公开(公告)号：US11672083B2

公开(公告)日：2023-06-06

申请号：US17497815

申请日：2021-10-08

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Yang Li ,  Yan-Lu Li

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46 ,  H01L21/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/14 ,  H01L23/24 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H01L23/552 ,  H05K3/32 ,  H05K3/00

CPC分类号： H05K3/3452 ,  H05K3/0029 ,  H05K3/022 ,  H05K3/321 ,  H05K2203/0228

摘要： A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

公开(公告)号：US11700698B2

公开(公告)日：2023-07-11

申请号：US17686743

申请日：2022-03-04

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Hao-Yi Wei ,  Yan-Lu Li

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/28

CPC分类号： H05K3/4644 ,  H05K1/0218 ,  H05K3/28 ,  H05K2201/0715

摘要： A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

公开(公告)号：US11191168B2

公开(公告)日：2021-11-30

申请号：US17030521

申请日：2020-09-24

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Yang Li ,  Yan-Lu Li

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/06 ,  H05K3/10 ,  H05K3/36 ,  H05K3/46 ,  H01L21/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/14 ,  H01L23/24 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L23/498 ,  H05K3/34 ,  H05K3/32 ,  H05K3/00 ,  H05K3/02

摘要： A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

公开(公告)号：US10681824B1

公开(公告)日：2020-06-09

申请号：US16705398

申请日：2019-12-06

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Jian-Yi Hao ,  Yan-Lu Li ,  Xian-Qin Hu ,  Ming-Hua Du

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/28 ,  H05K3/12

摘要： A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.

公开(公告)号：US10667402B2

公开(公告)日：2020-05-26

申请号：US16145240

申请日：2018-09-28

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Yan-Lu Li ,  Jun-Hua Wang

IPC分类号： H05K3/32 ,  H05K1/18 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/24

摘要： An embedded circuit board includes a circuit board including a flexible base layer, a first conductive circuit layer, a second conductive circuit layer, two adhesive layers, and two copper plates. The first conductive circuit layer and the second conductive circuit layer are formed on corresponding opposite base layer surfaces of the base layer and electrically interconnected together. A photosensitive layer is located on one surface of the circuit board. A component is located within a mounting slot formed within the photosensitive layer. Each copper plate includes a flexible insulating film and forms a third conductive circuit layer. The flexible insulating film is adhered to a corresponding one of the circuit board or the photosensitive material layer by a corresponding one of the adhesive layers.

公开(公告)号：US10285260B2

公开(公告)日：2019-05-07

申请号：US14927888

申请日：2015-10-30

申请人： Avary Holding (Shenzhen) Co., Limited. ,  HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  GARUDA TECHNOLOGY CO., LTD.

发明人： Xian-Qin Hu ,  Yan-Lu Li ,  Li-Bo Zhang

IPC分类号： H05K3/42 ,  H05K1/02 ,  H05K3/46 ,  H05K1/11 ,  H05K3/40

摘要： The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.

公开(公告)号：US12120812B2

公开(公告)日：2024-10-15

申请号：US17564941

申请日：2021-12-29

申请人： HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd. ,  Avary Holding (Shenzhen) Co., Ltd. ,  Garuda Technology Co., Ltd.

发明人： Hao-Yi Wei ,  Childe Zhu ,  Yan-Lu Li

IPC分类号： H01P3/00 ,  H01P3/02 ,  H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0242 ,  H01P3/003 ,  H01P3/026 ,  H05K1/0215 ,  H05K3/10

摘要： A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

公开(公告)号：US09807877B1

公开(公告)日：2017-10-31

申请号：US15285593

申请日：2016-10-05

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

发明人： Li-Kun Liu ,  Yan-Lu Li

IPC分类号： H05K3/20 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC分类号： H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/427 ,  H05K3/4611 ,  H05K3/4655 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/09218 ,  H05K2203/063 ,  Y10T29/49128

摘要： A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.

公开(公告)号：US09622340B2

公开(公告)日：2017-04-11

申请号：US14858953

申请日：2015-09-18

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

发明人： Xian-Qin Hu ,  Yan-Lu Li ,  Wen-Hsin Yu ,  Ming-Jaan Ho

IPC分类号： H05K3/28 ,  H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0228 ,  H05K1/0221 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/10 ,  H05K3/243 ,  H05K3/28 ,  H05K3/281 ,  H05K2201/0355 ,  H05K2201/0715

摘要： A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.