公开(公告)号：US20170345692A1

公开(公告)日：2017-11-30

申请号：US15604609

申请日：2017-05-24

Applicant: Innolux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Bo-Feng Chen ,  Hui-Chieh Wang

IPC: H01L21/67 ,  H05K3/00 ,  H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  H05K3/40 ,  H05K1/11

CPC classification number: H01L21/67144 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/95 ,  H01L2933/0066 ,  H05K1/115 ,  H05K3/0026 ,  H05K3/4038 ,  H05K13/041 ,  H05K13/082

Abstract: The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface and a lower surface opposite to each other and a plurality of conductive via structures, wherein the conductive via structures are electrically connected to the control element. The pickup structure includes a plurality of pickup heads used for picking up or placing a plurality of light emitting diodes respectively. The pickup structure is disposed on the lower surface of the substrate or disposed in the substrate and extended outside the substrate, and the substrate is disposed between the control element and the pickup structure, wherein the pickup heads are electrically connected to the conductive via structures.

公开(公告)号：US09312287B2

公开(公告)日：2016-04-12

申请号：US14625429

申请日：2015-02-18

Applicant: InnoLux Corporation

Inventor： Kuan-Feng Lee ,  Hui-Chieh Wang

IPC: H01L29/78 ,  H01L27/12 ,  H01L29/786 ,  H01L27/32 ,  G02F1/1368 ,  G02F1/1362 ,  G02F1/1333

CPC classification number: H01L27/1248 ,  G02F1/133345 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  H01L27/1225 ,  H01L27/124 ,  H01L27/3248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3276 ,  H01L29/78618 ,  H01L29/7869 ,  H01L51/524 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2251/558

Abstract: A display panel includes a TFT substrate, an opposite substrate and a display layer. A TFT of the TFT substrate has a drain. A first insulating layer has a first sub-layer and a second sub-layer disposed on the drain sequentially. The first sub-layer has a first opening with a first width. The second sub-layer has a second opening with a second width on the first opening. The first and second openings form a first via, and the second width is greater than the first width. A passivation layer is disposed on the first insulating layer. A second insulating layer is disposed on the passivation layer. A pixel electrode layer is disposed on the second insulating layer and disposed in the first via to connect the drain. The display layer is disposed between the TFT substrate and the opposite substrate.

Abstract translation: 显示面板包括TFT基板，相对基板和显示层。 TFT基板的TFT具有漏极。 第一绝缘层具有顺序地设置在漏极上的第一子层和第二子层。 第一子层具有第一宽度的第一开口。 第二子层具有在第一开口上具有第二宽度的第二开口。 第一和第二开口形成第一通孔，第二宽度大于第一宽度。 钝化层设置在第一绝缘层上。 第二绝缘层设置在钝化层上。 像素电极层设置在第二绝缘层上并且设置在第一通孔中以连接漏极。 显示层设置在TFT基板和相对基板之间。

公开(公告)号：US11978678B2

公开(公告)日：2024-05-07

申请号：US17817715

申请日：2022-08-05

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Wei-Cheng Chu ,  Chun-Hsien Lin ,  Chandra Lius ,  Ting-Kai Hung ,  Kuan-Feng Lee ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Hui-Chieh Wang

IPC: G09G3/32 ,  B65G43/08 ,  G01R31/26 ,  H01L21/288 ,  H01L21/66 ,  H01L21/67 ,  H01L25/16 ,  H01L27/12 ,  H01L33/00 ,  H01L33/38 ,  H01L33/50 ,  H01L33/62 ,  H01L25/075

CPC classification number: H01L22/20 ,  B65G43/08 ,  G01R31/26 ,  H01L21/288 ,  H01L21/67144 ,  H01L25/167 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1255 ,  H01L27/1259 ,  H01L27/1262 ,  H01L33/0093 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  G09G3/32 ,  G09G2300/0426 ,  H01L22/14 ,  H01L25/0753 ,  H01L33/50 ,  H01L2933/0066

Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.

公开(公告)号：US11973067B2

公开(公告)日：2024-04-30

申请号：US17410445

申请日：2021-08-24

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng ,  Hui-Chieh Wang ,  Shun-Yuan Hu

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/00 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process:




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公开(公告)号：US11616166B2

公开(公告)日：2023-03-28

申请号：US17103971

申请日：2020-11-25

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

公开(公告)号：US11616165B2

公开(公告)日：2023-03-28

申请号：US16808303

申请日：2020-03-03

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

Abstract: The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

公开(公告)号：US11437288B2

公开(公告)日：2022-09-06

申请号：US17228911

申请日：2021-04-13

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Wei-Cheng Chu ,  Chun-Hsien Lin ,  Chandra Lius ,  Ting-Kai Hung ,  Kuan-Feng Lee ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Hui-Chieh Wang

IPC: H01L33/62 ,  H01L21/66 ,  H01L25/16 ,  H01L27/12 ,  H01L33/38 ,  H01L21/288 ,  H01L21/67 ,  B65G43/08 ,  G01R31/26 ,  H01L33/00 ,  G09G3/32 ,  H01L25/075 ,  H01L33/50

Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate, and includes a first electrode and a second electrode. The transistor is disposed on the substrate and electrically connected to the light-emitting element. The transistor includes a gate electrode and a semiconductor layer. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The first electrode and the second electrode of the light-emitting element do not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.

公开(公告)号：US10446752B2

公开(公告)日：2019-10-15

申请号：US15662522

申请日：2017-07-28

Applicant: InnoLux Corporation

Inventor： Chun-Hsien Lin ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Tsau-Hua Hsieh ,  Tung-Kai Liu ,  Jui-Feng Ko ,  Hui-Chieh Wang

IPC: H01L51/00 ,  H01L27/28 ,  H01L27/32 ,  H01L21/48

Abstract: A light-emitting diode display device includes a light-emitting diode and a substrate. The light-emitting diode includes a central axis, and the substrate includes a first connecting portion and a second connecting portion. The central axis is extended through the first connecting portion. The second connecting portion is disposed outside of the first connecting portion and is spaced apart from the first connecting portion by a distance which is greater than zero, and the first connecting portion and the second connecting portion are respectively electrically connected to the light-emitting diode.

公开(公告)号：US11955579B2

公开(公告)日：2024-04-09

申请号：US17725741

申请日：2022-04-21

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L33/0093 ,  H01L33/0095 ,  H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0075 ,  H01L33/32 ,  H01L2933/0066

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

公开(公告)号：US20230215970A1

公开(公告)日：2023-07-06

申请号：US18116259

申请日：2023-03-01

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L21/68714 ,  H01L25/0753 ,  H01L2933/0016

Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.