C08L21/00

摘要： Graphitized carbon powder are produced by carbonizing and expanding a pitch by heating to form carbonaceous foam and by graphitizing before pulverizing or graphitizing after pulverizing the carbonaceous foam. The resultant graphitized carbon powders have an interplanar spacing (d002) of graphite planes of less than 0.3370 nm. The powders preferably have an average particle size of from 2 to 200 &mgr;m. A thermally conductive composition includes the graphitized carbon powders in a matrix. The content of the powders is preferably 1 to 800 parts by weight relative to 100 parts by weight of the matrix. Thus, the graphitized carbon powders that have excellent thermal conductivity and a thermally conductive composition including such powders are provided.

摘要翻译： 通过加热碳化和膨胀沥青以形成碳质泡沫并通过石墨化之后，在粉碎碳质泡沫之前进行粉碎或石墨化之前生产石墨化碳粉末。 所得的石墨化碳粉末具有小于0.3370nm的石墨平面的晶面间距（d002）。 粉末的平均粒径优选为2〜200μm。 导热组合物包括基质中的石墨化碳粉。 相对于100重量份的基质，粉末的含量优选为1〜800重量份。 因此，提供具有优异导热性的石墨化碳粉末和包含这种粉末的导热组合物。

公开(公告)号：US06730731B2

公开(公告)日：2004-05-04

申请号：US09943006

申请日：2001-08-31

申请人： Masayuki Tobita ,  Natsuko Ishihara ,  Naoyuki Shimoyama ,  Shinya Tateda

发明人： Masayuki Tobita ,  Natsuko Ishihara ,  Naoyuki Shimoyama ,  Shinya Tateda

IPC分类号： C08J300

CPC分类号： D01F9/145 ,  C08K7/06 ,  C08K9/02 ,  D01F9/15 ,  D01F9/155 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A thermally conductive polymer composition includes polymer matrix such as thermoplastic resin or thermoplastic elastomer and a graphitized carbon fiber which serves as a thermally conductive filler. The graphitized carbon fiber is made from a mesophase pitch. The mesophase pitch is spun, infusibilized, carbonized, pulverized, and graphitized to form powdery graphitized carbon fibers. Preferably, the graphitized carbon fibers have a diameter of 5-20 &mgr;m, an average particle size of 10-500 &mgr;m, and a density of 2.20-2.26 g/cm3. The composition may be molded to form a thermally conductive molded article such as a thermally conductive sheet. The thermally conductive polymer composition and thermally conductive molded article have high thermal conductivity and transfer large amounts of heat from electric or electronic parts.

摘要翻译： 导热聚合物组合物包括聚合物基质，例如热塑性树脂或热塑性弹性体，以及用作导热填料的石墨化碳纤维。 石墨化碳纤维由中间相沥青制成。 将中间相沥青纺丝，不熔化，碳化，粉碎和石墨化，形成粉状石墨化碳纤维。 优选石墨化碳纤维的直径为5-20μm，平均粒径为10-500μm，密度为2.20-2.26g / cm 3。 组合物可以被模制以形成导热模制品，例如导热片。 导热聚合物组合物和热导成型制品具有高导热性并且从电子或电子部件传递大量的热量。

公开(公告)号：US06723425B2

公开(公告)日：2004-04-20

申请号：US10162520

申请日：2002-06-04

申请人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

发明人： Masayuki Tobita ,  Naoyuki Shimoyama ,  Shinya Tateda

IPC分类号： B32B516

摘要： A thermally conductive molded article is produced by molding a conductive composition into a predetermined shape. The composition includes a polymer matrix and carbon powders. The carbon powders are obtained by graphitizing a polymeric material that has an aromatic ring on its main chain by heating. The carbon powders are aligned in a certain direction in the polymer matrix. Thus, the molded article can be produced easily and effectively that has excellent thermal conductivity in a given direction and that is suitable for use as a heat radiator, heat transfer member, or a component thereof in electronic hardware.