公开(公告)号：US08409687B2

公开(公告)日：2013-04-02

申请号：US13394277

申请日：2010-10-12

申请人： Hirokazu Saito ,  Takeshi Isonaka ,  Hideya Suzuki ,  Youzou Yamashina ,  Shin Sasamoto ,  Jun Noguchi

发明人： Hirokazu Saito ,  Takeshi Isonaka ,  Hideya Suzuki ,  Youzou Yamashina ,  Shin Sasamoto ,  Jun Noguchi

IPC分类号： B32B3/02 ,  G11B7/24

CPC分类号： C08G18/8116 ,  C08F290/06 ,  C08G18/5015 ,  C08G18/672 ,  C08G65/007 ,  C08G2650/48 ,  C09D175/16 ,  G11B7/24 ,  G11B7/2542 ,  Y10T428/3154 ,  Y10T428/31935 ,  C08G18/48

摘要： A UV-curable composition for optical discs contains a fluorine-containing UV-curable resin having a poly(perfluoroalkylene ether) chain and a UV-curable group. The fluorine-containing UV-curable resin exhibits good compatibility with the composition and satisfactorily localizes in and near a surface of a coating film. Thus, the composition can be used to form an outermost layer of an optical disc such that the droplet size of grease such as that constituting fingerprints adhering to the outermost layer is reduced and scattering of light having a short oscillation wavelength passing through the outermost layer is suppressed. Accordingly, an optical disc on and from which signals can be satisfactorily recorded and read is formed.

摘要翻译： 用于光盘的UV可固化组合物含有具有聚（全氟亚烷基醚）链和UV可固化基团的含氟UV固化树脂。 含氟紫外线固化性树脂与组合物具有良好的相容性，令人满意地定位在涂膜表面及其附近。 因此，组合物可以用于形成光盘的最外层，使得诸如构成指纹粘附到最外层的那些润滑脂的液滴尺寸减小，并且具有穿过最外层的具有短的振荡波长的光的散射是 被压制 因此，形成可以令人满意地记录和读取信号的光盘。

公开(公告)号：US20100055376A1

公开(公告)日：2010-03-04

申请号：US12546429

申请日：2009-08-24

申请人： Hirokazu Saito ,  Koichi Fujii

发明人： Hirokazu Saito ,  Koichi Fujii

IPC分类号： B32B3/02 ,  C08K5/3492

CPC分类号： G11B7/2542 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/285 ,  B32B27/308 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/40 ,  B32B2307/414 ,  B32B2307/416 ,  B32B2307/51 ,  B32B2307/714 ,  B32B2429/00 ,  C08K5/34924 ,  G11B7/24038 ,  C08L33/06

摘要： The present invention provides an ultraviolet-curable composition that inhibits deterioration of a reflective layer during environmental changes in humidity and temperature even when using silicon or a silicon compound for the light reflecting layer, and an optical disc enabling preferable reading and writing of recording signals even during environmental changes in humidity and temperature.In particular, occurrence of deterioration at the interface between a cured coating film of an ultraviolet-curable composition and a silicon reflective layer can be decreased and the formation of minute white'spots, for which there is the risk of impairing reading and writing of signals, can be effectively inhibited even in a high-temperature and high-humidity environment by using an ultraviolet-curable composition comprising a (meth)acrylate oligomer, a (meth)acrylate monomer and an antioxidant, wherein the antioxidant is an antioxidant having an isocyanuric acid backbone, and the chlorine content in the composition is less than 120 ppm.

摘要翻译： 本发明提供了即使在使用硅或硅化合物作为光反射层的情况下也能够在湿度和温度的环境变化中抑制反射层的劣化的紫外线固化性组合物，以及甚至能够使记录信号的读取和写入更好的光盘 在湿度和温度的环境变化期间。 特别地，可以减少紫外线固化性组合物的固化涂膜与硅反射层之间的界面处的劣化，形成微小的白点，存在损害信号读写的风险 通过使用包含（甲基）丙烯酸酯低聚物，（甲基）丙烯酸酯单体和抗氧化剂的紫外线固化性组合物，即使在高温高湿环境下也可以有效地抑制其中抗氧化剂是具有异氰脲酸酯的抗氧化剂 酸骨架，组合物中的氯含量小于120ppm。

公开(公告)号：US20090305922A1

公开(公告)日：2009-12-10

申请号：US12272934

申请日：2008-11-18

申请人： Sang Yeob Cha ,  Skip Watts ,  Hirokazu Saito

发明人： Sang Yeob Cha ,  Skip Watts ,  Hirokazu Saito

IPC分类号： C10M139/00 ,  C10M141/10 ,  C10M133/46 ,  C10M133/44

CPC分类号： C10M169/04 ,  C10M2207/10 ,  C10M2215/064 ,  C10M2215/08 ,  C10M2215/28 ,  C10M2219/06 ,  C10M2223/043 ,  C10N2230/02 ,  C10N2230/06 ,  C10N2230/10 ,  C10N2230/76 ,  C10N2240/042

