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11.发明授权Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals 有权表面安装麦克风封装，麦克风布置，移动电话和用于记录麦克风信号的方法公开(公告)号：US09332330B2
公开(公告)日：2016-05-03
申请号：US13947930
申请日：2013-07-22
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/04 , B81B2201/0257 , H04R2201/00 , H04R2499/11
Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风包装的相对侧上。
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12.发明申请Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals 有权表面安装麦克风包，麦克风布置，手机和录音麦克风信号的方法公开(公告)号：US20150024807A1
公开(公告)日：2015-01-22
申请号：US13947930
申请日：2013-07-22
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/04 , B81B2201/0257 , H04R2201/00 , H04R2499/11
Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。
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13.发明申请Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals 审中-公开表面安装麦克风包，麦克风布置，手机和录音麦克风信号的方法公开(公告)号：US20150023523A1
公开(公告)日：2015-01-22
申请号：US14065067
申请日：2013-10-28
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/083 , B81B7/0061 , B81B2201/0257 , H01L2224/95 , H01L2924/14 , H01L2924/1461 , H01L2924/15 , H01L2924/181 , H01L2924/19106 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003 , H04R2410/05 , H04R2499/11
Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
Abstract translation: 表面可安装麦克风包包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。
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公开(公告)号：US10451543B2
公开(公告)日：2019-10-22
申请号：US15349438
申请日：2016-11-11
Applicant: Infineon Technologies AG
Inventor： Thomas Mueller , Horst Theuss , Klaus Elian , Rainer Markus Schaller , Stefan Kolb
Abstract: A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.
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公开(公告)号：US20170212036A1
公开(公告)日：2017-07-27
申请号：US15349438
申请日：2016-11-11
Applicant: Infineon Technologies AG
Inventor： Thomas Mueller , Horst Theuss , Klaus Elian , Rainer Markus Schaller , Stefan Kolb
IPC: G01N21/17
CPC classification number: G01N21/1702 , A61B5/0095 , A61B2562/0204 , G01N29/032 , G01N29/222 , G01N29/2418 , G01N29/48 , G01N33/0009 , G01N2021/1704 , G01N2291/021 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
Abstract: A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.
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Patent Agency Ranking
公开(公告)号：US10107867B2
公开(公告)日：2018-10-23
申请号：US14631443
申请日：2015-02-25
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Jochen Dangelmaier , Franz Michael Darrer , Thomas Mueller , Mathias Vaupel , Manfred Fries , Guenther Ruhl , Horst Theuss , Matthias Rose , Stephan Auer , Tue Fatt David Wee , Sie Boo Chiang
IPC: H01M10/48 , G01R31/36 , H01M10/42 , H04Q9/00 , H01M10/0525
Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.
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公开(公告)号：US20180257442A1
公开(公告)日：2018-09-13
申请号：US15911305
申请日：2018-03-05
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Thomas Mueller
IPC: B60C23/04
CPC classification number: B60C23/0486 , B60C23/0493 , B60C23/064 , G01L17/00
Abstract: Tire sensor devices, tires equipped with such devices and corresponding methods are disclosed, where a tire sensor chip is provided on a flexible sheet material.
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公开(公告)号：US09986354B2
公开(公告)日：2018-05-29
申请号：US13927865
申请日：2013-06-26
Applicant: Infineon Technologies AG
Inventor： Thomas Mueller , Horst Theuss , Stefan Uwe Schindler , Dominik Kohl , Jochen Dangelmaier
IPC: H01L29/84 , H01L21/78 , H04R25/00 , B81C1/00 , H01L23/495 , H04R31/00 , H04R19/00 , H04R19/04 , H04R1/08
CPC classification number: H04R31/00 , B81B2201/0257 , B81B2207/092 , B81B2207/096 , B81C1/0023 , B81C1/00301 , H01L2224/05554 , H01L2224/48091 , H01L2224/48137 , H01L2224/8592 , H01L2924/10158 , H01L2924/16195 , H04R1/086 , H04R19/005 , H04R19/04 , Y10T29/49121 , H01L2924/00014
Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.
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19.发明授权公开(公告)号：US09576872B2
公开(公告)日：2017-02-21
申请号：US14132296
申请日：2013-12-18
Applicant: Infineon Technologies AG
Inventor： Thomas Mueller , Horst Theuss
CPC classification number: H01L23/3114 , H01L21/561 , H01L21/568 , H01L23/3157 , H01L2224/11 , H01L2924/0002 , H01L2924/00
Abstract: A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor chips, wherein depositing the first material layer includes a vapor deposition, and wherein the first material layer includes at least one of an organic material and a polymer.
Abstract translation: 一种方法包括在第一载体上布置多个半导体芯片并在多个半导体芯片的表面上沉积第一材料层，其中沉积第一材料层包括气相沉积，并且其中第一材料层包括有机材料 和聚合物。
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20.发明申请公开(公告)号：US20160241953A1
公开(公告)日：2016-08-18
申请号：US15043831
申请日：2016-02-15
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Horst Theuss , Thomas Mueller
CPC classification number: H04R1/083 , B81B7/0061 , B81B2201/0257 , H01L2224/95 , H01L2924/14 , H01L2924/1461 , H01L2924/15 , H01L2924/181 , H01L2924/19106 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003 , H04R2410/05 , H04R2499/11
Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
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