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11.发明授权Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types 有权混合电和光LGA插入器，用于通过双信号类型促进芯片到板通信公开(公告)号：US07613368B2
公开(公告)日：2009-11-03
申请号：US10988220
申请日：2004-11-12
申请人： Gareth G. Hougham , Russell A. Budd , Punit P. Chiniwalla , Paul W. Coteus , Alphonso P. Lanzetta , Frank R. Libsch
发明人： Gareth G. Hougham , Russell A. Budd , Punit P. Chiniwalla , Paul W. Coteus , Alphonso P. Lanzetta , Frank R. Libsch
IPC分类号： G02B6/12
CPC分类号： G02B6/43
摘要： Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
摘要翻译： 集成的光电芯片或芯片集合在具有电和光互连的模块上，在速度，功耗和发热方面提供许多优点。 然而，混合信号类型构成重大的封装挑战。 本发明描述了一种能够将来自模块的电和光信号同时连接到印刷电路板的平面栅格阵列（LGA）插入器。
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公开(公告)号：US07456046B2
公开(公告)日：2008-11-25
申请号：US11063449
申请日：2005-02-23
IPC分类号： H01L21/44
CPC分类号： H01L21/4853 , G01R1/0408 , G01R1/06716 , G01R1/07307 , H01L23/49811 , H01L23/562 , H01L24/81 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/351 , H01L2924/00
摘要： A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.
摘要翻译： 一种制造用于集成电路的柔性互连的方法，特别地，优选地通过半导体或基于玻璃衬底的载体中的激光辅助化学气相沉积工艺形成柔性或柔性互连件，所述方法用于安装和封装多个集成电路 芯片和选择性，其他设备的技术。
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公开(公告)号：US20080285920A1
公开(公告)日：2008-11-20
申请号：US12141556
申请日：2008-06-18
IPC分类号： G02B6/26
CPC分类号： G02B6/42 , G02B6/30 , G02B6/3885 , G02B6/4214 , G02B6/423 , G02B6/4292
摘要： An optical assembly includes a waveguide assembly and an optical coupling element. The waveguide assembly includes a core, a cladding portion, and, preferably, at least two waveguide core fiducials, the at least two waveguide core fiducials and the core being lithographically formed substantially simultaneously in a substantially coplanar layer The core and the at least two waveguide core fiducials are formed in a predetermined relationship with the cladding portion. The optical coupling element (for example, a lens array or mechanical transfer (MT) ferrule), includes an optical element and, preferably, at least two alignment features associated with the optical element, the at least two alignment features being mated with the at least two waveguide cote fiducials to accurately position the optical element with respect to the core in an X-Y plane A method of alignment is also provided
摘要翻译： 光学组件包括波导组件和光耦合元件。 波导组件包括芯，包层部分，并且优选地至少两个波导芯基准，所述至少两个波导芯基准和芯基本上在基本上共面的层中基本同时形成。芯和至少两个波导 与包层部分形成预定关系的芯基准。 光学耦合元件（例如，透镜阵列或机械转移（MT）套圈）包括光学元件，并且优选地包括与光学元件相关联的至少两个对准特征，所述至少两个对准特征与所述光学元件配合 至少两个波导基准基准以在XY平面中相对于芯精确地定位光学元件还提供了对准方法
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公开(公告)号：US20080277154A1
公开(公告)日：2008-11-13
申请号：US12176615
申请日：2008-07-21
CPC分类号： H05K1/0298 , H05K1/0237 , H05K1/181 , H05K3/027 , H05K3/32 , H05K3/429 , H05K2201/09845 , H05K2203/0242 , H05K2203/175 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167
摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.
摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。
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公开(公告)号：US4963900A
公开(公告)日：1990-10-16
申请号：US445085
申请日：1989-12-01
CPC分类号： H04N1/1911 , H04N1/1135
摘要： A multiple laser beam scanning optical system for correcting monochromatic and polychromatic aberrations comprising a doublet cylindrical lens for receiving the multiple beams and directing them to a rotating polygonal mirror. Scanning lens means are located to receive the beams from the mirror and direct them to the image plane. The scanning lens is comprised of at least one doublet wherein both elements have approximately the same index of refraction but different dispersion factors at a nominal wavelength
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16.发明授权Chromatic and misalignment compensation in a multiple beam laser scanning system 失效多光束激光扫描系统中的色差和不对准补偿
公开(公告)号：US4950889A
公开(公告)日：1990-08-21
申请号：US388537
申请日：1989-08-01
IPC分类号： G02B26/10 , B41J2/44 , G02B27/00 , G03G15/04 , G06K15/12 , H04N1/053 , H04N1/113 , H04N1/12 , H04N1/19 , H04N1/191
CPC分类号： H04N1/1916 , G02B27/0031 , G06K15/1219 , G06K15/1261 , H04N1/053 , H04N1/19 , H04N1/1911 , G06K2215/111 , H04N1/1135 , H04N1/12 , H04N2201/0471 , H04N2201/04786
摘要： This is an electronic scheme for correcting for mechanical misalignment and chromatic aberrations from laser beam to laser beam in the scan direction of a multiple beam laser scanning system for use in an electrophotographic machine. Each beam is first corrected for mechanical misalignment and thereafter for chromatic aberrations. A reference laser beam produces two pulses near the start of scan (SOS) and two pulses near the end of scan (EOS). A non-reference laser beam then produces SOS and EOS pulses from which the mechanical misalignment is calculated. A gated clock is energized by the reference pulse and a tapped delay line is used for nanosecond resolution. After accomplishing correction for mechanical misalignment, chromatic aberrations are corrected by measuring the amount of total pel displacement of the non-reference scan line relative to the reference scan line and inserting appropriate delays at selected intervals throughout the non-reference scan in order to maintain pel placement accuracy to a desired tolerance.