摘要： The present invention relates to an automatic transmission lubricating oil composition, and particularly to an automatic transmission lubricating oil composition comprising an oil of lubricating viscosity, an ashless dispersant, an anti-oxidant, a phosphorus-based anti-wear agent and a friction-modifier, wherein more than 310 ppm of phosphorus is contained, thereby being useful for lubricating or operating an automatic transmission comprising a transmission clutch using a slip lock-up torque converter and a paper based clutch material and a planetary gear system, especially six-speed automatic transmission.

摘要翻译： 本发明涉及一种自动变速器润滑油组合物，特别涉及包含润滑粘度的油，无灰分散剂，抗氧化剂，磷系抗磨剂和摩擦改性剂的自动变速器润滑油组合物 其中含有大于310ppm的磷，从而可用于润滑或操作包括使用滑动锁定力矩转换器和纸基离合器材料的变速离合器和行星齿轮系统的自动变速器，特别是六速自动变速器 传输。

公开(公告)号：US07499340B2

公开(公告)日：2009-03-03

申请号：US12007336

申请日：2008-01-09

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C7/10

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.

摘要翻译： 形成在半导体芯片上的半导体存储器件包括第一存储器阵列，多个第二存储器阵列，第一电压发生器和第一焊盘。 半导体芯片被分为第一，第二和第三矩形区域，第三矩形区域布置在第一矩形区域和第二矩形区域之间。 第一存储器阵列形成在第一矩形区域中。 第二存储器阵列形成在第二矩形区域中。 电压发生器和第一接合焊盘布置在第三矩形区域中。 第一接合焊盘布置在第一矩形区域和电压发生器之间，并且在电压发生器和第二存储器阵列之间没有布置接合焊盘。

公开(公告)号：US20080205111A1

公开(公告)日：2008-08-28

申请号：US12007336

申请日：2008-01-09

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C5/02 ,  G11C7/00

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.

摘要翻译： 形成在半导体芯片上的半导体存储器件包括第一存储器阵列，多个第二存储器阵列，第一电压发生器和第一焊盘。 半导体芯片被分为第一，第二和第三矩形区域，第三矩形区域布置在第一矩形区域和第二矩形区域之间。 第一存储器阵列形成在第一矩形区域中。 第二存储器阵列形成在第二矩形区域中。 电压发生器和第一接合焊盘布置在第三矩形区域中。 第一接合焊盘布置在第一矩形区域和电压发生器之间，并且在电压发生器和第二存储器阵列之间没有布置接合焊盘。

公开(公告)号：US06709870B2

公开(公告)日：2004-03-23

申请号：US09739327

申请日：2000-12-19

申请人： Motoo Suzuki ,  Takashi Ishikawa ,  Hirokazu Saito

发明人： Motoo Suzuki ,  Takashi Ishikawa ,  Hirokazu Saito

IPC分类号： B01L302

CPC分类号： G01N1/14 ,  G01N35/1004 ,  Y10T436/114998 ,  Y10T436/2575

摘要： A sample tube of a sampling valve is moved up and down by a cylinder. When the sample tube is moved downward, a sample inlet opposes a stored sample, and the sample can be extracted. When the sample tube is moved upward, the sample inlet opposes a cleaning liquid path. Thus, cleaning liquid is fed into the cleaning liquid path from a cleaning liquid supply port of a cleaning pipe. The cleaning liquid flows within the sample tube from the sample inlet, and flows out from a sample discharge port. Thus, an entire interior of the sample tube can be cleaned. In a sample extracting device using the sampling valve, a state in which no air or impurities are mixed in the sample can always be maintained, such that stable extraction can be carried out.

摘要翻译： 采样阀的样品管由气缸上下移动。 当样品管向下移动时，样品入口与存储的样品相对，并且可以提取样品。 当样品管向上移动时，样品入口与清洁液体路径相反。 因此，清洗液从清洗管的清洗液供给口送入清洗液路径。 清洗液从样品入口在样品管内流动，从样品排出口流出。 因此，可以清洁样品管的整个内部。 在使用采样阀的样品提取装置中，可以始终保持在样品中不混合空气或杂质的状态，从而可以进行稳定的提取。

公开(公告)号：US06335884B1

公开(公告)日：2002-01-01

申请号：US09714268

申请日：2000-11-17

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C1300

CPC分类号： H01L24/06 ,  G11C5/025 ,  G11C5/04 ,  G11C5/063 ,  G11C11/406 ,  G11C29/06 ,  G11C29/12005 ,  G11C29/12015 ,  G11C29/24 ,  G11C29/34 ,  G11C29/50 ,  G11C29/50012 ,  G11C29/70 ,  G11C29/80 ,  G11C29/804 ,  G11C29/832 ,  G11C29/844 ,  G11C2029/2602 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L27/0207 ,  H01L27/105 ,  H01L27/10897 ,  H01L27/11898 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.