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公开(公告)号：US4899327A
公开(公告)日：1990-02-06
申请号：US52115
申请日：1987-05-04
CPC分类号： G11B7/125 , G11B7/094 , G11B7/0945 , G11B7/0909
摘要： Error correction in a feedback servo system. The feedback servo loop in, for example, a head positioning circuit in an optical disk data recording and retrieval system is provided with means for forcing the feedback signal to zero when the head is positioned at best focus as determined by a peak in the laser monitoring diode. The head in such a system must be dynamically maintained at a best focus position but, through use and transporting, the alignment of the head position error detecting system can be disturbed. In some cases, the loop circuit parameters may drift from their original values. To correct for errors introduced from such causes, the head is positioned at best focus and the focus error (head position error) signal is sensed. A correction system forces the sensed value to zero, e.g, by adjusting the gain of amplifiers used in the feedback loop.
摘要翻译： 反馈伺服系统中的误差校正。 例如，在光盘数据记录和检索系统中的例如头部定位电路中的反馈伺服环路设置有当头部位于最佳焦点时强制反馈信号为零的装置，由激光监测中的峰值确定 二极管。 这种系统中的头部必须被动态地保持在最佳对焦位置，但是通过使用和传送，头部位置误差检测系统的对准可能受到干扰。 在某些情况下，环路电路参数可能偏离其原始值。 为了纠正从这些原因引起的错误，头部被定位在最佳焦点处，并且感测到聚焦误差（头位置误差）信号。 校正系统将感测值强制为零，例如通过调整在反馈回路中使用的放大器的增益。
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公开(公告)号：US08755644B2
公开(公告)日：2014-06-17
申请号：US12080266
申请日：2008-04-01
CPC分类号： G02B6/4206 , G02B6/4214 , H01L33/58 , H01S5/005 , H01S5/02248 , H01S5/02288 , H01S5/183
摘要： Method of fabricating a semiconductor die with a microlens associated therewith. More particularly, a method for fabricating a vertical channel guide optical via through a silicon substrate wherein the optical via can contain lens elements, a discrete index gradient guiding pillar and other embodiments. Also disclosed are means for transferring, coupling and or focusing light from an electronic-optical device on the top of a semiconductor substrate through the substrate to a waveguiding medium below the substrate. The high alignment accuracies afforded by standard semiconductor fabrication processes are exploited so as to obviate the need for active alignment of the optical coupling or light guiding elements.
摘要翻译： 制造具有与之相关联的微透镜的半导体管芯的方法。 更具体地，涉及一种通过硅衬底制造垂直沟道引导光通孔的方法，其中光通孔可以包含透镜元件，离散折射率梯度引导柱和其它实施例。 还公开了用于将来自半导体衬底顶部的电子光学器件的光通过衬底转移，耦合和聚焦到衬底下面的波导介质的装置。 利用由标准半导体制造工艺提供的高对准精度，以便消除对光学耦合或导光元件的主动对准的需要。
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公开(公告)号：US08703274B2
公开(公告)日：2014-04-22
申请号：US12244067
申请日：2008-10-02
申请人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
发明人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
IPC分类号： B32B3/00
CPC分类号： B23K1/0016 , B23K1/20 , B23K26/364 , B23K2101/40 , H05K1/111 , H05K3/3457 , H05K2201/09381 , H05K2201/0969 , H05K2201/09745 , H05K2203/043 , Y02P70/611 , Y10T428/24479
摘要： A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
摘要翻译： 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。
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20.发明授权Compliant mold fill head with integrated cavity venting and solder cooling 有权具有集成腔体排气和焊锡冷却的合适的模具填充头公开(公告)号：US08011563B2
公开(公告)日：2011-09-06
申请号：US11696753
申请日：2007-04-05
CPC分类号： B23K3/0607 , B23K2101/40
摘要： A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.
摘要翻译： 模具填充头包括焊料输送头和具有固定到焊料输送头的顺应部分和与柔顺部分相关联的分配区域的界面部分。 分配区域形成有至少一个孔，其被配置为与模板中的空腔相接触，所述至少一个孔与焊料输送头流体连通。 顺应部分的构造和尺寸被设计成当从其延伸预定距离时将分配区域推靠在模板上，并且基本上容许模板的平坦度变化，预定距离的变化和/或角度取向的变化 界面部分和模板。
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