摘要翻译： 这里公开了一种半导体存储器件，其中外围电路布置在由纵向中心部分和横向中心部分组成的半导体芯片的交叉区域中，并且其中存储器阵列布置在由 交叉区域。 由于外围电路布置在芯片的中心部分的这种结构，最长的信号传输路径可以缩短到芯片尺寸的大约一半，以加快DRAM的大容量。

公开(公告)号：US06320135B1

公开(公告)日：2001-11-20

申请号：US09493936

申请日：2000-01-27

申请人： Hirokazu Saito

发明人： Hirokazu Saito

IPC分类号： H05K100

CPC分类号： H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/0097 ,  H05K2201/09781 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1545 ,  H01L2924/00

摘要： Predetermined wiring of copper is formed on the upper surface of an elongated base film in a wiring forming area as a width-directional central portion of the base film. Further, band-shaped first reinforcing layers of copper are formed on width-directional opposite portions of the upper surface of the base film. As a result, even if the base film has a relatively thin thickness, portions of the base film near sprocket holes can be made to have a substantially desired strength. To keep the first reinforcing layers out of contact with the pins of a transfer pin roller, opening slightly larger than the sprocket holes are formed in the first reinforcing layers.

摘要翻译： 在作为基膜的宽度方向中心部的布线形成区域中的细长基膜的上表面上形成铜的预定布线。 此外，在基膜的上表面的宽度方向的相对部分上形成有铜带状的第一加强层。 结果，即使基膜具有相对较薄的厚度，可以使在链轮孔附近的基膜的部分具有基本上期望的强度。 为了保持第一加强层与传送针辊的销不接触，在第一加强层中形成比链轮孔略大的开口。

公开(公告)号：US5847783A

公开(公告)日：1998-12-08

申请号：US959757

申请日：1997-10-29

申请人： Masami Hiramoto ,  Kazuhiro Sugiyama ,  Hirokazu Saito ,  Hideki Nakajima ,  Akira Igarashi ,  Masaaki Shibamoto ,  Katsunobu Sakaishi

发明人： Masami Hiramoto ,  Kazuhiro Sugiyama ,  Hirokazu Saito ,  Hideki Nakajima ,  Akira Igarashi ,  Masaaki Shibamoto ,  Katsunobu Sakaishi

IPC分类号： G02F1/13 ,  G02F1/13357 ,  G02F1/1335

CPC分类号： G02F1/13452 ,  G02F1/133604 ,  G02F1/133621 ,  G02F2201/503 ,  G02F2202/28

摘要： An electroluminescent panel is provided in a region of the rear surface side of the display panel, which corresponds to a display region, and the drive circuit for the display panel is located in the other region than the display region, on the surface side of the display panel. Further, the inverter serving as a drive circuit for the electroluminescent panel is provided in the region of the rear surface side of the display panel, other than the display region. With this structure, the downsizing and thinning of the display device are promoted.

摘要翻译： 在显示面板的后表面侧的区域中设置电致发光面板，其对应于显示区域，并且用于显示面板的驱动电路位于比显示区域的另一区域中，在 显示面板。 此外，除了显示区域之外，用作电致发光面板的驱动电路的反相器设置在显示面板的后表面侧的区域中。 通过这种结构，可以促进显示装置的小型化和细化。

公开(公告)号：US5579256A

公开(公告)日：1996-11-26

申请号：US455411

申请日：1995-05-31

申请人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

发明人： Kazuhiko Kajigaya ,  Kazuyuki Miyazawa ,  Manabu Tsunozaki ,  Kazuyoshi Oshima ,  Takashi Yamazaki ,  Yuji Sakai ,  Jiro Sawada ,  Yasunori Yamaguchi ,  Tetsurou Matsumoto ,  Shinji Udo ,  Hiroshi Yoshioka ,  Hirokazu Saito ,  Mitsuhiro Takano ,  Makoto Morino ,  Sinichi Miyatake ,  Eiji Miyamoto ,  Yasuhiro Kasama ,  Akira Endo ,  Ryoichi Hori ,  Jun Etoh ,  Masashi Horiguchi ,  Shinichi Ikenaga ,  Atsushi Kumata

IPC分类号： G11C5/00 ,  G11C5/02 ,  G11C11/406 ,  H01L23/485

CPC分类号： H01L24/05 ,  G11C11/406 ,  G11C5/025 ,  H01L24/06 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/73215 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01043 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01054 ,  H01L2924/01055 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10S257/908

摘要： Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.